Anti-electromagnetic interference radio frequency module and implementation method therefor
An anti-electromagnetic interference radio frequency module and an implementation method therefor. The anti-electromagnetic interference radio frequency module comprises a radio frequency module body, the inside of the radio frequency module body is provided with an electrical connection area ( 1 ) and a grounding area ( 2 ), a metal thin film structure ( 4 ) is attached to an upper surface and side surfaces of the radio frequency module body, and the metal thin film structure is connected to the grounding area, forming an anti-electromagnetic interference shielding layer structure which is integrated with the radio frequency module body. The radio frequency module achieves an anti-electromagnetic interference effect by means of the anti-electromagnetic interference shielding layer structure, so that electromagnetic interference generated around the radio frequency module is effectively isolated, thereby improving the performance of the radio frequency module.
1. An implementation method of an anti-electromagnetic interference radio frequency module, comprising the following steps of:
Step S 1 , preparing a base plate, and dividing different areas on the base plate;
Step S 2 , arranging each composition part of a radio frequency module in an electrical connection area of the base plate;
Step S 3 , electrically connecting a corresponding chip to the base plate and corresponding routing areas in a grounding area and a cutting route area by using conductive materials;
Step S 4 , filling and covering a molding compound to each space corner of a radio frequency module body so that each composition part of the radio frequency module and the conductive materials are covered in the molding compound;
Step S 5 , cutting independent encapsulation finished products from an integral sealing structure by a finished product cutting process according to a finished product dimension of a single radio frequency module; and
Step S 6 , converting a radio frequency module body onto a film plating tool for film plating so as to form the anti-electromagnetic interference radio frequency module.
2. The implementation method of the anti-electromagnetic interference radio frequency module according to claim 1 , wherein
in Step S 1 , at least one grounding routing area is arranged on the base plate, the routing area is respectively grounded, the cutting route area is arranged at the periphery of the base plate, and routing areas are arranged on the cutting route area positioned at any one side or a plurality of sides of the base plate.
3. The implementation method of the anti-electromagnetic interference radio frequency module according to claim 1 , wherein
in Step S 2 , when a component is contained in the radio frequency module, the component is attached onto the base plate by a surface mounting process so that the component is respectively and electrically connected with the base plate.
4. The implementation method of the anti-electromagnetic interference radio frequency module according to claim 1 , wherein
in Step S 2 , when a functional chip is contained in the radio frequency module, the functional chip is attached onto the base plate by a mounting process, or the functional chip is directly and electrically connected with the base plate by a reverse mounting process.
5. The implementation method of the anti-electromagnetic interference radio frequency module according to claim 1 , wherein
in Step S 3 , when a functional chip is attached onto the base plate by a mounting process, the functional chip is electrically connected with the base plate by a lead wire bonding process through a second conductive material, and a grounding routing area is respectively, correspondingly and electrically connected with the routing area in the cutting route area by the lead wire bonding process through a first conductive material.
6. The implementation method of the anti-electromagnetic interference radio frequency module according to claim 1 , wherein
in Step S 5 , the cutting route area is cut away, and a first conductive material respectively connected with a corresponding grounding routing area is cut to form a cross section, so that the cross section of the first conductive material is respectively exposed from a corresponding surface of a located radio frequency module body.
7. The implementation method of the anti-electromagnetic interference radio frequency module according to claim 1 , wherein
in Step S 6 , a plurality of independent radio frequency module bodies are converted onto the film plating tool, an upper surface of each independent radio frequency module body faces the upside, and a preset gap is formed between every two independent radio frequency module bodies, so that side surfaces of each radio frequency module body are exposed in the air, a lower surface of the base plate is completely shielded by the film plating tool, a metal thin film structure is attached to the upper surface and the side surfaces of the radio frequency module body, and the metal thin film structure is directly and electrically connected to a cross section of a first conductive material exposed from the side surfaces of the radio frequency module body, and the metal thin film structure is electrically connected with the grounding area inside the radio frequency module body to form an anti-electromagnetic interference shielding layer integrated with the radio frequency module body.
8. The anti-electromagnetic interference radio frequency module formed by the implementation method according to claim 1 .