Computer server heat regulation utilizing integrated precision air flow
Disclosed is a server rack system within an enclosed building and a process for directing air through a server facility. Air is channeled from conduit to a server rack assembly and then through a closed loop back again into the server rack assembly from channeling exhaust air through conduit away from the server rack assembly.
1. A server facility for the efficient transmission of cooling gas, said facility comprising:
an airflow source for the forced transmission of gas;
a building defining an enclosed building interior and having at least one building inlet conduit for sealed movement of the gas within said building and at least one building outlet conduit for exhausting the gas to a heat release element; and
a server rack stand bearing at least one computer, said at least one computer having a case, said case having an exterior, at least one case inlet aperture, and at least one case outlet aperture, comprising lateral support members defining:
(i) an interior void, having
a first discrete portion;
a second discrete portion positioned opposite from said first discrete portion;
a third discrete portion, positioned linearly from said first discrete portion; and
a fourth discrete portion positioned opposite from said third discrete portion and said fourth discrete portion positioned linearly from said second discrete portion;
(ii) an airflow inlet passage downstream of said at least one building inlet conduit and said airflow inlet passage upstream of said first discrete portion and said third discrete portion, said airflow inlet passage adapted to inject said gas directly from both said first discrete portion and said third discrete portion into said case of said at least one computer via said at least one case inlet aperture without any substantially gas contact with said exterior of said case of said at least one computer, and
(iii) an airflow outlet passage, downstream of said second discrete portion and said fourth discrete portion said airflow outlet passage upstream of said at least one building outlet conduit, said airflow outlet passage adapted to receive said gas from said at least one computer to both said second discrete portion and said fourth discrete portion via said at least one case outlet aperture without any substantially gas contact with said exterior of said case of said at least one computer.
2. A server facility for the efficient transmission of cooling gas, said facility comprising:
an airflow source for the forced transmission of gas;
a building defining an enclosed building interior and having at least one building inlet conduit for sealed movement of the gas within said building and at least one building outlet conduit for exhausting the gas to a heat release element; and
a server rack stand bearing at least one computer, said at least computer having a case, said case having an exterior, at least one case inlet aperture, and at least one case outlet aperture, comprising lateral support members defining:
(i) an interior void, having
a first discrete portion;
a second discrete portion positioned linearly from said first discrete portion,
a third discrete portion, positioned opposite from said first discrete portion, and
a fourth discrete portion positioned opposite from said second discrete portion and said fourth discrete portion positioned linearly from said third discrete portion, and
(ii) an airflow inlet passage downstream of said at least one building inlet conduit and said airflow inlet passage upstream of said first discrete portion and said third discrete portion, said airflow inlet passage adapted to inject said gas directly from both said first discrete portion and said third discrete portion into said case of said at least one computer via said at least one case inlet aperture without any substantially gas contact with said exterior of said case of said at least one computer, and
(iii) an airflow outlet passage, downstream of said second discrete portion and said fourth discrete portion said airflow outlet passage upstream of said at least one building outlet conduit, said airflow outlet passage adapted to receive said gas from said at least one computer to both said second discrete portion and said fourth discrete portion via said at least one case outlet aperture without any substantially gas contact with said exterior of said case of said at least one computer.
3. A method of directing gas for cooling through a server facility, said method comprising:
providing a server rack stand comprising two lateral support members;
releasably affixing a plurality of cartridges to said two lateral support members;
cooling said gas;
channeling said cooled gas through at least one building inlet conduit within an enclosed building through at least one airflow inlet passage of said server rack stand into a first discrete interior void portion and a third discrete interior void portion of at least one of said two lateral supports of said server rack stand;
directing said cooled gas from said first and third discrete interior void portions through a plurality of sealed inlet fluid pathways into a device interior of at least one electronic device coupled between said two lateral support members;
returning said gas as exhaust gas from said at least one electronic device through a plurality of sealed outlet fluid pathways to a second discrete interior void portion and a fourth discrete interior void portion of said at least one of said two lateral supports of said server rack stand; and
channeling said exhausted gas through at least one airflow outlet passage of said server rack stand into at least one building outlet conduit within said enclosed building to a heat release element,
wherein each of said sealed inlet fluid pathways and said sealed outlet fluid pathways comprise a selectively blocked pathway through a respective one of said cartridges.
4. The method of claim 3 further comprising:
positioning said first discrete interior void portion opposite of said second discrete interior void portion; and
positioning said third discrete interior void portion opposite of said fourth discrete interior void portion.
5. The method of claim 4 wherein said positioning step includes:
positioning said third discrete interior void portion linearly with said first discrete interior void portion; and
positioning said fourth discrete interior void portion linearly with said second discrete interior void portion.
6. The method of claim 3 further comprising:
positioning said first discrete interior void portion opposite of said third discrete interior void portion; and
positioning said second discrete interior void portion opposite of said fourth discrete interior void portion.
7. The method of claim 6 wherein said positioning step includes:
positioning said second discrete interior void portion linearly with said first discrete interior void portion; and
positioning said fourth discrete interior void portion linearly with said third discrete interior void portion.
8. The method of claim 3 further comprising:
positioning said third discrete interior void portion linearly with said first discrete interior void portion; and
positioning said fourth discrete interior void portion linearly with said second discrete interior void portion.
9. The method of claim 3 further comprising:
positioning said second discrete interior void portion linearly with said first discrete interior void portion; and
positioning said fourth discrete interior void portion linearly with said third discrete interior void portion.