IP Library Granted Patent US 11,263,378
Granted Patent B2
US 11,263,378 · App. 16/744,311 · Granted Mar 1, 2022

Multi-row standard cell design method in hybrid row height system

Inventors: Hung-Chih Ou (Kaohsiung, TW); Wen-Hao Chen (Hsinchu, TW); Chun-Yao Ku (Taipei, TW)
Assignee: Taiwan Semiconductor Manufacturing Company Limited
G06F30/392
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Quick Facts
Patent No.
US 11,263,378
App. No.
16/744,311
Granted
Mar 1, 2022
Kind
B2
Abstract

A discrete multi-row height cell in a hybrid row-height system with a plurality of rows of at least two different row-heights is disclosed. The discrete multi-row height cell includes: a first sub-cell deployed on a first row with a first row-height; a second sub-cell deployed on a second row with a second row-height, wherein the second row and the first row is separated by a third row with a third row-height, wherein the third row-height is different from the first row-height, wherein the first sub-cell and the second sub-cell are electrically connected by at least a wire.

Claims (54)

1. An integrated circuit (IC) layout, the IC layout comprising:

a plurality of rows of at least two different row-heights;

a discrete multi-row cell deployed over the plurality of rows, the multi-row cell comprising:

a first sub-cell deployed on at least a first row of cells with a first row-height;

a second sub-cell deployed on at least a second row of cells with a second row-height, and

empty spaces surrounding the first and second sub-cells,

wherein the first row and the second row have different number of fins corresponding to at least two different row-heights,

wherein the empty spaces are used for filling in other cells of matching geometry,

wherein the multi-row cell comprises a sub-cell covering more than one row,

wherein the second row of cells and the first row of cells are separated by a third row of cells with a third row-height,

wherein the third row-height is different from the first row-height, and

wherein the first sub-cell and the second sub-cell are electrically connected by at least a wire in the empty spaces.

2. The IC layout of claim 1 , wherein the third row-height is different from the second row-height.

3. The IC layout of claim 1 , wherein the first row-height and the second row-height are the same.

4. The IC layout of claim 1 , wherein the first row-height and the second row-height are different.

5. The IC layout of claim 1 , wherein the third row-height is smaller than the first row-height.

6. The IC layout of claim 1 , wherein the third row-height is smaller than both the first row-height and the second row-height.

7. The IC layout of claim 1 , wherein the first sub-cell is of the same size as the second sub-cell.

8. The IC layout of claim 1 , wherein the first sub-cell is of a size different from the second sub-cell.

9. A method for IC layout design, the method comprising:

obtaining hybrid-row specifications with different row heights;

obtaining cell driving target specifications;

analyzing hybrid-row specifications with different row heights;

deriving discrete multi-row cell styles;

generating the discrete multi-row cell by splitting a cell into discrete sub-cells with matching geometry and target cell driving specifications;

conducting the discrete multi-row cell quality control to ensure the generated discrete multi-row cell match quality control targets; and

under a condition if the quality control fails, re-generating the discrete multi-row cell by splitting the cell into sub-cells with matching geometry and target cell driving specifications.

10. The method of claim 9 , further comprises:

under a condition if the quality control passes, generating a marker layer of empty spaces to potentially accommodate other cells in the empty space with matching geometry and performance specifications.

11. The method of claim 9 , further comprises:

completing the generation of discrete multi-row cell with matching specifications.

12. The method of claim 9 , wherein analyzing hybrid-row specifications further comprises:

decomposing a hybrid-row system to understand the specification of each row style.

13. The method of claim 12 , wherein analyzing hybrid-row specifications further comprises:

estimating an achievable driving strength of the discrete multi-row cell according to the hybrid-row specification and the cell driving target specifications.

14. The method of claim 9 , wherein deriving discrete multi-row cell styles further comprises:

generating available discrete multi-row styles and compositions.

15. The method of claim 9 , wherein conducting discrete multi-row cell quality control further comprises:

analyzing the generated discrete multi-row cell to ensure no design rule violation in the generated discrete multi-row cell and among other cells.

16. The method of claim 10 , wherein generating a marker layer of the empty spaces further comprises:

implementing the marker layer of the empty spaces to allow wire feed through.

17. The method of claim 10 , wherein generating a marker layer of the empty spaces further comprises:

implementing the marker layer of the empty spaces to allow other cell placement.

18. The method of claim 10 , wherein generating a marker layer on the empty spaces is implemented to achieve better area shrinking ratio and to reduce the impact of discrete multi-row cells.

19. An IC layout designed by a process, the process comprising:

obtaining hybrid-row specifications with different row heights;

obtaining cell driving target specifications;

analyzing the hybrid-row specifications with different row heights;

deriving discrete multi-row cell styles;

generating the discrete multi-row cell by splitting a cell into discrete sub-cells with matching geometry and target cell driving specifications;

conducting the discrete multi-row cell quality control to ensure the generated discrete multi-row cell match quality control targets; and

under a condition if the quality control fails, re-generating the discrete multi-row cell by splitting the cell into sub-cells with matching geometry and target cell driving specifications.

20. The IC layout of claim 19 , wherein the process further comprises:

under a condition if the quality control passes, generating a marker layer of empty spaces to potentially accommodate other cells in the empty space with matching geometry and performance specifications.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 3, 2020
From: OU, HUNG-CHIH; CHEN, WEN-HAO; KU, CHUN-YAO
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
Reel/Frame 051987/0056 →
Continuity (1)
Related Publication 20210224455A1 · Jul 22, 2021
Cited By (1)
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