Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense
A device package and a method of forming a device package are described. The device package has dies disposed on a substrate, and one or more layers with a high thermal conductivity, referred to as the highly-conductive (HC) intermediate layers, disposed on the dies on the substrate. The device package further includes a lid with legs on an outer periphery of the lid, a top surface, and a bottom surface. The legs of the lid are attached to the substrate with a sealant. The bottom surface of the lid is disposed over the one or more HC intermediate layers and the one or more dies on the substrate. The device package may also include thermal interface materials (TIMs) disposed on the HC intermediate layers. The TIMs may be disposed between the bottom surface of the lid and one or more top surfaces of the HC intermediate layers.
1. A device package, comprising:
one or more dies disposed on a substrate;
one or more highly-conductive (HC) intermediate layers disposed on the one or more dies, wherein the one or more HC intermediate layers comprises a first HC layer laterally adjacent to a second HC layer on one of the one or more dies, the second HC layer having a different composition than the first HC layer; and
a lid with one or more legs on an outer periphery of the lid, a top surface, and a bottom surface that is opposite from the top surface, wherein the one or more legs of the lid are attached to the substrate with a sealant, and wherein the bottom surface of the lid is disposed over the one or more HC intermediate layers and the one or more dies on the substrate.
2. The device package of claim 1 , further comprising one or more thermal interface materials (TIMs) disposed on the one or more HC intermediate layers, wherein the one or more TIMs are disposed between the bottom surface of the lid and one or more top surfaces of the one or more HC intermediate layers.
3. The device package of claim 1 , wherein the one or more HC intermediate layers are directly disposed on the top surface of the one or more dies without an adhesive layer.
4. The device package of claim 1 , wherein the one or more HC intermediate layers include one or more different shapes, including at least one of a ring, a picture frame, a patch, a rectangle, a strip, or an oval.
5. The device package of claim 1 , wherein the first HC intermediate layer surrounds the second HC intermediate layer.
6. The device package of claim 1 , wherein the lid is a flat lid, and wherein the one or more legs of the lid are one or more HC legs disposed on the outer periphery of the flat lid without an adhesive layer.
7. The device package of claim 1 , wherein the lid is an integrated heat spreader (IHS) lid.
8. The device package of claim 1 , wherein the one or more HC intermediate layers include one or more materials, and wherein the one or more materials include at least one or more of metals, metal alloys, metal-ceramic composites, polymers, polymer-metal composites, polymer-ceramic composites, epoxy, or ceramics.
9. The device package of claim 3 , wherein the one or more HC intermediate layers are disposed on the top surface of the one or more dies using a cold spray process.
10. The device package of claim 1 , wherein the one or more HC intermediate layers are disposed on the top surface of the one or more dies at a wafer level, a die level, or a panel level, and wherein the substrate is a printed circuit board.
11. The device package of claim 1 , further comprising one or more electrical components disposed on one or more exposed regions on the substrate, wherein the one or more electrical components are die side capacitors.
12. A method of forming a device package, comprising:
disposing one or more dies on a substrate;
disposing one or more highly-conductive (HC) intermediate layers on the one or more dies, wherein the one or more HC intermediate layers comprises a first HC layer laterally adjacent to a second HC layer on one of the one or more dies, the second HC layer having a different composition than the first HC layer; and
disposing a lid with one or more legs on an outer periphery of the lid, a top surface, and a bottom surface that is opposite from the top surface on the substrate, wherein the one or more legs of the lid are attached to the substrate with a sealant, and wherein the bottom surface of the lid is disposed over the one or more HC intermediate layers and the one or more dies on the substrate.
13. The method of claim 12 , further comprising one or more thermal interface materials (TIMs) disposed on the one or more HC intermediate layers, wherein the one or more TIMs are disposed between the bottom surface of the lid and one or more top surfaces of the one or more HC intermediate layers.
14. The method of claim 12 , wherein the one or more HC intermediate layers are directly disposed on the top surface of the one or more dies without an adhesive layer, and wherein the one or more HC intermediate layers include one or more different shapes, including at least one of a ring, a picture frame, a patch, a rectangle, a strip, or an oval.
15. The method of claim 12 , wherein the first HC intermediate layer surrounds the second HC intermediate layer.
16. The method of claim 12 , wherein the lid is a flat lid, and wherein the one or more legs of the lid are one or more HC legs disposed on the outer periphery of the flat lid without an adhesive layer, and wherein the lid is an integrated heat spreader (IHS) lid.
17. The method of claim 12 , wherein the one or more HC intermediate layers include one or more materials, wherein the one or more materials include at least one or more of metals, metal alloys, metal-ceramic composites, polymers, polymer-metal composites, polymer-ceramic composites, epoxy, ceramics, wherein the one or more HC intermediate layers are disposed on the top surface of the one or more dies using a cold spray process, wherein the one or more HC intermediate layers are disposed on the top surface of the one or more dies at a wafer level, a die level, or a panel level, and wherein the substrate is a printed circuit board.
18. The method of claim 12 , further comprising one or more electrical components disposed on one or more exposed regions on the substrate, wherein the one or more electrical components are die side capacitors.
19. A device package, comprising:
one or more dies disposed on a substrate;
one or more highly-conductive (HC) intermediate layers disposed on the one or more dies, wherein the one or more HC intermediate layers are directly disposed on the top surface of the one or more dies without an adhesive layer, and wherein the one or more HC intermediate layers comprises a first HC layer laterally adjacent to a second HC layer on one of the one or more dies, the second HC layer having a different composition than the first HC layer;
a lid with one or more legs on an outer periphery of the lid, a top surface, and a bottom surface that is opposite from the top surface, wherein the one or more legs of the lid are attached to the substrate with a sealant, and wherein the bottom surface of the lid is disposed over the one or more HC intermediate layers and the one or more dies on the substrate; and
one or more thermal interface materials (TIMs) disposed on the one or more HC intermediate layers, wherein the one or more TIMs are disposed between the bottom surface of the lid and one or more top surfaces of the one or more HC intermediate layers.
20. The device package of claim 19 , wherein the one or more HC intermediate layers include one or more different shapes, including at least one of a ring, a picture frame, a patch, a rectangle, a strip, or an oval.
21. The device package of claim 19 , wherein the first HC intermediate layer surrounds the second HC intermediate layer.
22. The device package of claim 19 , wherein the lid is a flat lid, and wherein the one or more legs of the lid are one or more HC legs disposed on the outer periphery of the flat lid without an adhesive layer, and wherein the lid is an integrated heat spreader (IHS) lid.
23. The device package of claim 19 , wherein the one or more HC intermediate layers include one or more materials, and wherein the one or more materials include at least one or more of metals, metal alloys, metal-ceramic composites, polymers, polymer-metal composites, polymer-ceramic composites, epoxy, or ceramics.
24. The device package of claim 20 , wherein the one or more HC intermediate layers are disposed on the top surface of the one or more dies using a cold spray process, and wherein the one or more HC intermediate layers are disposed on the top surface of the one or more dies at a wafer level, a die level, or a panel level, and wherein the substrate is a printed circuit board.
25. The device package of claim 19 , further comprising one or more electrical components disposed on one or more exposed regions on the substrate, wherein the one or more electrical components are die side capacitors.