IP Library › Granted Patent US 11,313,123

Granted Patent B2

US 11,313,123 · App. 15/183,424 · Granted Apr 26, 2022

Method of forming a building panel or surface element and such a building panel and surface element

Inventors: Darko Pervan (Viken, SE); Peter Wingårdh (Viken, SE); Göran Ziegler (Viken, SE); Thomas Meijer (Viken, SE)

Assignee: VALINGE INNOVATION AB

E04C2/26 B32B5/02 B32B5/028 B32B13/02 B32B13/06 B32B13/12 B32B13/14 B32B15/02 B32B15/08 B32B21/04 B32B27/06 B32B27/12 B32B27/20 B32B33/00 B32B38/08 B32B37/06 B32B37/10 B32B37/1027 B32B37/24 B32B2260/021 B32B2260/026 B32B2260/046 B32B2262/02 B32B2262/062 B32B2262/067 B32B2305/38 B32B2307/538 B32B2307/554 B32B2307/724 B32B2311/00 B32B2375/00 B32B2419/04 B32B2607/00 E04F15/102 E04F15/107

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Quick Facts

Patent No.: US 11,313,123
App. No.: 15/183,424
Granted: Apr 26, 2022
Kind: B2

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Abstract

A method of forming a building panel or a surface element, including providing a substrate, applying a sub-layer on the substrate, applying a mesh structure on the sub-layer, and applying heat and pressure to the mesh structure such that the sub-layer at least partially fills meshes of the mesh structure. Also, to such a building panel and a surface element.

Claims (34)

1. A method of forming a building panel or a surface element, comprising

providing a substrate,

applying a sub-layer on a first surface of the substrate,

then applying a mesh structure on the sub-layer, which has been applied on the first surface of the substrate, wherein a vapour permeability of the mesh structure exceeds 100 SI Perm, and

applying heat and pressure to said mesh structure with a pressing process, wherein the pressing process comprises a press plate that presses the mesh structure, sublayer and substrate together such that portions of the sub-layer permeate through meshes of the said mesh structure.

2. The method according to claim 1 , wherein the mesh structure has a substantially uniform vapour permeability in a plane parallel to the first surface of the substrate.

3. The method according to claim 1 , wherein the vapour permeability of the mesh structure exceeds 200 SI Perm.

4. The method according to claim 1 , wherein applying heat and pressure comprises curing the sub-layer and thereby fixing the mesh structure to the sub-layer.

5. The method according to claim 1 , wherein the mesh structure is at least partially visible after heat and pressure have been applied.

6. The method according to claim 1 , wherein the sub-layer at least partially encapsulates the mesh structure.

7. The method according to claim 1 , wherein a material forming the mesh structure facing the sub-layer has a surface roughness exceeding Ra 6.3.

8. The method according to claim 1 , wherein the sub-layer comprises a thermosetting binder.

9. The method according to claim 1 , wherein the mesh structure is formed of a metal material.

10. The method according to claim 1 , wherein the mesh structure is formed of a plastic material.

11. The method according to claim 1 , wherein the mesh structure is formed of a perforated foil.

12. The method according to claim 1 , wherein the mesh structure is formed of a textile material.

13. The method according to claim 12 , wherein the textile material comprises weaved cotton fibres.

14. The method according to claim 12 , wherein a mesh size and mesh width of the textile material exceeds 0.1 mm.

15. The method according to claim 12 , wherein the textile material is bonded to the sub-layer by a cured thermosetting binder when applying heat and pressure.

16. The method according to claim 12 , wherein the textile material is chemically impregnated by the sub-layer by a cured thermosetting binder when applying heat and pressure.

17. The method according to claim 12 , wherein a melamine formaldehyde resin powder is applied on the textile material prior to applying heat and pressure.

18. The method according to claim 12 , wherein the textile material is impregnated with a thermosetting binder prior to applying heat and pressure.

19. The method according to claim 1 , wherein the substrate comprises a wood-based board.

20. The method according to claim 1 , wherein a temperature of 150° C.-180° C. and a pressure of 20-60 bar is applied on the mesh structure when applying heat and pressure.

21. The method according to claim 1 , wherein the sublayer is applied in liquid form.

22. A method of forming a building panel or a surface element, comprising

providing a substrate,

applying a sub-layer on a first surface of the substrate,

then applying a mesh structure on the sub-layer, which has been applied on the first surface of the substrate, wherein a vapour permeability of the mesh structure exceeds 100 SI Perm, and

23. The method according to claim 1 , wherein the mesh structure is bonded to the sub-layer by a cured thermosetting binder when applying heat and pressure.

24. The method according to claim 22 , wherein the mesh structure is bonded to the sub-layer by a cured thermosetting binder when applying heat and pressure.

25. The method of claim 1 , wherein the press plate is at a temperature of 140° C. to 160° C.

26. The method of claim 22 , wherein the press plate is at a temperature of 140° C. to 160° C.

Assignments (1)

ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 12, 2016

From: PERVAN, DARKO; WINGARDH, PETER; ZIEGLER, GORAN; MEIJER, THOMAS

To: VALINGE INNOVATION AB

Reel/Frame 040333/0096 →

Priority Claims (1)

SE 1550827-8 · Jun 16, 2015 · national

Continuity (1)

Related Publication 20160369507A1 · Dec 22, 2016

Cited By (6)

US 12,330,445 US 12,350,917 US 12,454,123 US 12,532,987 US 12,577,778 US 12,623,372