IP Library › Granted Patent US 11,264,375
Granted Patent B2
US 11,264,375 · App. 16/787,643 · Granted Mar 1, 2022

Semiconductor device

Inventor: Naoki Takahashi (Kyoto, JP)
Assignee: Rohm Co., Ltd.
H01L27/0292H01L27/027H01L27/0255
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Quick Facts
Patent No.
US 11,264,375
App. No.
16/787,643
Granted
Mar 1, 2022
Kind
B2
Abstract

A semiconductor device has an N-type substrate, a through conductor penetrating the N-type substrate, a protection target circuit provided on the N-type substrate, and an ESD protection circuit provided on the N-type substrate. The protection target circuit and the ESD protection circuit are connected together to the through conductor.

Claims (34)

1. A semiconductor device comprising:

an N-type substrate;

a through conductor penetrating the N-type substrate;

a protection target circuit provided on the N-type substrate; and

an ESD protection circuit provided on the N-type substrate,

wherein:

the protection target circuit and the ESD protection circuit are connected together, and the protection target circuit and the ESD protection circuit are connected to the through conductor, and

the ESD protection circuit includes:

a clamper configured to generate a clamp voltage when a voltage applied to the through conductor exceeds a threshold voltage; and

a vertical field-effect transistor configured to be on when the clamper is generating the clamp voltage.

2. The semiconductor device according to claim 1 , wherein

the through conductor has an extending part extending along an outer edge of the ESD protection circuit as seen in a top view of the N-type substrate.

3. The semiconductor device according to claim 2 , wherein

the extending part is ring-shaped and surrounds the ESD protection circuit as seen in a top view of the N-type substrate.

4. The semiconductor device according to claim 2 , wherein

the extending part has an uneven width.

5. The semiconductor device according to claim 1 , wherein

as seen in a top view of the N-type substrate,

a first-direction end part of the protection target circuit is located to a first-direction side of a first-direction end part of the ESD protection circuit,

a second-direction end part of the protection target circuit is located to a second-direction side of a second-direction end part of the ESD protection circuit, and

the first and second directions are opposite to each other.

6. The semiconductor device according to claim 1 , further comprising:

a gate control circuit configured to generate a gate voltage; and

an N-channel high-side switch configured to switch between conducting and cut-off states a path between a power supply and a load in accordance with the gate voltage.

7. An electronic appliance device comprising:

the semiconductor device according to claim 1 .

8. An electronic appliance device comprising:

the semiconductor device according to claim 6 .

9. A vehicle comprising:

a battery; and

the electronic appliance according to claim 7 configured to operate by being supplied with a supply voltage from the battery.

10. A vehicle device comprising:

a battery; and

the electronic appliance according to claim 8 configured to operate by being supplied with a supply voltage from the battery.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 21, 2020
From: TAKAHASHI, NAOKI
To: ROHM CO., LTD.
Reel/Frame 051886/0585 →
Priority Claims (1)
JP JP2019-22920 · Feb 12, 2019 · national
Continuity (1)
Related Publication 20200258880A1 · Aug 13, 2020