IP Library Granted Patent US 11,331,883
Granted Patent B2
US 11,331,883 · App. 16/510,208 · Granted May 17, 2022

Diffusion barrier structure, and conductive laminate and manufacturing method thereof

Inventors: Tzu-Chien Wei (Hsinchu, TW); Wei-Yen Wang (Hsinchu, TW)
Assignee: NATIONAL TSING HUA UNIVERSITY
B32B15/20B32B3/10B32B7/12B32B15/082B32B27/283B32B27/306B32B27/308H01L21/76841B32B2264/105B32B2307/302B32B2307/762B32B2457/00
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Quick Facts
Patent No.
US 11,331,883
App. No.
16/510,208
Granted
May 17, 2022
Kind
B2
Abstract

A diffusion barrier structure, and a conductive laminate and a manufacturing method thereof are provided. The conductive laminate includes a substrate, a diffusion barrier structure, and a conductive layer. The diffusion barrier structure is formed between the substrate and the conductive layer. The diffusion barrier structure includes a discontinuous modifying layer and a barrier layer. The discontinuous modifying layer is disposed on the substrate. A material for composing the discontinuous modifying layer is a polymer with hydrophilic group. The barrier layer is disposed on the substrate and the discontinuous modifying layer. A material for composing the barrier layer includes at least one self-healing polymer.

Claims (28)

1. A diffusion barrier structure formed between a substrate and a conductive layer, comprising:

a discontinuous modifying layer disposed on the substrate, and a material for composing the discontinuous modifying layer including a silane with a hydrophilic group; and

a barrier layer disposed on the substrate and the discontinuous modifying layer, and a material for composing the barrier layer including at least one self-healing polymer; wherein the self-healing polymer is selected from the group consisting of: polyvinyl alcohol, polyvinylpyrrolidone, polyacrylic acid, polyethylene glycol, and any combination thereof.

2. The diffusion barrier structure according to claim 1 , wherein the silane with the hydrophilic group is a silane with an amino group.

3. The diffusion barrier structure according to claim 2 , wherein the silane with the amino group is selected from the group consisting of: (3-aminopropyl)triethoxysilane, N-(3-(trimethoxysilyl)propyl)ethylenediamine), 3-2-(2-aminoethylamino)ethylamino propyl trimethoxysilane, and any combination thereof.

4. The diffusion barrier structure according to claim 1 , wherein the barrier layer further includes a catalytic material.

5. The diffusion barrier structure according to claim 4 , wherein the catalytic material is metallic nanoparticles.

6. The diffusion barrier structure according to claim 4 , wherein a weight ratio of the self-healing polymer to the catalytic material in the barrier layer is from 0.175:1 to 2:1.

7. The diffusion barrier structure according to claim 4 , wherein the catalytic material is encapsulated in the self-healing polymer.

8. The diffusion barrier structure according to claim 1 , wherein a total thickness of the diffusion barrier structure is less than 5 nm.

9. A conductive laminate, comprising:

a substrate having a surface;

a diffusion barrier structure formed on the substrate, the diffusion barrier structure including a discontinuous modifying layer and a barrier layer, the discontinuous modifying layer disposed on the surface of the substrate, a material composing the discontinuous modifying layer including a silane with a hydrophilic group, the barrier layer disposed on the surface of the substrate and the discontinuous modifying layer, and a material composing the barrier layer including at least one self-healing polymer; wherein the self-healing polymer is selected from the group consisting of: polyvinyl alcohol, polyvinylpyrrolidone, polyacrylic acid, polyethylene glycol, and any combination thereof; and

a conductive layer disposed on the substrate, wherein the conductive layer is separated from the substrate by the diffusion barrier structure.

10. The conductive laminate according to claim 9 , wherein the material of the barrier layer further includes a catalytic material and an adhesive force between the conductive layer and the diffusion barrier structure is from 6 MPa to 15 MPa.

11. A method for manufacturing a conductive laminate, comprising:

providing a substrate having a surface;

performing a surface modification on the surface of the substrate to form a discontinuous modifying layer on the surface of the substrate;

forming a barrier layer on the surface and the discontinuous modifying layer; and

forming a conductive layer on a surface of the diffusion barrier structure;

wherein a material for composing the discontinuous modifying layer includes a silane with a hydrophilic group, and a material for composing the barrier layer includes a self-healing polymer; wherein the self-healing polymer is selected from the group consisting of: polyvinyl alcohol, polyvinylpyrrolidone, polyacrylic acid, polyethylene glycol, and any combination thereof.

12. The method according to claim 11 , wherein the silane with a hydrophilic group is a silane with an amino group.

13. The method according to claim 12 , wherein the silane with the amino group is selected from the group consisting of: (3-aminopropyl)triethoxysilane, N-(3-(trimethoxysilyl)propyl)ethylenediamine), 3-2-(2-aminoethylamino)ethylamino propyl trimethoxysilane, and any combination thereof.

14. The method according to claim 11 , wherein the barrier layer further includes a catalytic material.

15. The method according to claim 14 , wherein the catalytic material is metallic nanoparticles.

16. The method for manufacturing a conductive laminate according to claim 14 , wherein a weight ratio of the self-healing polymer to the catalytic material in the barrier layer is from 0.175:1 to 2:1.

17. The method for manufacturing a conductive laminate according to claim 14 , wherein the catalytic material is encapsulated in the self-healing polymer.

18. The method for manufacturing a conductive laminate according to claim 11 , wherein a total thickness of the discontinuous modifying layer and the barrier layer is less than 5 nm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 12, 2019
From: WEI, TZU-CHIEN; WANG, WEI-YEN
To: NATIONAL TSING HUA UNIVERSITY
Reel/Frame 049738/0116 →
Priority Claims (1)
TW 107134388 · Sep 28, 2018 · national
Continuity (1)
Related Publication 20200101699A1 · Apr 2, 2020