Dual redistribution layer structure
A method for fabricating a dual redistribution layer (RDL) interposer structure is provided. The method includes etching a semiconductor substrate to expose natural crystallographic planes to form trenches. The method also includes depositing conductive material within the trenches of the etched semiconductor substrate to form vias for an interposer structure. The method includes placing back end of line (BEOL) inter-chip wiring on a top side of the interposer structure using a first RDL. The method includes exposing the vias on a back side of the interposer structure. The method further includes forming power RDLs on a back side of the interposer structure using conductive lines in a dielectric layer.
1. A device including a dual redistribution layer (RDL) interposer structure for power-carrying and inter-chip transmission, comprising:
a silicon interposer structure with vias having sidewalls formed along natural crystallographic planes wherein the vias have a diameter of less than 1 micron;
a back end of line (BEOL) fine inter-chip wiring with interconnects formed in an inorganic dielectric layer, configured for communication on a top side of the interposer structure, wherein the back end of line (BEOL) fine inter-chip wiring is on a first side of the interposer structure;
at least one power RDL on a back side of the interposer structure including conductive lines in a dielectric layer, wherein the at least one power RDL is on a second side of the interposer structure opposite the first side;
at least one memory chip attached to the back end of line (BEOL) fine inter-chip wiring; and
at least one accelerator chip attached to the back end of line (BEOL) fine interchip wiring, wherein the dual redistribution layer (RDL) interposer structure is configured to provide power to the at least one memory chip and the at least one accelerator chip through the silicon interposer structure, and the at least one memory chip is electrically connected to the at least one accelerator chip through the back end of line (BEOL) fine inter-chip wiring.
2. The device of claim 1 ,
wherein the at least one memory chip includes a plurality of memory chips that forms a three dimensional stacked dynamic random access memory (DRAM) component.
3. The device of claim 1 , further comprising:
multiple inorganic RDL on the top side of the interposer structure for inter-chip communication.
4. The device of claim 1 , wherein the wet-etched vias comprise tetrahedral vias.
5. The device of claim 1 , wherein a thickness of the conductive material is of the order of sub-microns.