Method for forming pattern by using photo-nanoimprint technology, imprint apparatus, and curable composition
A method for forming a pattern by using a photo-nanoimprint process includes performing, on each of a plurality of shot areas on a surface of a substrate: a step (1) of dispensing liquid droplets of a curable composition (A) dropwise discretely; a step (2) of bringing the curable composition (A) and a mold into contact with each other; a step (3) of irradiating the curable composition (A) with light; and a step (4) of releasing the mold from a cured product of the curable composition (A), in which when steps from the step (2) to the step (4) are collectively called an imprinting step (Im), before the imprinting step (Im) is performed on one shot area on which the step (1) has already been performed out of the plurality of shot areas, the step (1) is performed on another shot area selected from the plurality of shot areas.
1. A method for forming a pattern by using a photo-nanoimprint process, comprising performing, on each of a plurality of shot areas on a surface of a substrate, in this order:
a laying step ( 1 ) of dispensing liquid droplets of a curable composition (A) containing at least a component (a) serving as a polymerizable compound dropwise discretely to lay the liquid droplets;
a mold contacting step ( 2 ) of bringing the curable composition (A) and a mold into contact with each other;
a light irradiating step ( 3 ) of irradiating the curable composition (A) with light from a mold side to cure the composition; and
a releasing step ( 4 ) of releasing the mold from a cured product of the curable composition (A),
wherein when steps from the mold contacting step ( 2 ) to the releasing step ( 4 ) are collectively called an imprinting step (Im), before the imprinting step (Im) is performed on one shot area on which the laying step ( 1 ) has already been performed out of the plurality of shot areas, the laying step ( 1 ) is performed on another shot area selected from the plurality of shot areas,
wherein after the laying step ( 1 ) has been sequentially performed on the plurality of shot areas (S(1), S(2), . . . , S(m)), where m represents an integer of 2 or more, the imprinting step (Im) on the shot area (S(1)) and the laying step ( 1 ) on a shot area (S(1+m)) are performed in the stated order, and thereafter, the imprinting step (Im) on a shot area (S(p)), where p represents an integer of 2 or more, and the laying step ( 1 ) on a shot area (S(p+m)) are performed in the stated order, and
wherein when the laying step ( 1 ) is sequentially performed on the plurality of shot areas (S(1), S(2), . . . , S(m)), in a period from performance of the laying step ( 1 ) on one shot area to performance of the laying step ( 1 ) on a next shot area, a waiting step [M] identical in length to a required time Ti 1 for performance of the imprinting step (Im) on the one shot area is provided.
2. The method according to claim 1 , wherein when a required time in the laying step ( 1 ) is represented by Td 1 , in one arbitrary shot area, a required time for initiation of the imprinting step (Im) after completion of the laying step ( 1 ) is (m−1)×(Ti 1 +Td 1 ).
3. The method according to claim 2 , wherein the required time Td 1 in the laying step ( 1 ) and the required time Ti 1 in the imprinting step (Im) are equal to each other.
4. The method according to claim 1 , wherein the curable composition (A) has a volume reduction ratio of 10% in a period after the liquid droplets have been dispensed dropwise discretely to be laid in the laying step ( 1 ) and before the mold is brought into contact with the curable composition (A) in the mold contacting step ( 2 ).
5. The method according to claim 1 , wherein the curable composition (A) has a weight reduction ratio of a composition of components of the curable composition (A), except a component (d) serving as a solvent, of 10% or less 10 seconds after the liquid droplets have been dispensed dropwise discretely to be laid in the laying step ( 1 ).
6. The method according to claim 1 , wherein the curable composition (A) has a vapor pressure of a composition of components of the curable composition (A), except a component (d) serving as a solvent, at 20° C. of 0.5 kPa or less.