IP Library Granted Patent US 11,280,919
Granted Patent B2
US 11,280,919 · App. 16/720,989 · Granted Mar 22, 2022

Radiation imaging apparatus and radiation imaging system

Inventors: Katsuro Takenaka (Honjo, JP); Shoshiro Saruta (Tokyo, JP); Atsushi Iwashita (Tokyo, JP); Kentaro Fujiyoshi (Tokyo, JP); Keiichi Nomura (Kawasaki, JP); Kazumi Nagano (Tokyo, JP); Yohei Ishida (Kawasaki, JP); Tomoki Komatsu (Kawasaki, JP)
Assignee: CANON KABUSHIKI KAISHA
G01T1/2018
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Quick Facts
Patent No.
US 11,280,919
App. No.
16/720,989
Granted
Mar 22, 2022
Kind
B2
Abstract

A radiation imaging apparatus is provided. The apparatus includes a substrate in which conversion elements are arranged and which transmits light beams, a first scintillator arranged on a first surface side of the substrate, and a second scintillator arranged on a second surface side opposite to the first surface. The conversion elements include first conversion elements and second conversion elements. The first conversion elements are arranged so as to receive light beams from the first scintillator and the second scintillator. A light-shielding layer is arranged between the first scintillator and each of the second conversion elements so as to set light amounts of the second conversion elements from the first scintillator smaller than those of the first conversion elements from the first scintillator, and the second conversion elements are arranged to receive a light beam from the second scintillator.

Claims (33)

1. A radiation imaging apparatus, comprising:

a substrate in which a plurality of conversion elements is arranged in a two-dimensional array and which transmits light beams, the plurality of conversion elements including a first conversion element and a second conversion element;

a first scintillator arranged on a first surface side of the substrate; and

a second scintillator arranged on a second surface side of the substrate opposite to the first surface, wherein

a light-shielding layer is arranged between the first scintillator and a semiconductor layer of the second conversion element so as to set light amounts received by the semiconductor layer of the second conversion element from the first scintillator smaller than those of the first conversion element from the first scintillator, and the semiconductor layer of the second conversion element is arranged to receive a light beam from the second scintillator,

with the provisos that a light shielding layer is not disposed between a semiconductor layer of the first conversion element and the first scintillator, and a light shielding layer is not disposed between the semiconductor layer of the first conversion element and the second scintillator.

2. The radiation imaging apparatus according to claim 1 , wherein the plurality of conversion elements is arranged between the first surface and the first scintillator.

3. The radiation imaging apparatus according to claim 2 , wherein each of the plurality of conversion elements includes a first electrode, the semiconductor layer, and a second electrode in this order from the first surface side to the first scintillator, and

the second electrode is configured to function as the light-shielding layer in the second conversion element.

4. The radiation imaging apparatus according to claim 2 , comprising a scattering preventive layer arranged between the second scintillator and the second surface.

5. The radiation imaging apparatus according to claim 1 , wherein the plurality of conversion elements is arranged between the second surface and the second scintillator.

6. The radiation imaging apparatus according to claim 5 , wherein each of the plurality of conversion elements includes a first electrode, the semiconductor layer, and a second electrode in this order from the second surface side to the second scintillator, and

the first electrode is configured to function as the light-shielding layer in the second conversion element.

7. The radiation imaging apparatus according to claim 6 , wherein the first electrode is a metal material, and

an area of the first electrode arranged in the first conversion element out of the first electrode is smaller than an area of the first electrode and the semiconductor layer arranged in the second conversion element out of the first electrode in a planar view with respect to the substrate.

8. The radiation imaging apparatus according to claim 1 , which is configured for radiation to enter from the first surface side.

9. The radiation imaging apparatus according to claim 1 , which is configured for radiation to enter from the second surface side.

10. The radiation imaging apparatus according to claim 1 , further comprising:

a plurality of signal lines along a column direction in which signals generated by the plurality of conversion elements are configured to be output, wherein

the plurality of conversion elements includes a plurality of the first conversion elements and a plurality of the second conversion elements, and

among conversion elements aligned in a row direction crossing the column direction out of the plurality of conversion elements, the numbers of the plurality of included second conversion elements are equal to each other for the respective rows.

11. The radiation imaging apparatus according to claim 10 , wherein among conversion elements aligned in the column direction out of the plurality of conversion elements, the numbers of the plurality of included second conversion elements are equal to each other for the respective columns.

12. The radiation imaging apparatus according to claim 1 , further comprising:

a plurality of signal lines along a column direction in which signals generated by the plurality of conversion elements are configured to be output, wherein

among conversion elements aligned in the column direction out of the plurality of conversion elements, the numbers of the plurality of included second conversion elements are equal to each other for the respective columns.

13. The radiation imaging apparatus according to claim 1 , wherein the plurality of conversion elements includes a plurality of the first conversion elements and a plurality of the second conversion elements, and

the number of the plurality of second conversion elements is smaller than the number of the plurality of first conversion elements.

14. A radiation imaging system, comprising:

the radiation imaging apparatus according to claim 1 ; and

a signal processing unit configured to process a signal from the radiation imaging apparatus.

15. The radiation imaging system according to claim 14 , wherein the signal processing unit is configured to generate an energy subtraction image based on signals output from the first conversion element and signals output from the second conversion element.

16. The radiation imaging system according to claim 14 , wherein the signal processing unit is configured to generate an energy subtraction image based on differences between signals output from the second conversion element and differences between signals output from the first conversion element and signals output from the second conversion element.

17. The radiation imaging system according to claim 14 , wherein the signal processing unit is configured to generate a normal radiation image based on signals output from the first conversion element.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 6, 2020
From: TAKENAKA, KATSURO; SARUTA, SHOSHIRO; IWASHITA, ATSUSHI; FUJIYOSHI, KENTARO; NOMURA, KEIICHI; NAGANO, KAZUMI; ISHIDA, YOHEI; KOMATSU, TOMOKI
To: CANON KABUSHIKI KAISHA
Reel/Frame 051732/0768 →
Priority Claims (2)
JP JP2017-134956 · Jul 10, 2017 · national
JP JP2017-199603 · Oct 13, 2017 · national
Continuity (2)
Continuation PCTJP2018020996 · May 31, 2018
Related Publication 20200124749A1 · Apr 23, 2020
Cited By (7)
US 12,253,639 US 12,339,408 US 12,348,891 US 12,357,259 US 12,461,258 US 12,529,804 US 12,733,894