IP Library › Granted Patent US 11,317,513
Granted Patent B2
US 11,317,513 · App. 17/113,414 · Granted Apr 26, 2022

Optical module

Inventors: Daisuke Noguchi (Tachikawa, JP); Hiroshi Yamamoto (Inagi, JP)
Assignee: CIG PHOTONICS JAPAN LIMITED
H05K1/147H05K1/113H05K1/118H05K1/189H05K3/28H05K2201/10121
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Quick Facts
Patent No.
US 11,317,513
App. No.
17/113,414
Granted
Apr 26, 2022
Kind
B2
Abstract

An optical module includes a photoelectric device and a flexible printed circuit board. The flexible printed circuit board includes an insulating substrate with a first surface and a second surface, a first wiring pattern on the first surface, and a second wiring pattern on the second surface. The first wiring pattern includes a signal line with a signal terminal portion at a tip and a signal-line portion narrower than the signal terminal portion, the first wiring pattern including a pair of ground pads at positions sandwiching the signal-line portion, at least part of the pair of ground pads avoiding being adjacent to the signal terminal portion. The second wiring pattern includes a ground plane overlapping with the signal-line portion and being connected to the pair of ground pads, the second wiring pattern including a signal pad connected to the signal terminal portion.

Claims (36)

1. An optical module comprising:

a photoelectric device adapted to convert an optical signal and an electrical signal at least from one to another; and

a flexible printed circuit board electrically connected to the photoelectric device,

wherein

the flexible printed circuit board includes an insulating substrate with a first surface and a second surface, a first wiring pattern on the first surface, and a second wiring pattern on the second surface,

the first wiring pattern includes a signal line with a signal terminal portion at a tip and a signal-line portion narrower than the signal terminal portion, the first wiring pattern including a pair of ground pads at positions sandwiching the signal-line portion, at least part of the pair of ground pads avoiding being adjacent to the signal terminal portion, at least part of the signal terminal portion avoiding being adjacent to either of the pair of ground pads in an arranging direction of the signal terminal portion and the pair of ground pads, and

the second wiring pattern includes a ground plane overlapping with the signal-line portion and being connected to the pair of ground pads, the second wiring pattern including a signal pad connected to the signal terminal portion.

2. The optical module according to claim 1 , wherein

the insulating substrate, in a planar shape, has a first side extending in a first direction, and a pair of second sides extending from respective both ends of the first side and extending in a second direction intersecting with the first direction,

the signal terminal portion is at an end portion including the first side,

the pair of ground pads are at respective end portions including the pair of second sides.

3. The optical module according to claim 2 , wherein

the signal terminal portion has an edge that coincides with the first side, and

the pair of ground pads have edges that coincide with the respective pair of second sides.

4. The optical module according to claim 2 , wherein

the insulating substrate, in the planar shape, has a main body and at least one projection from the main body, and

the at least one projection has an outer shape composed of the first side and the pair of second sides.

5. The optical module according to claim 4 , wherein the at least one projection includes plural projections, and

the insulating substrate has a slit between each adjacent pair of the projections.

6. The optical module according to claim 1 , further comprising a printed circuit board with a circuit pattern connected to the ground plane and the signal pad with a conductive connecting material.

7. An optical module comprising:

a photoelectric device adapted to convert an optical signal and an electrical signal at least from one to another; and

a flexible printed circuit board electrically connected to the photoelectric device,

wherein

the flexible printed circuit board includes an insulating substrate with a first surface and a second surface, a first wiring pattern on the first surface, and a second wiring pattern on the second surface,

the first wiring pattern includes a signal line with a signal terminal portion at a tip and a signal-line portion narrower than the signal terminal portion, the first wiring pattern including a pair of ground pads at positions sandwiching the signal-line portion, at least part of the pair of ground pads avoiding being adjacent to the signal terminal portion,

the second wiring pattern includes a ground plane overlapping with the signal-line portion and being connected to the pair of ground pads, the second wiring pattern including a signal pad connected to the signal terminal portion,

the insulating substrate, in a planar shape, has a first side extending in a first direction, and a pair of second sides extending from respective both ends of the first side and extending in a second direction intersecting with the first direction,

the signal terminal portion is at an end portion including the first side,

the pair of ground pads are at respective end portions including the pair of second sides,

the insulating substrate, in a planar shape, has a main body and at least one projection from the main body,

the at least one projection has an outer shape composed of the first side and the pair of second sides,

the first wiring pattern further includes a power supply line, and

the second wiring pattern further includes a power supply pad connected to the power supply line.

8. The optical module according to claim 7 , wherein the power supply line is positioned without being adjacent to the pair of ground pads in the first direction.

9. The optical module according to claim 8 , wherein the power supply line is on the main body without being on the at least one projection.

Assignments (2)
CHANGE OF ADDRESS Recorded Jul 19, 2024
From: CIG PHOTONICS JAPAN LIMITED
To: CIG PHOTONICS JAPAN LIMITED
Reel/Frame 068436/0287 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 7, 2020
From: NOGUCHI, DAISUKE; YAMAMOTO, HIROSHI
To: CIG PHOTONICS JAPAN LIMITED
Reel/Frame 054563/0573 →
Priority Claims (1)
JP JP2019-230383 · Dec 20, 2019 · national
Continuity (1)
Related Publication 20210195746A1 · Jun 24, 2021