Multi-row QFN semiconductor package
A semiconductor package includes at least one die attach pad of a leadframe, at least one semiconductor die mounted on the at least one die attach pad; and a plurality of lead terminals disposed around the at least one die attach pad and electrically connected to respective input/output (I/O) pads on the at least one semiconductor die through a plurality of bond wires. The plurality of lead terminals comprises first lead terminals, second lead terminals, and third lead terminals, which are arranged in triple row configuration along at least one side of the semiconductor package. Each of the first lead terminals, second lead terminals, and third lead terminals has an exposed base metal on a cut end thereof.
1. A semiconductor package, comprising:
at least one die attach pad of a leadframe;
at least one semiconductor die mounted on the at least one die attach pad; and
a plurality of lead terminals disposed around the at least one die attach pad and electrically connected to respective input/output (I/O) pads on the at least one semiconductor die through a plurality of bond wires, wherein the plurality of lead terminals comprises first lead terminals, second lead terminals, and third lead terminals, which are arranged in triple row configuration along at least one side of the semiconductor package, and wherein each of the first lead terminals, second lead terminals, and third lead terminals has an exposed base metal on a cut end thereof, wherein the exposed base metal has a bottom surface exposed from a bottom of the semiconductor package and has a thickness that is equal to that of wire-bonded pad portions of each of the first lead terminals, the second lead terminals, and the third lead terminals.
2. The semiconductor package according to claim 1 , wherein the cut end is vertically flush with a sidewall surface of the semiconductor package.
3. The semiconductor package according to claim 1 further comprising:
a molding compound encapsulating the at least one semiconductor die, the at least one die attach pad, the plurality of bond wires, and the plurality of lead terminals.
4. The semiconductor package according to claim 3 , wherein the cut end is vertically flush with a sidewall surface of the molding compound.
5. The semiconductor package according to claim 1 , wherein the first lead terminals, second lead terminals, and third lead terminals are arranged in a staggered manner.
6. The semiconductor package according to claim 1 , wherein the third lead terminals are disposed in an inner row that is proximate to the I/O pads on the at least one semiconductor die, the second lead terminals are disposed in a middle row, and the first lead terminals are disposed in an outer row.
7. The semiconductor package according to claim 6 , wherein each of the third lead terminals has a pad portion for wire-bonding and a connection tie bar, wherein the cut end is disposed on an end of the connection tie-bar.
8. The semiconductor package according to claim 7 , wherein the connection tie-bar extends between one of the second lead terminals and one of the first lead terminals.
9. The semiconductor package according to claim 7 , wherein the connection tie-bar is linear shaped.
10. The semiconductor package according to claim 7 , wherein the connection tie-bar has a curved shape or a serpentine shape.
11. The semiconductor package according to claim 7 , wherein each of the second lead terminals has a pad portion for wire-bonding and a connection tie bar.
12. The semiconductor package according to claim 11 , wherein the pad portion of each of the third lead terminals has a surface area that is greater than that of the pad portion of each of the second lead terminals.
13. The semiconductor package according to claim 1 further comprising:
a ground ring surrounding the die attach pad.
14. The semiconductor package according to claim 13 , wherein the ground ring is half-etched and is not exposed from a bottom of the semiconductor package.
15. An electronic system, comprising:
a semiconductor package, comprising: a die attach pad of a leadframe; a semiconductor die mounted on the die attach pad; and a plurality of lead terminals disposed around the die attach pad and electrically connected to respective input/output (I/O) pads on the at least one semiconductor die through a plurality of bond wires, wherein the plurality of lead terminals comprises first lead terminals, second lead terminals, and third lead terminals, which are arranged in triple row configuration along at least one side of the semiconductor package, and wherein each of the first lead terminals, second lead terminals, and third lead terminals has an exposed base metal on a cut end thereof, wherein the exposed base metal has a bottom surface exposed from a bottom of the semiconductor package and has a thickness that is equal to that of wire-bonded pad portions of each of the first lead terminals, the second lead terminals, and the third lead terminals; and
a printed circuit board, wherein the semiconductor package is mounted on the printed circuit board.
16. The electronic system according to claim 15 , wherein the printed circuit board comprises a pad corresponding to the die attach pad and at least one finger pad corresponding to at least one of the plurality of the lead terminals.
17. The electronic system according to claim 16 , wherein the die attach pad is adhered to the pad by using an adhesive layer.
18. The electronic system according to claim 16 , wherein the at least one of the plurality of lead terminals is bonded to the at least one finger pad through solder paste, and wherein wicking of the solder paste up to the base metal on the cut end forms a solder fillet.