IP Library › Granted Patent US 11,296,232
Granted Patent B2
US 11,296,232 · App. 16/759,562 · Granted Apr 5, 2022

Oxide semiconductor thin-film transistor and method of fabricating the same

Inventors: Jin Jang (Seoul, KR); Suhui Lee (Seoul, KR)
Assignee: UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY
H01L29/7869H01L27/3262H01L29/66969H01L29/78618H01L2227/323
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,296,232
App. No.
16/759,562
Granted
Apr 5, 2022
Kind
B2
Abstract

An oxide thin-film transistor includes a substrate; a first gate electrode formed on the substrate; a gate insulator formed on the first gate electrode; an oxide semiconductor layer formed on the gate insulator to correspond to the first gate electrode; source/drain electrodes formed to be spaced from each other on the oxide semiconductor layer and formed in a shape of a plurality of island patterns; a passivation layer formed on the source/drain electrodes, where the source/drain electrodes include a first area formed in a direction of the first gate electrode with respect to a horizontal plane of the substrate; and a second area formed in an opposite direction to the first area, and the plurality of island patterns are formed such that the first areas are separated from each other and thus have resistance to external stress.

Claims (45)

1. An oxide semiconductor thin-film transistor, comprising:

a substrate;

a first gate electrode formed on the substrate;

a gate insulator formed on the first gate electrode;

an oxide semiconductor layer formed on the gate insulator to correspond to the first gate electrode;

source/drain electrodes formed to be spaced from each other on the oxide semiconductor layer and formed in a shape of a plurality of island patterns;

a passivation layer formed on the source/drain electrodes,

wherein the source/drain electrodes comprise a first area formed in a direction of the first gate electrode with respect to a horizontal plane of the substrate, and a second area formed in an opposite direction to the first area, and

the plurality of island patterns are formed such that the first areas are separated from each other,

wherein an end of the first gate electrode and an end of the first area with respect to the source electrode are offset by a width of −1 μm to 0 μm or overlapped by a width of 0 μm to 3 μm in a horizontal direction, and

wherein the other end of the first gate electrode and an end of the second area with respect to the drain electrode are offset by a width of −1 μm to 0 μm or overlapped by a width of 0 μm to 3 μm in the horizontal direction.

2. The oxide semiconductor thin-film transistor according to claim 1 , wherein the plurality of island patterns have a shape wherein a plurality of line patterns are repeatedly formed.

3. The oxide semiconductor thin-film transistor according to claim 2 , wherein a width of each of the plurality of line patterns is 1 μm to 10 μm.

4. The oxide semiconductor thin-film transistor according to claim 2 , wherein a spacing between the plurality of line patterns is 1 μm to 16 μm.

5. The oxide semiconductor thin-film transistor according to claim 1 , wherein the plurality of island patterns have a lattice shape wherein a plurality of line patterns vertically intersect.

6. The oxide semiconductor thin-film transistor according to claim 1 , wherein a second gate electrode is further formed on the passivation layer formed on the source/drain electrodes of the oxide semiconductor thin-film transistor.

7. The oxide semiconductor thin-film transistor according to claim 6 , further comprising a connection electrode for electrically connecting the first gate electrode and the second gate electrode.

8. The oxide semiconductor thin-film transistor according to claim 7 , wherein the first gate electrode and the second gate electrode are electrically connected and thus the same voltage is applied thereto.

9. A display apparatus, comprising:

a substrate;

an oxide semiconductor thin-film transistor according to claim 1 formed on the substrate; and

a display device electrically connected to the oxide semiconductor thin-film transistor.

10. The display apparatus according to claim 9 , wherein the display device is an organic light-emitting device.

11. A coplanar oxide semiconductor thin-film transistor, comprising:

an oxide semiconductor layer formed on a substrate; a first gate electrode formed on the oxide semiconductor layer; and source/drain electrodes respectively formed in a shape of a plurality of island patterns,

wherein the source/drain electrodes comprise a first area formed in a direction of the first gate electrode with respect to a horizontal plane of the substrate; and a second area formed in an opposite direction to the first area, and

the plurality of island patterns are formed such that the first areas are separated from each other,

wherein an end of the first gate electrode and an end of the first area with respect to the source electrode are offset by a width of −1 μm to 0 μm or overlapped by a width of 0 μm to 3 μm in a horizontal direction, and

wherein the other end of the first gate electrode and an end of the second area with respect to the drain electrode are offset by a width of −1 μm to 0 μm or overlapped by a width of 0 μm to 3 μm in the horizontal direction.

12. The oxide semiconductor thin-film transistor according to claim 11 , wherein a second gate electrode is further formed under the oxide semiconductor layer.

13. A display apparatus, comprising:

a substrate;

an oxide semiconductor thin-film transistor according to claim 11 formed on the substrate; and

a display device electrically connected to the oxide semiconductor thin-film transistor.

14. The display apparatus according to claim 13 , wherein the display device is an organic light-emitting device.

15. A method of fabricating an oxide semiconductor thin-film transistor, the method comprising:

forming a first gate electrode on a substrate;

forming a gate insulator on the first gate electrode;

forming an oxide semiconductor layer on the gate insulator to correspond to the first gate electrode;

forming source/drain electrodes to be spaced from each other on the oxide semiconductor layer and to have a plurality of island patterns; and

forming a passivation layer on the source/drain electrodes,

wherein the source/drain electrodes comprise a first area formed in a direction of the first gate electrode with respect to a horizontal plane of the substrate, and a second area formed in an opposite direction to the first area,

wherein an end of the first gate electrode and an end of the first area with respect to the source electrode are offset by a width of −1 μm to 0 μm or overlapped by a width of 0 μm to 3 μm in a horizontal direction, and

wherein the other end of the first gate electrode and an end of the second area with respect to the drain electrode are offset by a width of −1 μm to 0 μm or overlapped by a width of 0 μm to 3 μm in the horizontal direction.

16. The method according to claim 15 , further comprising forming a second gate electrode on the passivation layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 27, 2020
From: JANG, JIN; LEE, SUHUI
To: UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY
Reel/Frame 052503/0475 →
Priority Claims (1)
KR 10-2017-0141182 · Oct 27, 2017 · national
Continuity (1)
Related Publication 20200287049A1 · Sep 10, 2020