Production method for antenna substrate, production method for antenna substrate with wiring line and electrode, and production method for RFID element

1. A method for producing an antenna substrate with a wiring line and electrode, comprising the steps of:

(1) forming a coating film using a photosensitive paste containing a conductive material and a photosensitive organic component on an insulating substrate;

(2-A) processing the coating film into a pattern corresponding to an antenna by photolithography;

(2-B) processing the coating film into a pattern corresponding to a wiring line by photolithography;

(2-C) processing the coating film into a pattern corresponding to an electrode by photolithography;

(3-A) curing the pattern corresponding to an antenna into an antenna;

(3-B) curing the pattern corresponding to a wiring line into a wiring line; and

(3-C) curing the pattern corresponding to an electrode into an electrode,

wherein steps (2-A), (2-B), and (2-C) are performed at the same time in a batch manner such that connections among the antenna, wiring line and electrode are continuous, and

wherein the electrode is operatively connected to a TFT or a capacitor.

2. The method for producing an antenna substrate with wiring line and electrode according to claim 1 , wherein the antenna has a thickness of 1 to 10 μm, and the wiring line and the electrode each have a thickness of 0.05 to 1.0 μm.

3. A method for producing an antenna substrate with wiring line and electrode, comprising the steps of:

(1-P) forming a coating film using a photosensitive paste containing a conductive material and a photosensitive organic component on an insulating substrate having an antenna thereon;

(2-P-B) processing the coating film into a pattern corresponding to a wiring line by photolithography;

(2-P-C) processing the coating film into a pattern corresponding to an electrode by photolithography;

(3-P-B) curing the pattern corresponding to a wiring line into a wiring line; and

(3-P-C) curing the pattern corresponding to an electrode into an electrode,

wherein steps (2-P-B) and (2-P-C) are performed at the same time in a batch manner such that a connection between the wiring line and electrode is continuous, and

wherein the electrode is operatively connected to a TFT or a capacitor.

4. The method for producing an antenna substrate with wiring line and electrode according to claim 3 , wherein in step (1-P), the coating film is formed so as to overlap a part of the antenna.

5. The method for producing an antenna substrate with wiring line and electrode according to claim 3 , wherein the insulating substrate having the antenna thereon is produced by a method including a step of bonding a conductive material to the insulating substrate.

6. The method for producing an antenna substrate with wiring line and electrode according to claim 1 , wherein the photosensitive organic component contains a compound having a urethane group.

7. The method for producing an antenna substrate with wiring line and electrode according to claim 1 , wherein the insulating substrate contains at least one resin selected from polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polyphenylene sulfone, a cycloolefin polymer, a polyamide, and a polyimide.

8. A method for producing an RFID element, comprising the steps of:

(1) forming a coating film using a photosensitive paste containing a conductive material and a photosensitive organic component on an insulating substrate;

(2-A) processing the coating film into a pattern corresponding to an antenna by photolithography;

(2-B) processing the coating film into a pattern corresponding to a wiring line by photolithography;

(2-C) processing the coating film into a pattern corresponding to an electrode by photolithography;

(3-A) curing the pattern corresponding to an antenna into an antenna;

(3-B) curing the pattern corresponding to a wiring line into a wiring line;

(3-C) curing the pattern corresponding to an electrode into one or more electrodes to give an antenna substrate with wiring line and electrode; and

(4-S) forming a semiconductor layer on one or more of the electrodes or between the electrodes of the antenna substrate with wiring line and electrode,

wherein steps (2-A), (2-B), and (2-C) are performed at the same time in a batch manner such that connections among the antenna, wiring line and electrode are continuous, and

wherein the one or more electrodes are operatively connected to a TFT or a capacitor.

9. A method for producing an RFID element, comprising the steps of:

(1-P) forming a coating film using a photosensitive paste containing a conductive material and a photosensitive organic component on an insulating substrate having an antenna thereon;

(2-P-B) processing the coating film into a pattern corresponding to a wiring line by photolithography;

(2-P-C) processing the coating film into a pattern corresponding to an electrode by photolithography;

(3-P-B) curing the pattern corresponding to a wiring line into a wiring line;

(3-P-C) curing the pattern corresponding to an electrode into one or more electrodes to give an antenna substrate with wiring line and electrode; and

(4-S) forming a semiconductor layer on one or more of the electrodes or between the electrodes of the antenna substrate with wiring line and electrode,

wherein steps (2-P-B) and (2-P-C) are performed at the same time in a batch manner such that a connection between the wiring line and electrode is continuous, and

wherein the one or more electrodes are operatively connected to a TFT or a capacitor.

10. The method for producing an RFID element according to claim 8 , wherein step (4-S) includes a step of applying a solution containing carbon nanotubes.

11. The method for producing an antenna substrate with wiring line and electrode according to claim 1 , wherein

the insulating substrate comprises one or more resins including a polyimide, polyamide, polyester, epoxy, polyamideimide, polyetherimide, polyetherketone, polysulfone, polyphenylene sulfide (PPS) or cycloolefin resin; and

the photosensitive paste comprises a conductive powder and the photosensitive organic component which contains a monomer, oligomer or polymer having a polymerizable unsaturated group therein.

12. The method for producing an antenna substrate with wiring line and electrode according to claim 3 , wherein

the insulating substrate comprises one or more resins including a polyimide, polyamide, polyester, epoxy, polyamideimide, polyetherimide, polyetherketone, polysulfone, polyphenylene sulfide (PPS) or cycloolefin resin; and

the photosensitive paste comprises a conductive powder and the photosensitive organic component which contains a monomer, oligomer or polymer having a polymerizable unsaturated group therein.

13. The method for producing an antenna substrate with wiring line and electrode according to claim 8 , wherein

the insulating substrate comprises one or more resins including a polyimide, polyamide, polyester, epoxy, polyamideimide, polyetherimide, polyetherketone, polysulfone, polyphenylene sulfide (PPS) or cycloolefin resin; and

the photosensitive paste comprises a conductive powder and the photosensitive organic component which contains a monomer, oligomer or polymer having a polymerizable unsaturated group therein.

14. The method for producing an antenna substrate with wiring line and electrode according to claim 9 , wherein

the insulating substrate comprises one or more resins including a polyimide, polyamide, polyester, epoxy, polyamideimide, polyetherimide, polyetherketone, polysulfone, polyphenylene sulfide (PPS) or cycloolefin resin; and

the photosensitive paste comprises a conductive powder and the photosensitive organic component which contains a monomer, oligomer or polymer having a polymerizable unsaturated group therein.