Semiconductor device with an expanded doping concentration distribution in an accumulation region
A doping concentration distribution in an accumulation region in a depth direction of a semiconductor substrate has a maximum portion at which a doping concentration reaches a maximum value, an upper gradient portion in which the concentration decreases from the maximum portion to a base region, and a lower gradient portion in which the concentration decreases from the maximum portion to a drift region. When a full width at half maximum determined by setting a depth position of the maximum portion as a range of impurity implantation with reference to a range-full width at half maximum characteristic according to a material of the substrate and a type of impurities contained in the accumulation region is set as a standard full width at half maximum, a full width at half maximum of the distribution in the accumulation region is 2.2 times the standard full width at half maximum or greater.
1. A semiconductor device comprising:
a semiconductor substrate having a first conductivity-type drift region;
a first conductivity-type emitter region provided above the drift region in the semiconductor substrate and having a doping concentration higher than that of the drift region;
a second conductivity-type base region provided between the emitter region and the drift region in the semiconductor substrate;
a first conductivity-type accumulation region provided between the base region and the drift region in the semiconductor substrate and having a doping concentration higher than that of the drift region; and
a plurality of trench parts formed to penetrate the emitter region, the base region and the accumulation region from an upper surface of the semiconductor substrate and each having a conductive portion provided therein, wherein:
a doping concentration distribution in the accumulation region in a depth direction of the semiconductor substrate has:
a maximum portion at which the doping concentration reaches a maximum value at a depth position Zp;
an upper gradient portion in which the doping concentration has a gradient to decrease in at least a part of a region from the maximum portion to the base region as moving toward the base region; and
a lower gradient portion in which the doping concentration has a gradient to decrease in at least a part of a region from the maximum portion to the drift region as moving toward the drift region;
the semiconductor substrate is a silicon substrate and the impurities contained in the accumulation region is phosphorus;
the following equation is satisfied:
y= 0.01763 x 6 −0.11077 x 5 +0.15065 x 4 +0.21668 x 3 −0.30410 x 2 +0.39392 x− 0.77003,
where x is a common logarithm of the depth position Zp (μm), and y is a common logarithm of a full width at half maximum (μm) of the doping concentration distribution in the accumulation region prior to heat treatment; and
a full width at half maximum of the doping concentration distribution in the accumulation region at the depth position Zp is 2.2 times the full width at half maximum at the depth position Zp or greater of the doping concentration distribution in the accumulation region prior to the heat treatment.
2. The semiconductor device according to claim 1 , wherein a sum of a distance from the upper surface of the semiconductor substrate to the maximum portion of the accumulation region and the half width at half maximum of the doping concentration distribution in the accumulation region at the depth position Zp is equal to or smaller than a distance from the upper surface of the semiconductor substrate to a lower end of each trench part in the depth direction of the semiconductor substrate.
3. The semiconductor device according to claim 1 , wherein the full width at half maximum of the doping concentration distribution in the accumulation region is 30 times or smaller of the full width at half maximum of the doping concentration distribution in the accumulation region prior to the heat treatment.
4. The semiconductor device according to claim 1 , wherein the gradient of the doping concentration in the upper gradient portion in the accumulation region decreases in an entire region from the maximum portion to the base region as moving toward the base region.
5. The semiconductor device according to claim 1 , wherein the gradient of the doping concentration in the lower gradient portion in the accumulation region decreases in an entire region from the maximum portion to the drift region as moving toward the drift region.
6. The semiconductor device according to claim 1 , wherein the accumulation region and the base region are in contact with each other.
7. The semiconductor device according to claim 1 , wherein a distance from a first depth position at which a ratio of a doping concentration to a doping concentration of the maximum portion is ¼, to a second depth position at which the ratio is 1/40 in the upper gradient portion of the doping concentration distribution in the accumulation region, is between 0.1 μm and 1.0 μm, inclusive.
8. The semiconductor device according to claim 1 , wherein a ratio of the full width at half maximum of the doping concentration distribution in the accumulation region to a full width at 1% of maximum of the doping concentration in the accumulation region is greater than 0.26.
9. The semiconductor device according to claim 1 , wherein the full width at half maximum of the doping concentration distribution in the accumulation region is three times or greater the full width at half maximum of the doping concentration distribution in the accumulation region prior to the heat treatment.