Multi-layer ceramic electronic component
A multi-layer ceramic electronic component, including: a capacitance forming unit that includes internal electrodes and ceramic layers, the internal electrodes being laminated in a first direction via the ceramic layers; and a circumferential unit that is provided on a circumference of the capacitance forming unit and formed of insulating ceramics. The circumferential unit includes a cover that is provided to the capacitance forming unit outward in the first direction, a side margin that is provided to the capacitance forming unit outward in a second direction orthogonal to the first direction, and a grain growth region that is formed at a boundary between the cover and the side margin and includes crystal grains of the insulating ceramics, the crystal grains having a mean grain size larger than a mean grain size of the crystal grains at a center portion of the cover.
1. A multi-layer ceramic electronic component, comprising:
a capacitance forming unit that includes internal electrodes and ceramic layers, the internal electrodes being laminated in a first direction via the ceramic layers; and
a circumferential unit that is provided on a circumference of the capacitance forming unit and formed of insulating ceramics, the circumferential unit including
a cover that covers the capacitance forming unit from the first direction,
a side margin that covers the capacitance forming unit and the cover from a second direction orthogonal to the first direction, the side margin being in direct physical contact with the ceramic layers of the capacitance forming unit, and
a grain growth region that is formed at a boundary between the cover and the side margin, that is overlapped in the first direction with at least a part of the capacitance forming unit, and that includes crystal grains of the insulating ceramics, the crystal grains having a mean grain size larger than a mean grain size of the crystal grains at a center portion of the cover.
2. The multi-layer ceramic electronic component according to claim 1 , wherein
the mean grain size of the crystal grains of the insulating ceramics in the grain growth region is 300 nm or more.
3. The multi-layer ceramic electronic component according to claim 1 , wherein
the side margin has a thickness dimension of 20 μm or less in the second direction.
4. The multi-layer ceramic electronic component according to claim 1 , wherein
the cover has a thickness dimension of 20 μm or less in the first direction.
5. The multi-layer ceramic electronic component according to claim 1 , wherein
the mean grain size of the crystal grains of the insulating ceramics in the grain growth region is larger than a mean grain size of the crystal grains of the insulating ceramics at a center portion of the side margin.
6. The multi-layer ceramic electronic component according to claim 1 , wherein
positions of end portions of the internal electrodes in the second direction are aligned with one another within a range of 0.5 μm in the second direction.
7. A multi-layer ceramic electronic component, comprising:
a capacitance forming unit that includes internal electrodes and ceramic layers, the internal electrodes being laminated in a first direction via the ceramic layers; and
a circumferential unit that is provided on a circumference of the capacitance foaming unit and formed of insulating ceramics, the circumferential unit including,
a side margin that covers the capacitance forming unit from a second direction orthogonal to the first direction,
a cover that covers the capacitance forming unit and the side margin from the first direction, and
a grain growth region that is formed at a boundary between the cover and the side margin, that is overlapped with at least a part of the capacitance forming unit in the second direction, and that includes crystal grains of the insulating ceramics, the crystal grains having a mean grain size larger than a mean grain size of the crystal grains at a center portion of the side margin.
8. The multi-layer ceramic electronic component according to claim 7 , wherein
the mean grain size of the crystal grains of the insulating ceramics in the grain growth region is 300 nm or more.
9. The multi-layer ceramic electronic component according to claim 7 , wherein
the side margin has a thickness dimension of 20 μm or less in the second direction.
10. The multi-layer ceramic electronic component according to claim 7 , wherein
the cover has a thickness dimension of 20 μm or less in the first direction.
11. The multi-layer ceramic electronic component according to claim 7 , wherein
the mean grain size of the crystal grains of the insulating ceramics in the grain growth region is larger than a mean grain size of the crystal grains of the insulating ceramics at a center portion of the cover.