High-frequency module
A high-frequency module 1 a includes: a circuit board 2 ; a first component 3 a , which has characteristics likely to be changed by heat, and a second component 3 b , which generates heat, that are mounted on an upper surface 20 a of the circuit board 2 ; a sealing resin layer 4 configured to cover each of the components 3 a and 3 b and a component 3 c ; a shield film 5 configured to cover a surface of the sealing resin layer 4 ; and a heat dissipation member 6 disposed above an upper surface 4 a of the sealing resin layer 4 . A recessed portion 11 is formed in the upper surface 4 a of the sealing resin layer 4 as viewed in a direction perpendicular to the upper surface 20 a of the circuit board 2 . The recessed portion 11 can prevent the heat generated from the second component 3 b from affecting the first component 3 a.
1. A high-frequency module comprising:
a circuit board;
a first component and a second component, the first component and the second component being mounted on one main surface of the circuit board;
a sealing resin layer having a contact surface in contact with the one main surface of the circuit board, an opposite surface opposing to the contact surface, and side surfaces connecting edges of the contact surface to respective edges of the opposite surface, the opposite surface having a recessed portion at least partly defining a hollow portion, the sealing resin layer being configured to seal the first component and the second component; and
a heat dissipation member disposed above the opposite surface of the sealing resin layer,
wherein the hollow portion is disposed at a position overlapping the first component as viewed in a direction perpendicular to the one main surface of the circuit board.
2. The high-frequency module according to claim 1 ,
wherein the opposite surface of the sealing resin layer further has a first groove deeper than the recessed portion, and wherein the first groove is provided between the first component and the second component and connected to the recessed portion.
3. The high-frequency module according to claim 2 ,
wherein the recessed portion is comprised of a plurality of small depressions provided at a position overlapping the first component as viewed in the direction perpendicular to the one main surface of the circuit board.
4. The high-frequency module according to claim 2 ,
wherein the recessed portion has a shape substantially the same as a shape of the first component as viewed in the direction perpendicular to the one main surface of the circuit board.
5. The high-frequency module according to claim 2 ,
wherein the opposite surface of the sealing resin layer further has a vent groove, and the vent groove extends from the recessed portion to an end portion of the sealing resin layer as viewed in the direction perpendicular to the one main surface of the circuit board.
6. The high-frequency module according to claim 1 ,
wherein the opposite surface of the sealing resin layer further has a second groove deeper than the recessed portion, and
wherein the second groove surrounds the first component as viewed in the direction perpendicular to the one main surface of the circuit board and connected to the recessed portion.
7. The high-frequency module according to claim 6 ,
wherein the recessed portion is comprised of a plurality of small depressions provided at a position overlapping the first component as viewed in the direction perpendicular to the one main surface of the circuit board.
8. The high-frequency module according to claim 6 ,
wherein the recessed portion has a shape substantially the same as a shape of the first component as viewed in the direction perpendicular to the one main surface of the circuit board.
9. The high-frequency module according to claim 6 ,
wherein the opposite surface of the sealing resin layer further has a vent groove, and the vent groove extends from the recessed portion to an end portion of the sealing resin layer as viewed in the direction perpendicular to the one main surface of the circuit board.
10. The high-frequency module according to claim 1 ,
wherein the recessed portion is comprised of a plurality of small depressions provided at a position overlapping the first component as viewed in the direction perpendicular to the one main surface of the circuit board.
11. The high-frequency module according to claim 1 ,
wherein the recessed portion has a shape substantially the same as a shape of the first component as viewed in the direction perpendicular to the one main surface of the circuit board.
12. The high-frequency module according to claim 1 ,
wherein the opposite surface of the sealing resin layer further has a vent groove, and the vent groove extends from the recessed portion to an end portion of the sealing resin layer as viewed in the direction perpendicular to the one main surface of the circuit board.
13. The high-frequency module according to claim 1 ,
wherein the second component has a height greater than a height of the first component from the one main surface of the circuit board and is exposed at the opposite surface of the sealing resin layer.
14. The high-frequency module according to claim 1 ,
wherein a shield film configured to cover at least the opposite surface and the side surfaces of the sealing resin layer is provided.
15. A high-frequency module comprising:
a circuit board;
a first component and a second component, the first component and the second component being mounted on one main surface of the circuit board;
a sealing resin layer having a contact surface in contact with the one main surface of the circuit board, an opposite surface opposing to the contact surface, and side surfaces connecting edges of the contact surface to respective edges of the opposite surface, the sealing resin layer including a hollow portion, the sealing resin layer being configured to seal the first component and the second component; and a heat dissipation member disposed above the opposite surface of the sealing resin layer,
wherein the hollow portion has a height from a surface of the first component on an opposite side to a mounting surface of the first component to a position lower than the opposite surface of the sealing resin layer and disposed at a position overlapping the first component as viewed in a direction perpendicular to the one main surface of the circuit board.
16. The high-frequency module according to claim 15 ,
wherein the hollow portion has a shape substantially the same as a shape of the first component as viewed in the direction perpendicular to the one main surface of the circuit board.
17. A high-frequency module comprising:
a circuit board;
a first component and a second component, the first component and the second component being mounted on one main surface of the circuit board;
a sealing resin layer having a contact surface in contact with the one main surface of the circuit board, an opposite surface opposing to the contact surface, and side surfaces connecting edges of the contact surface to respective edges of the opposite surface, the sealing resin layer being configured to seal the first component and the second component; and
a heat dissipation member having a facing surface facing the sealing resin layer, the facing surface having a recessed portion at least partly defining a hollow portion,
wherein the hollow portion is disposed at a position overlapping the first component as viewed in a direction perpendicular to the one main surface of the circuit board.
18. The high-frequency module according to claim 17 ,
wherein the recessed portion has a shape substantially the same as a shape of the first component as viewed in the direction perpendicular to the one main surface of the circuit board.
19. The high-frequency module according to claim 17 ,
wherein a heat dissipation fin is provided on a surface of the heat dissipation member opposite to the facing surface of the heat dissipation member and has a recessed portion that is opposite to the recessed portion of the facing surface and that at least partly defines the hollow portion.
20. The high-frequency module according to claim 17 , further comprising:
a groove provided in the opposite surface of the sealing resin layer,
wherein the groove surrounds the first component as viewed in the direction perpendicular to the one main surface of the circuit board.