IP Library › Granted Patent US 11,274,062
Granted Patent B2
US 11,274,062 · App. 17/041,059 · Granted Mar 15, 2022

Radiative cooling device

Inventors: Masahiro Suemitsu (Osaka, JP); Tadashi Saito (Osaka, JP)
Assignee: Osaka Gas Co., Ltd.
C03C17/366C03C17/3613C03C17/3626C03C17/3644C03C17/3649F28F21/065C03C2217/214C03C2217/252C03C2217/256C03C2217/281C03C2218/154F28F2245/06
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Quick Facts
Patent No.
US 11,274,062
App. No.
17/041,059
Granted
Mar 15, 2022
Kind
B2
Abstract

Provided is a radiative cooling device that provides coloration of the radiative surface while maximally avoiding reduction in its radiative cooling performance due to absorption of solar light. An infrared radiative layer for radiating infrared light from a radiative surface and a light reflective layer disposed on the side opposite to the presence side of the radiative surface of the infrared radiative layer are provided in a mutually stacked state. The light reflective layer is arranged such that a first metal layer made of silver or silver alloy and having a thickness equal to or greater than 10 nm and equal to or less than 100 nm, a transparent dielectric layer and a second metal layer reflecting light transmitted through the first metal layer and the transparent dielectric layer are stacked in this order on the side closer to the infrared radiative layer. The transparent dielectric layer has a thickness that causes a resonance wavelength of the light reflective layer to be a wavelength included in wavelengths equal to or greater than 400 nm and equal to or less than 800 nm.

Claims (13)

1. A radiative cooling device configured such that an infrared radiative layer for radiating infrared light from a radiative surface and a light reflective layer disposed on the side opposite to the presence side of the radiative surface of the infrared radiative layer are provided in a mutually stacked state:

wherein the light reflective layer is arranged such that a first metal layer made of silver or silver alloy and having a thickness equal to or greater than 10 nm and equal to or less than 100 nm, a transparent dielectric layer and a second metal layer for reflecting light transmitted through the first metal layer and the transparent dielectric layer are stacked in this order on the side closer to the infrared radiative layer; and

wherein the transparent dielectric layer has a thickness that causes a resonance wavelength of the light reflective layer to be a wavelength included in wavelengths equal to or greater than 400 nm and equal to or less than 800 nm.

2. The radiative cooling device of claim 1 , wherein the second metal layer is formed of silver or silver alloy having a thickness equal to or greater than 100 nm.

3. The radiative cooling device of claim 1 , wherein the second metal layer is formed of aluminum or aluminum alloy having a thickness equal to or greater than 30 nm.

4. The radiative cooling device of claim 1 , wherein the second metal layer comprises the first layer formed of silver or silver alloy and the second layer formed of aluminum or aluminum alloy stacked and disposed in this order to the side closer to the transparent dielectric layer.

5. The radiative cooling device of claim 1 , wherein the transparent dielectric layer comprises a transparent nitride membrane.

6. The radiative cooling device of claim 1 , wherein the transparent dielectric layer comprises a transparent oxide layer.

7. The radiative cooling device of claim 1 , wherein the infrared radiative layer comprises glass selected from the group consisting of alkali free glass, crown glass and borosilicate glass.

8. The radiative cooling device of claim 1 , wherein the infrared radiative layer is used as a substrate, on which the first metal layer, the transparent dielectric layer and the second metal layer are stacked.

9. The radiative cooling device of claim 8 , wherein a gapless contact layer is stacked between the infrared radiative layer and the first metal layer.

10. The radiative cooling device of claim 8 , wherein on the side of the second metal layer opposite to the presence side of the transparent dielectric layer, an anti-oxidization layer is stacked.

11. The radiative cooling device of claim 1 , wherein the radiative surface of the infrared radiative layer has unevenness for light diffusion.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 24, 2020
From: SUEMITSU, MASAHIRO; SAITO, TADASHI
To: OSAKA GAS CO., LTD.
Reel/Frame 053869/0293 →
Priority Claims (1)
JP JP2018-137746 · Jul 23, 2018 · national
Continuity (1)
Related Publication 20210024409A1 · Jan 28, 2021