Electronic component
A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (μm) and a maximum thickness of the second region is T2 (μm), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T 2/ T 1≥0.11. In a cross-section along a thickness direction of the first region, a total area of voids in the first region is in a range of 5.0 to 36.0% of an area of the first region. In a cross-section along a thickness direction of the second region, a total area of voids in the second region is in the range of 5.0 to 36.0% of an area of the second region.
1. An electronic component comprising:
an element body including a side surface and an end surface adjacent to each other; and
an external electrode disposed on the side surface and the end surface, wherein
the external electrode includes a conductive resin layer that is disposed on the side surface and the end surface and includes a plurality of voids, and a plating layer covering the conductive resin layer,
the conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface,
a maximum thickness T1 of the first region in μm and a maximum thickness T2 of the second region in μm satisfy a relation of
T 2/ T 1≥0.11,
in a cross-section along a thickness direction of the first region, a total area of the voids in the first region is in a range of 5.0 to 36.0% of an area of the first region, and
in a cross-section along a thickness direction of the second region, a total area of the voids in the second region is in the range of 5.0 to 36.0% of an area of the second region.
2. The electronic component according to claim 1 , wherein
the maximum thickness T1 and the maximum thickness T2 satisfy a relation of
T 2/ T 1≤0.48.
3. The electronic component according to claim 1 , wherein
a minimum thickness T3 of the third region in μm and the maximum thickness T1 satisfy a relation of
T 3/ T 1≥0.08.
4. The electronic component according to claim 1 , wherein
the maximum thickness T1 and the minimum thickness T3 satisfy a relation of
T 3/ T 1≤0.37.
5. The electronic component according to claim 1 ,
wherein, in a cross-section along a thickness direction of the third region, a total area of the voids in the third region is in a range of 3.0 to 11.0% of an area of the third region.
6. The electronic component according to claim 1 , wherein,
in a cross-section orthogonal to the side surface and the end surface, a surface of the second region curves in a convex shape in a direction away from the side surface.
7. The electronic component according to claim 1 , wherein
the external electrode further includes a sintered metal layer, the sintered metal layer being disposed on the side surface and the end surface and being covered with the conductive resin layer, and
with a plane including the end surface as a reference plane, a length from an end edge of the sintered metal layer to an end edge of the second region in a direction orthogonal to the end surface is larger than a length from the reference plane to the end edge of the sintered metal layer in the direction orthogonal to the end surface.
8. The electronic component according to claim 1 , wherein,
when viewed from a direction orthogonal to the side surface, an end edge of the second region curves.
9. The electronic component according to claim 1 , wherein,
the side surface is arranged to constitute a mounting surface.