IP Library › Granted Patent US 11,335,716
Granted Patent B2
US 11,335,716 · App. 16/805,860 · Granted May 17, 2022

Photosensing pixel, image sensor and method of fabricating the same

Inventors: Sin-Yao Huang (Tainan, TW); Feng-Chi Hung (Hsin-Chu County, TW); Chen-Hsien Lin (Tainan, TW); Tzu-Hsuan Hsu (Kaohsiung, TW); Yan-Chih Lu (Tainan, TW)
Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
H01L27/14612H01L27/14621H01L27/14627H01L27/14689
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Quick Facts
Patent No.
US 11,335,716
App. No.
16/805,860
Granted
May 17, 2022
Kind
B2
Abstract

A photosensing pixel includes a substrate, a photosensing region, a floating diffusion region, a transfer gate and a control electrode. The photosensing region is located within the substrate. The floating diffusion region is located within the substrate aside the photosensing region. The transfer gate is disposed on the substrate and extending into the photosensing region. The control electrode is located on the substrate and extending into the floating diffusion region.

Claims (20)

1. An image sensor comprising a plurality of pixels, and at least one pixel among the plurality of pixels comprises:

a first photosensing region located within a substrate;

a first transfer gate disposed on a frontside the substrate and extending into the first photosensing region;

a second photosensing region located within the substrate;

a second transfer gate disposed on the frontside of the substrate and extending into the second photosensing region;

a floating diffusion region disposed from the frontside of the substrate to a position within the substrate, wherein the floating diffusion region is shared between the first photosensing region and the second photosensing region; and

a control electrode located on the frontside of the substrate and extending into the floating diffusion region.

2. The image sensor according to claim 1 , wherein the at least one pixel among the plurality of pixels further comprises:

a third photosensing region located within the substrate;

a third transfer gate disposed on the substrate and extending into the third photosensing region;

a fourth photosensing region located within the substrate; and

a fourth transfer gate disposed on the substrate and extending into the fourth photosensing region,

wherein the floating diffusion region is shared between the first photosensing region, the second photosensing region, the third photosensing region and the fourth photosensing region.

3. The image sensor according to claim 1 , further comprising:

a first gate dielectric located within the substrate separating the first transfer gate from the first photosensing region, and

a second gate dielectric located within the substrate separating the second transfer gate from the second photosensing region.

4. The image sensor according to claim 1 , wherein the floating diffusion region is located on a first doped well of the substrate having a first conductivity type, and the floating diffusion region comprises a lightly doped well of a second conductivity type located on the first doped well, and a heavily doped well of the second conductivity type located on the lightly doped well.

5. The image sensor according to claim 4 , wherein the control electrode extends into the floating diffusion region and into the substrate so that it is surrounded by the first doped well, the lightly doped well and the heavily doped well.

6. The image sensor according to claim 4 , further comprising a dielectric layer located within the substrate separating the control electrode from the floating diffusion region, wherein the control electrode is capacitively coupled to the floating diffusion region.

7. The image sensor according to claim 1 , further comprising color filters and micro-lenses located on a backside of the substrate opposite to the frontside.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 8, 2021
From: HUANG, SIN-YAO; HUNG, FENG-CHI; LIN, CHEN-HSIEN; HSU, TZU-HSUAN; LU, YAN-CHIH
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 056797/0739 →
Continuity (2)
Provisional Application 62953472 · Dec 24, 2019
Related Publication 20210193712A1 · Jun 24, 2021
Cited By (2)
US 12,532,558 US 12,648,249