Semiconductor structure with buried power line and buried signal line and method for manufacturing the same
The present disclosure provides a semiconductor structure. The semiconductor structure comprises a substrate having a first top surface. An active region is surrounded by an isolation region in the substrate. A buried power line and a buried signal line are disposed within the substrate and in the active region. A first circuit layer is disposed on the first top surface of the substrate to cover the buried power line and the buried signal line. A second circuit layer is disposed on the first top surface of the substrate and separated from the first circuit layer. A cell capacitor is disposed on and electrically coupled to the first circuit layer.
1. A semiconductor structure, comprising:
a substrate having a first top surface;
an active region surrounded by an isolation region in the substrate;
a buried power line and a buried signal line disposed within the substrate and in the active region;
a first circuit layer disposed on the first top surface of the substrate and covering the buried power line and the buried signal line;
a second circuit layer disposed on the first top surface of the substrate and separated from the first circuit layer; and
a cell capacitor disposed on and electrically coupled to the first circuit layer.
2. The semiconductor structure according to claim 1 , wherein the buried power line is disposed at a central portion of the active region, and the buried signal line is disposed at a peripheral portion of the active region.
3. The semiconductor structure according to claim 1 , wherein the buried power line is distal to the isolation region, and the buried signal line is proximal to the isolation region.
4. The semiconductor structure according to claim 1 , further comprising a word line structure disposed over the cell capacitor.
5. The semiconductor structure according to claim 4 , further comprising an interlayer dielectric encapsulating the cell capacitor and the word line structure.
6. The semiconductor structure according to claim 5 , further comprising a second conductive material within a through hole penetrating the interlayer dielectric.
7. The semiconductor structure according to claim 5 , further comprising a bit line structure disposed on the interlayer dielectric and over the word line structure.
8. The semiconductor structure according to claim 5 , wherein the buried power line, the buried signal line and the word line structure extend along a first direction, and the bit line structure extends along a second direction substantially orthogonal to the first direction.
9. The semiconductor structure according to claim 8 , wherein the second conductive material in the through hole extends along a third direction substantially orthogonal to the first direction and the second direction.
10. The semiconductor structure according to claim 8 , wherein the buried power line and the buried signal line are arranged along the second direction.
11. The semiconductor structure according to claim 10 , wherein the word line structure and the bit line structure form a memory array, wherein the memory array has a layout of four square feature size (4F 2 ).
12. The semiconductor structure according to claim 10 , wherein the cell capacitor is interposed between the first circuit layer and the word line structure, and the word line structure is interposed between the cell capacitor and the bit line structure.