Systems and methods for preventing chip fraud by inserts in chip pocket

1. A card, comprising:

a substrate including a chip pocket, wherein the chip pocket includes a peak and a valley;

a chip at least partially encompassed in the chip pocket; and

a fraud prevention insert including a plurality of metal contact plates,

wherein the fraud prevention inserted is situated between the chip and the chip pocket.

2. The card of claim 1 , wherein the fraud prevention insert is situated to form a perpendicular angle with the chip pocket.

3. The card of claim 1 , wherein the plurality of metal contact plates forms a pylon between the chip and the chip pocket.

4. The card of claim 1 , comprising a contact pad communicatively coupled to the chip by a connection.

5. The card of claim 4 , comprising a fraud prevention insert in contact with the connection.

6. The card of claim 4 , wherein the connection is between the peak, the valley, or both.

7. The card of claim 1 , comprising a fraud prevention insert situated around an edge of the chip pocket.

8. The card of claim 7 , comprising an insert pocket, wherein the insert pocket is configured to receive the fraud prevention insert.

9. A method of making a card, the method comprising the steps of:

forming a chip pocket using a substrate;

forming a peak and a valley within the chip pocket;

positioning a chip of a device at least partially within the chip pocket;

forming an insert pocket, wherein the insert pocket is configured to receive a fraud prevention insert, and

forming a fraud prevention insert by stacking a plurality of metal contact plates in the insert pocket.

10. The method of claim 9 , comprising the step of inserting a fraud prevention insert between the chip and the chip pocket.

11. The method of claim 10 , wherein the fraud prevention insert is at least partially encompassed in the chip pocket.

12. The method of claim 10 , wherein the fraud prevention insert is positioned at least partially outside of the chip pocket.

13. The method of claim 10 , comprising the step of adhesively attaching the fraud prevention insert to the insert pocket.

14. A chip fraud prevention system, comprising:

a substrate including a chip pocket, wherein the chip pocket includes a peak and a valley;

a chip at least partially encompassed in the chip pocket; and

a fraud prevention insert including a plurality of contact plates,

wherein the fraud prevention inserted is situated at least partially between the chip and the chip pocket.

15. The chip fraud prevention system of claim 14 , comprising a contact pad, wherein:

the chip is communicatively coupled to the contact pad by a connection, and

the fraud prevention insert is positioned at the connection.

16. The chip fraud prevention system of claim 14 , comprising an insert pocket, wherein the insert pocket is configured to receive the fraud prevention insert.

17. The chip fraud prevention system of claim 14 , wherein the fraud prevention insert is situated to form a perpendicular angle with the chip pocket.

18. The chip fraud prevention system of claim 14 , wherein the plurality of metal contact plates forms a pylon between the chip and the chip pocket.

19. The chip fraud prevention system of claim 14 , wherein the plurality of contact plates comprises a thermally conductive material.

20. The chip fraud prevention system of claim 14 , wherein fraud prevention insert is positioned at an outer edge of the chip.