IP Library › Granted Patent US 11,355,827
Granted Patent B2
US 11,355,827 · App. 16/787,286 · Granted Jun 7, 2022

Radio frequency device with non-uniform width cavities

Inventor: Hassan Dani (Cazenovia, NY)
Assignee: KNOWLES CAZENOVIA, INC.
H01P1/203H01P1/2088H01P1/212
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Quick Facts
Patent No.
US 11,355,827
App. No.
16/787,286
Granted
Jun 7, 2022
Kind
B2
Abstract

A microwave or radio frequency (RF) device includes a substrate and a cover. The substrate has a first surface and an opposing second surface, the first surface including a first RF component and a second RF component electrically coupled to the first RF component in series. The cover is disposed over the first surface of the substrate, where the cover includes a first portion with a first width covering the first RF component, where the first portion and the first surface define a first waveguide cavity having the first width, and a second portion with a second width, less than the first width, covering the second RF component, where the second portion and the first surface define a second waveguide cavity having the second width.

Claims (26)

1. A radio frequency (RF) device, comprising

a substrate having a first surface and an opposing second surface;

a first RF component supported by the first surface of the substrate, the first RF component comprising a band-pass filter exhibiting one or more harmonics in a first frequency range;

a second RF component supported by the first surface of the substrate and electrically coupled to the first RF component in series, the second RF component comprising a low-pass filter having a cut-off frequency below the first frequency range; and

a cover disposed over the first surface of the substrate, the cover including:

a first portion having a first width and covering the first RF component, the first portion and the first surface define a first waveguide cavity having the first width, and

a second portion having a second width, less than the first width, and covering the second RF component, the second portion and the first surface define a second waveguide cavity having the second width.

2. The RF device of claim 1 , wherein the first portion of the cover and the second portion of the cover have a first height and a second height, respectively, in relation to the first surface of the substrate, and wherein the first height is equal to the second height.

3. The RF device of claim 1 , wherein the first width has a value between 0.2 inches and 0.4 inches, and the second width has a value between 0.1 inches and 0.4 inches.

4. The RF device of claim 1 , wherein the first portion of the cover includes a first sidewall and a second sidewall, and wherein the second portion includes a third sidewall and a fourth sidewall.

5. The RF device of claim 4 , wherein the first sidewall is separated from the third sidewall by a first gap.

6. The RF device of claim 5 , wherein the second sidewall is separated from the fourth sidewall by a second gap.

7. The RF device of claim 6 , wherein the first gap is equal to the second gap.

8. The RF device of claim 4 , wherein the first sidewall is continuous with the third sidewall.

9. The RF device of claim 8 , wherein the second sidewall is separated from the fourth sidewall by a gap.

10. The RF device of claim 4 , wherein the first surface of the substrate defines a first slot and a second slot, and wherein at least a portion of the third sidewall is disposed in the first slot and at least a portion of the fourth sidewall is disposed in the second slot.

11. The RF device of claim 10 , wherein the first sidewall and the second sidewall are separated from a perimeter of the first RF component by at least a first distance.

12. The RF device of claim 11 , wherein the first distance is at least 0.008 inches.

13. The RF device of claim 4 , wherein the substrate includes a ground plane disposed on the second surface.

14. The RF device of claim 13 , wherein the substrate includes:

a plurality of side surfaces that extend between the first surface and the opposing second surface; and

conductive material disposed on at least a portion of the plurality of side surfaces, the conductive material electrically connected to the ground plane.

15. The RF device of claim 14 , wherein at least a portion of the first sidewall and at least a portion of the second sidewall are in contact with the conductive material.

16. The RF device of claim 4 , wherein the first portion includes a first top plate that extends between the first sidewall and the second sidewall, the first top plate covering the first RF component.

17. The RF device of claim 16 , wherein the second portion includes a second top plate that extends between the third sidewall and the fourth sidewall, the second top plate covering the second RF component.

18. The RF device of claim 17 , wherein the first top plate is continuous with the second top plate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 26, 2022
From: DANI, HASSAN
To: KNOWLES CAZENOVIA, INC.
Reel/Frame 059406/0415 →
Continuity (2)
Provisional Application 62805199 · Feb 13, 2019
Related Publication 20200259263A1 · Aug 13, 2020
Cited By (1)
US 12,586,885