IP Library › Granted Patent US 11,355,729
Granted Patent B2
US 11,355,729 · App. 16/900,034 · Granted Jun 7, 2022

Light-emitting device and method for manufacturing light-emitting device

Inventors: Akihiro Chida (Kanagawa, JP); Tomoya Aoyama (Kanagawa, JP)
H01L51/5246H01L51/0097
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Quick Facts
Patent No.
US 11,355,729
App. No.
16/900,034
Granted
Jun 7, 2022
Kind
B2
Abstract

A highly reliable flexible light-emitting device is provided. The light-emitting device includes a first flexible substrate, a second flexible substrate, a light-emitting element between the first flexible substrate and the second flexible substrate, a first bonding layer; and a second bonding layer in a frame shape surrounding the first bonding layer. The first bonding layer and the second bonding layer are between the second flexible substrate and the light-emitting element. The light-emitting element includes layer containing a light-emitting organic compound between the pair of electrodes. The second bonding layer has a higher gas barrier property than the first bonding layer.

Claims (40)

1. A light-emitting device comprising:

a first flexible substrate;

a light-emitting element over the first flexible substrate;

a first bonding layer over the light-emitting element;

a second bonding layer arranged so as to be in contact with and surrounding outer sides of the first bonding layer;

a second flexible substrate over the first bonding layer and the second bonding layer;

a third bonding layer between the first flexible substrate and the light-emitting element arranged so as to be in contact with and surrounding outer sides of the second bonding layer; and

a fourth bonding layer positioned in a region where the first flexible substrate and the second flexible substrate are facing each other, the fourth bonding layer being arranged so as to be in contact with and surrounding outer sides of the third bonding layer,

wherein an oxygen permeability of the second bonding layer is lower than an oxygen permeability of the first bonding layer.

2. The light-emitting device according to claim 1 , wherein the fourth bonding layer has a frame shape.

3. The light-emitting device according to claim 1 , wherein the oxygen permeability of the second bonding layer is lower than or equal to 1×10 −8 [g/m 2 ·day].

4. The light-emitting device according to claim 1 , further comprising:

a transistor between the second flexible substrate and the light-emitting element.

5. The light-emitting device according to claim 1 , further comprising:

a first insulating layer between the second flexible substrate and the light-emitting element;

a transistor between the first insulating layer and the light-emitting element;

a coloring layer between the light-emitting element and the first flexible substrate; and

a second insulating layer between the coloring layer and the first flexible substrate.

6. An electronic device comprising the light-emitting device according to claim 1 .

7. A lighting device comprising the light-emitting device according to claim 1 .

8. A light-emitting device comprising:

a first flexible substrate;

a light-emitting element over the first flexible substrate;

a first bonding layer over the light-emitting element;

a second bonding layer arranged so as to be in contact with and surrounding outer sides of the first bonding layer;

a second flexible substrate over the first bonding layer and the second bonding layer;

a third bonding layer between the first flexible substrate and the light-emitting element arranged so as to be in contact with and surrounding outer sides of the second bonding layer; and

a fourth bonding layer positioned in a region where the first flexible substrate and the second flexible substrate are facing each other, the fourth bonding layer being arranged so as to be in contact with and surrounding outer sides of the third bonding layer,

wherein a water vapor permeability of the second bonding layer is lower than a water vapor permeability of the first bonding layer.

9. The light-emitting device according to claim 8 , wherein the fourth bonding layer has a frame shape.

10. The light-emitting device according to claim 8 , wherein the water vapor permeability of the second bonding layer is lower than or equal to 1×10 −8 [g/m 2 ·day].

11. The light-emitting device according to claim 8 , further comprising:

a transistor between the second flexible substrate and the light-emitting element.

12. The light-emitting device according to claim 8 , further comprising:

a first insulating layer between the second flexible substrate and the light-emitting element;

a transistor between the first insulating layer and the light-emitting element;

a coloring layer between the light-emitting element and the first flexible substrate; and

a second insulating layer between the coloring layer and the first flexible substrate.

13. An electronic device comprising the light-emitting device according to claim 8 .

14. A lighting device comprising the light-emitting device according to claim 8 .

Priority Claims (2)
JP 2013-184698 · Sep 6, 2013 · national
JP 2013-218601 · Oct 21, 2013 · national
Continuity (3)
Continuation 15707383 · Sep 18, 2017
Division 14476154 · Sep 3, 2014
Related Publication 20200313115A1 · Oct 1, 2020
Cited By (2)
US 12,232,396 US 12,677,357