IP Library Granted Patent US 11,330,743
Granted Patent B2
US 11,330,743 · App. 16/444,456 · Granted May 10, 2022

Electronic device including structure for protecting display driver from static electricity

Inventors: Hyunjun Park (Suwon-si, KR); Seonghoon Kim (Suwon-si, KR); Hongkook Lee (Suwon-si, KR); Donghwy Kim (Suwon-si, KR); Jongkon Bae (Suwon-si, KR); Dongkyoon Han (Suwon-si, KR)
Assignee: Samsung Electronics Co., Ltd.
H05K9/0079G09G3/20H05K1/18H05K5/0017G09G2330/04H05K2201/10128
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Quick Facts
Patent No.
US 11,330,743
App. No.
16/444,456
Granted
May 10, 2022
Kind
B2
Abstract

An electronic device is provided. The electronic device includes a display panel, a metal layer disposed on a surface of the display panel, a display driver integrated circuit (DDI) disposed on a surface of the metal layer, a bending part connecting the display panel to the DDI, and a cover member connected to the metal layer while covering the DDI. The cover member includes at least one conductive layer. The metal layer and the cover member form a space in which the DDI is disposed, and the bending part is connected to the DDI via a connection part in the space.

Claims (64)

1. An electronic device comprising:

a display panel;

a metal layer disposed on a surface of the display panel;

a display driver integrated circuit (DDI) disposed on a surface of the metal layer;

a bending part connecting the display panel to the DDI; and

a cover member connected to the metal layer while covering the DDI,

wherein the cover member comprises at least one conductive layer,

wherein the metal layer and the cover member form a space in which the DDI is disposed, and

wherein the bending part is connected to the DDI via a connection part in the space.

2. The electronic device of claim 1 ,

wherein the cover member and the metal layer are in contact with each other at at least one point,

wherein an electrostatic path (EEP) via the at least one point is formed, and

wherein the EEP connects the cover member to the metal layer.

3. The electronic device of claim 1 , wherein the cover member further comprises:

a first conductive layer extending from a first point of the metal layer to a second point of the metal layer and covering the DDI; and

a second conductive layer disposed at the first point and the second point and connecting the first conductive layer to the metal layer.

4. The electronic device of claim 3 ,

wherein the cover member further comprises a third conductive layer interposed between the first conductive layer and the second conductive layer, and

wherein the cover member substantially shields the DDI.

5. The electronic device of claim 3 , wherein the cover member further comprises:

an adhesive layer disposed on the DDI; and

an insulating layer interposed between the first conductive layer and the adhesive layer.

6. The electronic device of claim 3 , wherein the second conductive layer is spaced apart from the DDI and the bending part.

7. The electronic device of claim 3 , wherein a first electrostatic path (EEP) facing toward the metal layer via the first conductive layer and the second conductive layer at the first point and a second EEP facing toward the metal layer via the first conductive layer and the second conductive layer at the second point are formed.

8. The electronic device of claim 1 ,

wherein a substrate layer is connected to one side of the bending part, and

wherein the substrate layer is spaced apart from the cover member.

9. The electronic device of claim 1 ,

wherein the bending part extends from the display panel and at least part of an area of the bending part is bent, and

wherein the bending part is disposed in at least part of an area of an upper surface or a lower surface of the metal layer while surrounding one side of the metal layer.

10. An electronic device comprising:

a display panel;

a metal layer disposed on a surface of the display panel and electrically connected to a ground terminal of the electronic device; and

one or more wires electrically connected to the display panel,

wherein the one or more wires comprise:

a substrate layer electrically connected to a display driver integrated circuit (DDI) operating the display panel, and

a conductive layer disposed on at least part of the substrate layer and at least part of the metal layer while covering the DDI,

wherein the conductive layer is electrically connected to the at least part of the metal layer.

11. The electronic device of claim 10 , wherein the conductive layer extends from at least one point spaced from the DDI and is electrically connected to the metal layer at the at least one point.

12. The electronic device of claim 10 , wherein the substrate layer is electrically connected to the display panel.

13. The electronic device of claim 10 , wherein the conductive layer extends toward the substrate layer from at least one edge spaced from the DDI.

14. The electronic device of claim 10 , further comprising:

an adhesive layer adhering the conductive layer to the DDI; and

an insulating layer interposed between the conductive layer and the adhesive layer.

15. The electronic device of claim 12 , wherein the conductive layer blocks external noise applied to the DDI or noise generated from the DDI.

16. An electronic device comprising:

a display panel;

a metal layer disposed on a surface of the display panel;

a substrate layer disposed on a surface of the metal layer and electrically connected to the display panel;

a bending part extending from one side of the display panel, surrounding one side of the metal layer, and being connected to the substrate layer via a first portion of the surface of the metal layer;

a display driver integrated circuit (DDI) disposed on the first portion; and

a cover member covering the DDI,

wherein the cover member is electrically connected to the metal layer while being spaced from the DDI and the bending part.

17. The electronic device of claim 16 , wherein the cover member extends to at least one point spaced from the substrate layer, is in contact with the metal layer at the at least one point, and shields the DDI.

18. The electronic device of claim 16 , wherein the cover member comprises:

an insulating layer disposed on the DDI;

a conductive layer disposed on the insulating layer and a ground part; and

an adhesive layer coupling the insulating layer to the DDI.

19. The electronic device of claim 16 , further comprising:

a protective layer disposed on the substrate layer,

wherein the protective layer covers a printed circuit board (PCB) wire of the substrate layer and a PCB circuit of the substrate layer and exposes a PCB ground of the substrate layer.

20. The electronic device of claim 19 ,

wherein a path for discharging static electricity that starts from the cover member, goes via the PCB ground, and faces toward the metal layer is formed, and

wherein the path for discharging the static electricity does not go via the PCB wire and the PCB circuit.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 18, 2019
From: PARK, HYUNJUN; KIM, SEONGHOON; LEE, HONGKOOK; KIM, DONGHWY; BAE, JONGKON; HAN, DONGKYOON
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049504/0985 →
Priority Claims (1)
KR 10-2018-0084495 · Jul 20, 2018 · national
Continuity (1)
Related Publication 20200029475A1 · Jan 23, 2020
Cited By (1)
US 12,543,300