Electronic device including a shielding sheet and a heat radiation member

1. An electronic device comprising:

a circuit board;

at least one electronic component mounted on a surface of the circuit board, the at least one electronic component comprising a first electronic component and at least one second electronic component;

a shielding sheet attached to the surface of the circuit board and covering the at least one electronic component, the shielding sheet contacting a top surface of the first electronic component at a first height from the circuit board, a top surface of the at least one second electronic component at a second height from the circuit board different from the first height, and the circuit board in a region between the first electronic component and the at least one second electronic component;

a thermal interface material (TIM) stacked on the shielding sheet and overlapping the at least one electronic component; and

a heat dissipation member facing the surface of the circuit board, the heat dissipation member being in surface contact with the TIM and fastened to at least a portion of the circuit board by a fixing member,

wherein the shielding sheet comprises an adhesive layer, an insulating layer, and a conductive layer disposed between the adhesive layer and the insulating layer,

wherein the insulating layer is removed from a portion of the shielding sheet overlapping the at least one electronic component, and

wherein a portion of the conductive layer is exposed and is in surface contact with the TIM, the TIM being disposed above the portion of the conductive layer.

2. The electronic device of claim 1 ,

wherein the adhesive layer is removed from a portion of the shielding sheet overlapping the at least one electronic component, and

wherein a portion of the conductive layer is exposed and is in surface contact with the at least one electronic component, the at least one electronic component being disposed under the portion of the conductive layer.

3. The electronic device of claim 1 , wherein the conductive layer comprises a plurality of nanofibers plated with copper (Cu), graphite, or nickel (Ni).

4. The electronic device of claim 1 , wherein the conductive layer is in contact with a ground pad disposed on the surface of the circuit board at a boundary of the shielding sheet.

5. The electronic device of claim 1 , wherein the heat dissipation member comprises:

a heat spreader in surface contact with the TIM; and

a fixing plate fixing the heat spreader.

6. The electronic device of claim 5 , wherein the heat spreader is disposed between the fixing plate and the TIM.

7. The electronic device of claim 5 ,

wherein the fixing plate is disposed between the heat spreader and the TIM and has a groove exposing the heat spreader at a portion overlapping the TIM, and

wherein the TIM is in surface contact with the heat spreader through the groove.

8. The electronic device of claim 5 , wherein the heat spreader comprises a heat pipe or a vapor chamber.

9. The electronic device of claim 5 , wherein the fixing plate comprises any one of steel used stainless (SUS) or a copper alloy.

10. The electronic device of claim 5 ,

wherein the heat spreader comprises a heat pipe or a vapor chamber, and

wherein a majority of a surface area of a surface of the heat spreader contacts a majority of a surface area of a surface of the fixing plate.

11. The electronic device of claim 1 ,

wherein an area of the TIM comprises a same area as an area of the at least one electronic component, and

wherein an area of the shielding sheet is larger than the area of the TIM.

12. The electronic device of claim 11 , wherein an area of the heat dissipation member is larger than the area of the shielding sheet and smaller than an area of the circuit board.

13. The electronic device of claim 11 , wherein an area of the heat dissipation member comprises 50% to 90% of an area of the circuit board.

14. The electronic device of claim 1 ,

wherein the fixing member includes a nut formed on the circuit board or the heat dissipation member, and

wherein a screw is inserted in the nut.

15. The electronic device of claim 14 , wherein at least one hole through which the screw is disposed is formed in the circuit board or the heat dissipation member.

16. The electronic device of claim 1 , wherein the at least one electronic component comprises at least one of a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, a communication processor, a power amp module (PAM), or a power management integrated circuit (PMIC).

17. The electronic device of claim 1 , wherein an air layer is formed between the heat dissipation member and the circuit board in a region not overlapping the at least one electronic component.