Apparatus and method for treating substrate
The substrate treating apparatus includes a processing module and an index module on which a cassette having the substrate received therein is placed and that includes an index robot that transfers the substrate between the cassette and the processing module. The processing module includes a process chamber and a transfer chamber. The process chamber includes a support unit. The support unit includes a support on which the substrate is placed and a ring member that surrounds the substrate placed on the support and that is provided so as to be detachable from the support. The apparatus further includes a carrier storage unit that stores a carrier that is mounted on a hand of the main transfer robot or the index robot and on which the ring member is placed when the ring member is transferred by the main transfer robot or the index robot.
1. A method for treating a substrate, the method comprising:
supporting the substrate using a support unit including a ring member configured to surround a periphery of the substrate in a processing space; and
performing processing on the substrate,
wherein the ring member is transferred by a transfer robot having a hand,
wherein the ring member is supported by a carrier mounted on the hand when the ring member is transferred by the hand,
wherein the carrier includes a body having a fan shape with a blunt end.
2. The method of claim 1 , wherein an anti-slip member is mounted on a surface of the carrier on which the ring member is placed.
3. The method of claim 2 , wherein the anti-slip member includes a plurality of O-rings.
4. The method of claim 2 , wherein the carrier is mounted on the hand by vacuum clamping.
5. The method of claim 2 , wherein the substrate is directly supported on the hand when the substrate is transferred by the transfer robot.
6. The method of claim 5 , wherein a transfer speed of the hand when the ring member is transferred is lower than a transfer speed of the hand when the substrate is transferred.
7. The method of claim 1 , wherein the processing space includes,
a dielectric plate configured to hold the substrate, the ring member disposed around a periphery of the dielectric plate;
a heater disposed in the dielectric plate;
a base configured to support the dielectric plate; and
a cooling channel within the base.