Mechanical failure monitoring, detection, and classification in electronic assemblies
Disclosed herein are systems and methods for mechanical failure monitoring, detection, and classification in electronic assemblies. In some embodiments, a mechanical monitoring apparatus may include: a fixture to receive an electronic assembly; an acoustic sensor; and a computing device communicatively coupled to the acoustic sensor, wherein the acoustic sensor is to detect an acoustic emission waveform generated by a mechanical failure of the electronic assembly during testing.
1. A mechanical monitoring apparatus, comprising:
an actuator configured to apply force on an electronic assembly under test;
a fixture to receive the electronic assembly;
an acoustic sensor; and
a computing device communicatively coupled to the acoustic sensor, wherein:
the electronic assembly comprises:
an integrated circuit (IC) package having a die therein,
a thermal management device attached to the IC package on one side and a circuit board attached to the IC package on an opposing side,
the thermal management device includes leaf springs securable to the circuit board with screws at three of four locations,
the actuator applies force on a fourth one of the four locations during testing, and
the acoustic sensor is configured to detect an acoustic emission waveform generated by a mechanical failure of the electronic assembly during testing.
2. The mechanical monitoring apparatus of claim 1 , wherein the fixture includes an indenter.
3. The mechanical monitoring apparatus of claim 1 , wherein the fixture includes a pick-and-place machine.
4. The mechanical monitoring apparatus of claim 1 , wherein the fixture includes a thermal head.
5. The mechanical monitoring apparatus of claim 1 , wherein the acoustic sensor is coupled to the fixture.
6. The mechanical monitoring apparatus of claim 1 , wherein the acoustic sensor includes a piezoelectric crystal.
7. The mechanical monitoring apparatus of claim 1 , wherein the electronic assembly further includes a circuit board.
8. The mechanical monitoring apparatus of claim 1 , wherein the mechanical failure is a crack.
9. The mechanical monitoring apparatus of claim 8 , wherein the computing device is to estimate a crack type of the crack based at least in part on the acoustic emission waveform.
10. The mechanical monitoring apparatus of claim 8 , wherein the computing device is to estimate a crack length of the crack based at least in part on the acoustic emission waveform.
11. The mechanical monitoring apparatus of claim 1 , wherein the acoustic sensor is one of a plurality of acoustic sensors included in the mechanical monitoring apparatus, and individual ones of the acoustic sensors are coupled to the computing device.
12. The mechanical monitoring apparatus of claim 11 , wherein the computing device is to estimate a failure onset location of the mechanical failure based at least in part on acoustic emission waveforms generated by multiple ones of the acoustic sensors.
13. One or more non-transitory computer readable media having instructions thereon that, upon execution by one or more processing devices of a mechanical monitoring apparatus, cause the mechanical monitoring apparatus to:
receive data representative of acoustic emission waveforms generated by mechanical failures of integrated circuit (IC) packages having one or more dies therein, wherein:
a thermal management device is attached to at least one IC package on one side and a circuit board is attached to the at least one IC package on an opposing side,
the thermal management device includes leaf springs securable to the circuit board with screws at three of four locations, and
the mechanical monitoring apparatus is coupled to an actuator that applies force on a fourth one of the four locations during testing;
receive data representative of physical features of the mechanical failures from the testing;
generate physical feature estimation criteria based on the data representative of the acoustic emission waveforms and the data representative of the physical features;
receive additional data representative of an additional acoustic emission waveform generated by an additional mechanical failure of the at least one IC package; and
generate an estimate of a physical feature of the additional mechanical failure based at least in part on the additional data and the physical feature estimation criteria.
14. The one or more non-transitory computer readable media of claim 13 , wherein generate the physical feature estimation criteria includes perform a machine learning technique on the data representative of the acoustic emission waveforms and the data representative of physical features.
15. The one or more non-transitory computer readable media of claim 14 , wherein the machine learning technique includes a regression analysis or a clustering analysis.
16. A method of testing an electronic assembly, comprising:
receiving data from an acoustic sensor in acoustic communication with the electronic assembly during application of mechanical stress to the electronic assembly, wherein:
the electronic assembly comprises:
an IC package having a die therein; and
a thermal management device attached to the IC package on one side and a circuit board attached to the IC package on an opposing side, the thermal management device including leaf springs securable to the circuit board with screws at three of four locations, and
the mechanical stress is applied on a fourth one of the four locations; and
identifying a characteristic of a mechanical failure of the electronic assembly in the data received from the acoustic sensor.
17. The method of claim 16 , wherein the acoustic sensor is one of a plurality of acoustic sensors in acoustic communication with the electronic assembly during application of mechanical stress to the electronic assembly, and identifying the characteristic of the mechanical failure includes estimating a failure onset location of the mechanical failure based on the data generated by the plurality of acoustic sensors.
18. The method of claim 16 , further comprising:
causing the application of mechanical stress to stop upon detection of the characteristic of the mechanical failure.
19. One or more non-transitory computer readable media having instructions thereon that, upon execution by one or more processing devices of a mechanical monitoring apparatus, cause the mechanical monitoring apparatus to:
receive data representative of an acoustic emission waveform generated during a test by a mechanical failure of an electronic assembly having an IC package with a die therein, wherein the electronic assembly further comprises a thermal management device attached to the IC package on one side and a circuit board attached to the IC package on an opposing side,
the thermal management device includes leaf springs securable to the circuit board with screws at three of four locations,
the monitoring apparatus is coupled to an actuator that applies force on a fourth one of the four locations during the test; and
generate an estimate of a physical feature of the mechanical failure based at least in part on the data, wherein the physical feature includes a crack type, crack length, or failure onset location.
20. The one or more non-transitory computer readable media of claim 19 , wherein the physical feature includes a crack type.
21. The one or more non-transitory computer readable media of claim 20 , wherein the data includes a duration, a rise time, and an absolute energy.
22. The one or more non-transitory computer readable media of claim 19 , wherein the physical feature includes a crack length.
23. The one or more non-transitory computer readable media of claim 22 , wherein the data includes a duration, a rise time, and an absolute energy.
24. The one or more non-transitory computer readable media of claim 23 , wherein the data further includes an amplitude and counts.
25. The one or more non-transitory computer readable media of claim 19 , wherein the physical feature includes a failure onset location.