IP Library › Granted Patent US 11,309,257
Granted Patent B2
US 11,309,257 · App. 16/773,112 · Granted Apr 19, 2022

Semiconductor apparatus for detecting or oscillating electromagnetic waves

Inventors: Toshifumi Yoshioka (Hiratsuka, JP); Noriyuki Kaifu (Atsugi, JP)
Assignee: Canon Kabushiki Kaisha
H01L23/552G01R31/001H05K9/0081
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Quick Facts
Patent No.
US 11,309,257
App. No.
16/773,112
Granted
Apr 19, 2022
Kind
B2
Abstract

A semiconductor apparatus comprising: an element substrate including a plurality of semiconductor devices which detect or oscillate terahertz waves; and an electromagnetic shielding in a mesh form disposed in front of a surface detecting or oscillating the terahertz waves in the element substrate and formed of a conductive material, wherein a line width of the electromagnetic shielding is not more than a wavelength of the terahertz waves.

Claims (27)

1. A semiconductor apparatus comprising:

an element substrate including a plurality of semiconductor devices which detect or oscillate terahertz waves; and

an electromagnetic shielding in a mesh form disposed in front of a surface detecting or oscillating the terahertz waves in the element substrate and formed of a conductive material, wherein

a line width of the electromagnetic shielding is not more than a wavelength of the terahertz waves, and

a width of each opening portion of the electromagnetic shielding is at least the wavelength of the terahertz waves.

2. The semiconductor apparatus according to claim 1 , wherein the width of each opening portion of the electromagnetic shielding is not more than ½ of a wavelength of millimeter waves.

3. The semiconductor apparatus according to claim 1 , wherein the thickness of the electromagnetic shielding is not more than the wavelength of the terahertz waves.

4. The semiconductor apparatus according to claim 1 , further comprising a circuit board including a circuit which reads signals output from the plurality of semiconductor devices or drives the plurality of semiconductor devices, wherein

the plurality of semiconductor devices are two-dimensionally arranged on the element substrate, and the circuit board and the element substrate are integrally disposed.

5. The semiconductor apparatus according to claim 1 , wherein a lens which controls an optical path of the terahertz waves is disposed in front of the surface detecting or oscillating the terahertz waves in the element substrate.

6. A semiconductor apparatus comprising:

an element substrate including a plurality of semiconductor devices which detect or oscillate predetermined electromagnetic waves; and

an electromagnetic shielding in a mesh form disposed in front of a surface detecting or oscillating the predetermined electromagnetic waves in the element substrate and formed of a conductive material, wherein

a wavelength of the predetermined electromagnetic waves is in a range of 0.1 mm to 1 mm,

a line width of the electromagnetic shielding is not more than 1 mm, and

a width of each opening portion of the electromagnetic shielding is at least the wavelength of the predetermined electromagnetic waves.

7. The semiconductor apparatus according to claim 6 , wherein the width of each opening portion of the electromagnetic shielding is not more than 25 mm.

8. The semiconductor apparatus according to claim 7 , wherein the width of each opening portion of the electromagnetic shielding is not more than 1.5 mm.

9. The semiconductor apparatus according to claim 6 , wherein the thickness of the electromagnetic shielding is not more than 1 mm.

10. An imaging system comprising:

the semiconductor apparatus according to claim 1 ; and

a signal processor which processes signals output from the semiconductor apparatus.

11. A moving object comprising:

the semiconductor apparatus according to claim 1 ;

a moving device;

a processing device which acquires information from signals output from the semiconductor apparatus; and

a control device which controls the moving device on the basis of the information.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 13, 2020
From: YOSHIOKA, TOSHIFUMI; KAIFU, NORIYUKI
To: CANON KABUSHIKI KAISHA
Reel/Frame 052383/0403 →
Priority Claims (1)
JP JP2019-011827 · Jan 28, 2019 · national
Continuity (1)
Related Publication 20200243458A1 · Jul 30, 2020