IP Library › Granted Patent US 11,360,249
Granted Patent B2
US 11,360,249 · App. 17/337,436 · Granted Jun 14, 2022

Multilayer structure

Inventor: Hideki Yasuda (Kanagawa, JP)
Assignee: FUJIFILM CORPORATION
G02B5/208F25B23/003G02B1/04G02B5/26B32B7/027
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Quick Facts
Patent No.
US 11,360,249
App. No.
17/337,436
Granted
Jun 14, 2022
Kind
B2
Abstract

Provided is a multilayer structure including a radiator, a base material layer that includes a region forming an interface in an internal structure, and a first air layer that is provided between the radiator and the base material layer, in which a far-infrared transmittance B of the base material layer and a solar light reflectance A of the multilayer structure satisfy B/(100−A)>7, and a solar light reflectance C of the base material layer is 30% or more.

Claims (33)

1. A multilayer structure comprising:

a radiator;

a base material layer that includes a region forming an interface in an internal structure; and

a first air layer that is provided between the radiator and the base material layer,

wherein a far-infrared transmittance B of the base material layer and a solar light reflectance A of the multilayer structure satisfy B/(100−A) >7,

a solar light reflectance C of the base material layer is 30% or more,

the base material layer is a non-woven fabric or a resin film containing particles,

in a case in which the base material layer is the non-woven fabric, the region forming the interface in the internal structure comprises voids forming a solid-gas interface with fibers of the non-woven fabric, and

in a case in which the base material layer is the resin film containing the particles, the region forming the interface in the internal structure comprises the particles forming a solid-solid interface with the resin.

2. The multilayer structure according to claim 1 ,

wherein the far-infrared transmittance B of the base material layer and the solar light reflectance C of the base material layer satisfy B/(100−C)>7.

3. The multilayer structure according to claim 1 ,

wherein the number of the base material layers is two or more.

4. The multilayer structure according to claim 3 , further comprising:

a second air layer that is provided between the base material layers.

5. The multilayer structure according to claim 4 ,

wherein a thickness of the second air layer is 5 cm or less.

6. The multilayer structure according to claim 1 ,

wherein the far-infrared transmittance B of the base material layer and the solar light reflectance A of the multilayer structure satisfy B/(100−A)>20.

7. The multilayer structure according to claim 1 ,

wherein the solar light reflectance C of the base material layer is 80% or more.

8. The multilayer structure according to claim 1 ,

wherein an average diameter of the region forming the interface in the internal structure is 5000 nm or less.

9. The multilayer structure according to claim 1 ,

wherein the region forming the interface in the internal structure is at least one selected from a void or a particle.

10. The multilayer structure according to claim 1 ,

wherein the base material layer is a porous base material layer.

11. The multilayer structure according to claim 1 ,

wherein a void volume of the base material layer is 40% or more.

12. The multilayer structure according to claim 1 ,

wherein the base material layer contains polyolefin.

13. The multilayer structure according to claim 1 ,

wherein the multilayer structure is a radiative cooling structure.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 18, 2021
From: YASUDA, HIDEKI
To: FUJIFILM CORPORATION
Reel/Frame 056581/0619 →
Priority Claims (1)
JP JP2018-227602 · Dec 4, 2018 · national
Continuity (2)
Continuation PCTJP2019044510 · Nov 13, 2019
Related Publication 20210286116A1 · Sep 16, 2021
Cited By (1)
US 12,209,826