Member for semiconductor manufacturing device
According to one embodiment, a member for a semiconductor manufacturing device includes an alumite base material including a concavity, and a first layer formed on the alumite base material and including an yttrium compound. The first layer includes a first region, and a second region provided in the concavity and located between the first region and the alumite base material. An average particle diameter in the first region is shorter than an average particle diameter in the second region.
1. A member for a semiconductor manufacturing device, comprising:
an alumite base material including concavitits defined therein, the concavities being irregular shaped cracks formed by heat treatment of the alumite base material; and
a first layer formed by aerosol deposition on the alumite base material and including an yttrium compound, wherein
the first layer including
an outer surface,
a first region on a side of the outer surface, and
a second region provided in the concavity and located between the first region and the alumite base material,
the concavity including a first portion provided with the first region and a second portion provided with the second region,
a width of the second portion being narrower than a width of the first portion in a cross section along a stacking direction, and
a boundary of the first layer in the concavity and the alumite base material being curved convex toward the outer surface of the first layer in the cross section.
2. The member for the semiconductor manufacturing device according to claim 1 , wherein
the second portion has a bottom surface along a plane perpendicular to the stacking direction, and
a ratio of an opening width of the first portion to a width of the bottom surface of the second portion is not less than 1.1 times in the cross section.
3. The member for the semiconductor manufacturing device according to claim 1 , wherein
the first layer also has a surface contacting the alumite base material which is opposite to the outer surface, and
a width of the concavity in the cross section becomes narrower as going away from the outer surface toward the surface contacting the alumite base material.
4. The member for the semiconductor manufacturing device according to claim 1 , wherein
an opening of each of the concavities has a first end portion and a second end portion separated from each other in the cross section,
the second portion has a bottom surface along a plane perpendicular to the stacking direction, and
an angle made by a straight line connecting the first end portion and the second end portion and a straight line connecting the first end portion and the bottom surface of the second portion in the shortest length in the cross section is not less than 10° and not more than 89°.
5. The member for the semiconductor manufacturing device according to claim 1 , wherein
a curvature radius of a boundary of the first layer in the concavity and the alumite base material is not less than 0.4 micrometers.