IP Library › Granted Patent US 11,258,165
Granted Patent B2
US 11,258,165 · App. 16/236,726 · Granted Feb 22, 2022

Asymmetric antenna structure

Inventors: Hong Bok We (San Diego, CA); Chin-Kwan Kim (San Diego, CA); Jaehyun Yeon (San Diego, CA); Suhyung Hwang (Rancho Mission Viejo, CA)
Assignee: QUALCOMM Incorporated
H01Q1/246H01Q1/085H01Q9/12H01Q5/364
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Quick Facts
Patent No.
US 11,258,165
App. No.
16/236,726
Granted
Feb 22, 2022
Kind
B2
Abstract

Certain aspects of the present disclosure provide an asymmetric antenna structure. An example antenna device generally includes a first antenna element, a second antenna element, and a flexible coupling element asymmetrically positioned between surfaces of the first and second antenna elements and electrically coupling the first antenna element to the second antenna element.

Claims (13)

1. A method of fabricating an antenna device, comprising:

forming a first antenna element and a second antenna element; and

forming a flexible coupling element asymmetrically positioned between opposing surfaces of the first and second antenna elements and electrically coupling the first antenna element to the second antenna element, wherein forming the first and second antenna elements and the flexible coupling element comprises:

forming at least one flexible coupling layer disposed above a substrate layer;

forming a conductive layer disposed above the at least one flexible coupling layer; and

after forming the conductive layer disposed above the at least one flexible coupling layer, cutting a first cavity in at least the conductive layer to define a first antenna element region on one side of the first cavity and a second antenna element region on another side of the first cavity.

2. The method of claim 1 , wherein forming the first and second antenna elements and the flexible coupling element further comprises cutting a second cavity in at least the substrate layer between the first antenna element region and the second antenna element region, such that the first cavity and second cavity have different depths and the at least one flexible coupling layer is asymmetrically positioned between surfaces of the first and second antenna element regions, wherein cutting the first cavity comprises cutting the first cavity to form a first surface above the at least one flexible coupling layer and upper lateral surfaces of the first and second antenna regions.

3. The method of claim 2 , wherein cutting the second cavity comprises cutting the second cavity to form a second surface below the at least one flexible coupling layer and lower lateral surfaces of the first and second antenna regions.

4. The method of claim 2 , wherein the at least one flexible coupling layer is electrically coupled to the first antenna element region and the second antenna element region.

5. The method of claim 2 , wherein the substrate layer comprises a rigid core, wherein one or more first laminate layers are disposed above the rigid core, and wherein one or more second laminate layers are disposed below the rigid core.

6. The method of claim 5 , wherein cutting the second cavity comprises cutting the second cavity in the one or more first laminate layers and the one or more second laminate layers.

7. The method of claim 5 , further comprising forming an additional conductive layer disposed below the one or more second laminate layers, wherein cutting the second cavity comprises cutting the second cavity in the additional conductive layer.

8. The method of claim 1 , wherein the at least one flexible coupling layer comprises at least one flexible layer and at least one electrically conductive layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 14, 2019
From: WE, HONG BOK; KIM, CHIN-KWAN; YEON, JAEHYUN; HWANG, SUHYUNG
To: QUALCOMM INCORPORATED
Reel/Frame 048603/0079 →
Continuity (1)
Related Publication 20200212545A1 · Jul 2, 2020