Composite component void repair
Methods for repairing composite component voids are provided. For example, one method comprises locating a void in a composite component and subjecting the composite component to a process for repair. The process for repair includes creating a flow path through the void, applying a filler material to the composite component at the flow path, and processing the composite component having the filler material. In some embodiments, the flow path has a first opening on a first side of the composite component and a second opening on a second, opposite side of the composite component. In other embodiments, at least one portion of the flow path extends at a first angle with respect to a lateral direction defined by the CMC component, and at least another portion extends at a second angle with respect to the lateral direction.
1. A method, comprising:
locating a void in a ceramic matrix composite (CMC) component; and
subjecting the CMC component to a process for repair, the process for repair including
creating a flow path through the void,
filling the void and the flow path with a filler material, and
processing the CMC component having the filler material,
wherein processing the CMC component includes subjecting the CMC component having the filler material to densification by melt infiltration through heating the CMC component having the filler material while in contact with a source of silicon, wherein a first portion of the flow path extends at a first angle with respect to a lateral direction defined by the CMC component, the first angle being non-zero and non-normal with respect to the lateral direction, and wherein a second portion of the flow path extends at a second angle with respect to the lateral direction such that the flow path is defined at more than one angle with respect to the CMC component, the second angle being non-zero and non-normal with respect to the lateral direction.
2. The method of claim 1 , wherein the flow path has a first opening on a first side of the CMC component and a second opening on a second side of the CMC component, and wherein the second side is opposite the first side.
3. The method of claim 1 , wherein the flow path has a first opening on a first side of the CMC component and a second opening on the first side of the CMC component.
4. The method of claim 1 , wherein the flow path has a first opening on a first side of the CMC component and a second opening on a third side of the CMC component, and wherein the third side is adjacent the first side.
5. The method of claim 1 , wherein creating the flow path comprises laser drilling a hole through the CMC component, the hole forming the flow path.
6. The method of claim 1 , wherein the filler material comprises silicon.
7. A method for repairing a void in a composite component, comprising:
creating a flow path through the void, the flow path having a first opening on a first side of the composite component and a second opening on a second side of the composite component, the second side opposite the first side;
filling the void and the flow path with a filler material; and
processing the composite component having the filler material,
wherein a first portion of the flow path extends at a first angle with respect to a lateral direction defined by the composite component, the first angle being non-zero and non-normal with respect to the lateral direction, and
wherein a second portion of the flow path extends at a second angle with respect to the lateral direction such that the flow path is defined at more than one angle with respect to the composite component, the second angle being non-zero and non-normal with respect to the lateral direction.
8. The method of claim 7 , wherein creating the flow path comprises laser drilling a hole through the composite component, the hole forming the flow path.
9. The method of claim 7 , wherein the composite component is formed from a ceramic matrix composite material, and wherein processing the composite component includes subjecting the composite component having the filler material to melt infiltration by heating the component having the filler material while the composite component having the filler material is in contact with a source of silicon.
10. The method of claim 7 , wherein the composite component is formed from a polymer matrix composite material, and wherein processing the composite component includes autoclaving the composite component having the filler material.
11. A method, comprising:
locating a void in a ceramic matrix composite (CMC) component;
creating a flow path through the void, the flow path having a first opening at an outer surface of the CMC component and a second opening at the outer surface of the CMC component, at least one portion of the flow path extending at a first angle with respect to a lateral direction defined by the CMC component;
filling the void and the flow path with a filler; and
subjecting the CMC component having the filler material within the flow path to a process that includes melt infiltration by heating the CMC component having the filler material while the CMC component having the filler material is in contact with a source of silicon, wherein a first portion of the flow path extends at a first angle with respect to a lateral direction, wherein a second portion of the flow path extends at a second angle with respect to the lateral direction such that the flow path is defined at more than one angle with respect to the composite component, wherein the first angle is a non-zero and non-normal angle with respect to the lateral direction, and wherein the second angle is a non-zero and non-normal angle with respect to the lateral direction.