High-temperature ultrasonic sensor
A sensor for ultrasonically measuring a portion of a structure having a temperature significantly above room-temperature, the sensor comprising: a high-temperature portion for intimate contact with the structure, the high-temperature portion comprising at least: at least one transducer for converting a first signal to an ultrasonic transmit signal, and for converting an ultrasonic reflected signal to a second signal; a low-temperature portion comprising at least: at least one digital sensor interface (DSI) to which the transducer is electrically connected, the DSI being configured to transmit the first electrical signal and receive the second electrical signal, and to generate an A-scan signal based on the first and second electrical signals; a wireless interface for transmitting a digital signal based directly or indirectly on at least said A-scan signal; and a battery for powering the DSI and the wireless interface; and an elongated member containing one or more electrical conductors for conducting the first and second signals between the transducer and the DSI, the elongated member being configured to offset the low-temperature portion a sufficient distance away from the high-temperature portion such that the low-temperature portion is subjected to significantly less heat from the structure compared to the high-temperature portion.
1. A sensor for ultrasonically measuring a portion of a structure having a temperature significantly above room-temperature, said sensor comprising:
a high-temperature portion for contact with said structure, said high-temperature portion comprising at least:
at least one transducer for converting a first signal to an ultrasonic transmit signal, and for converting an ultrasonic reflected signal to a second signal;
a low-temperature portion comprising at least:
at least one digital sensor interface (DSI) to which said at least one transducer is electrically connected, said at least one DSI being configured to transmit said first electrical signal and receive said second electrical signal, and to generate an A-scan signal based on said first and second electrical signals;
a wireless interface for transmitting a digital signal based directly or indirectly on at least said A-scan signal; and
a battery for powering said at least one DSI and said wireless interface; and
an elongated member connecting said low-temperature portion and said high-temperature portion such that said elongated member, said low-temperature portion and said high-temperature portion form a discrete, unitary body, said elongated member also being sufficiently long to hold said low-temperature portion a sufficient distance away from said high-temperature portion such that said low-temperature portion is subjected to significantly less heat from said structure compared to said high-temperature portion.
2. The sensor of claim 1 , wherein said high-temperature portion is subjected to a certain measure of heat from said structure when installed on said structure, and wherein said low-temperature portion is offset at a sufficient distance from said high-temperature portion such that said low-temperature portion is subjected to no more than 30% of said certain measure of heat from said structure.
3. The sensor of claim 1 , wherein said elongated member is a rigid tube.
4. The sensor of claim 1 , wherein said elongated member is 5 to 100 cm long.
5. The sensor of claim 4 , wherein said elongated member is 10 to 50 cm long.
6. The sensor of claim 1 , wherein said elongated member is integral with said high- and low-temperature portions.
7. The sensor of claim 1 , wherein said elongated member is discrete from said high- and low-temperature portions.
8. The sensor of claim 7 , wherein said elongated member has thread ends, and wherein said high- and low-temperature portions have threaded openings to receive said threaded ends, such that said elongated member forms said unitary sensor when in threaded engagement with said high- and low-temperature portions.
9. The sensor of claim 1 , wherein each of said at least one transducer comprises:
a delay line configured for contacting the structure;
a piezoelectric material contracting said delay line;
a backing around said piezoelectric material;
an insulating material around at least a portion of said backing material;
a spring urging said piezoelectric material into said delay line; and
a case cooperating with said delay line to enclose said spring and said insulting material.
10. The sensor of claim 9 wherein the piezoelectric material is lithium niobate.
11. The sensor of claim 9 wherein the piezoelectric material is aluminum nitride.
12. The sensor of claim 9 wherein the piezoelectric material is bismuth titanate.
13. The sensor of claim 9 , wherein the backing material is a partially sintered, powder metal compact.
14. The sensor of claim 9 , wherein said at least one transducer is coupled together with pressure rather than with adhesive.
15. The sensor of claim 1 , further comprising a temperature measurement device within said at least one transducer to measure the temperature of said portion of said structure.
16. The sensor of claim 15 wherein the temperature measurement device is a thermocouple.
17. The sensor of claim 15 wherein the temperature measurement device is a resistance temperature detector (RTD).
18. The sensor of claim 1 , further comprising one or more electrical conductors for conducting said first and second signals between said at least one transducer and said at least one DSI.
19. The sensor of claim 18 , wherein said one or more electrical conductors are contained within said elongated member.