Flipchip package with an IC having a covered cavity comprising metal posts

1. A semiconductor package, comprising:

an integrated circuit (IC) comprising a substrate including at least a semiconductor surface having circuitry configured for at least one function with some nodes of the circuitry connected to bond pads, with first metal posts on the bond pads, and dome support metal posts configured in a ring having a top rim defining an inner cavity with solder on the top rim extending over an area of the inner cavity for providing a dome of the solder that covers the inner cavity to provide a covered air cavity over a portion of the circuitry;

a leadframe including a plurality of leads or lead terminals;

wherein the IC is flipchip attached with a solder connection to the leadframe so that the first metal posts are attached to the leads or the lead terminals, and

a mold compound providing encapsulation for the semiconductor package except on at least a bottom side of the leads or the lead terminals.

2. The semiconductor package of claim 1 , wherein the ring is a continuous ring throughout so that the covered air cavity comprises a sealed air cavity, and wherein the mold compound is also excluded from being within the sealed air cavity.

3. The semiconductor package of claim 1 , wherein the ring is a non-continuous ring that includes at least one gap.

4. The semiconductor package of claim 1 , wherein the leadframe comprises a leadless lead frame.

5. The semiconductor package of claim 1 , wherein the first metal posts and the dome support metal posts each comprise a base metal including copper, further comprising at least one solder wettable metal layer on the top rim of the first metal posts and on the dome support metal posts.

6. The semiconductor package of claim 5 , wherein the at least one solder wettable metal comprises a layer of nickel, and a layer of a noble metal on the nickel, wherein the noble metal comprises at least one of gold, palladium, and a palladium-nickel alloy.

7. The semiconductor package of claim 1 , wherein the portion of the circuitry comprises less than 30 percent of an area of the IC.

8. The semiconductor package of claim 1 , wherein the portion of the circuitry comprises at least one of an analog-to-digital converter (ADC), a digital-to-analog converter (DAC), a bandgap voltage reference, and a Microelectromechanical systems (MEMS) sensor.

9. The semiconductor package of claim 1 , wherein the IC includes at least one passivation layer, and wherein a bottom side of the covered air cavity is in physical contact with the passivation layer.

10. The semiconductor package of claim 1 , wherein a thickness of the solder dome is from 10 μm to 200 μm.

11. A method, comprising:

providing an in-process integrated circuit (IC) comprising a substrate including at least a semiconductor surface having circuitry configured for at least one function with some nodes of the circuitry connected to bond pads of a metal layer that is exposed by openings in at least one passivation layer,

forming metal posts including first metal posts on the bond pads, and dome support metal posts configured in a ring having a top rim defining an inner cavity positioned over a portion of the circuitry, and

forming solder on the top rim extending over an area of the inner cavity for providing a dome of the solder that covers the inner cavity to provide a covered air cavity over the portion of the circuitry.

12. The method of claim 11 , where the forming of the solder on the rim comprises depositing a defined area of a solder paste using a solder stencil, then reflowing the solder paste so that after the reflowing the solder paste the dome of the solder spans the area of the inner cavity.

13. The method of claim 11 , further comprising:

providing a leadframe including a plurality of leads or lead terminals;

flipchip attaching the IC with a solder connection to the leadframe so that the first metal posts are attached to the leads or to the lead terminals, and

forming a mold compound providing encapsulation to provide a semiconductor package except on at least a bottom side of the leads or the lead terminals.

14. The method of claim 13 , wherein the leadframe comprises a leadless lead frame.

15. The method of claim 11 , wherein the first and the dome support metal posts both comprise a base metal comprising copper, further comprising forming at least one solder wettable metal on the rim before the forming of the solder.

16. The method of claim 15 , wherein the at least one solder wettable metal comprises a layer of nickel on the rim, and a layer of a noble metal on the nickel, wherein the noble metal comprises gold, palladium, or a palladium-nickel alloy.

17. The method of claim 11 , wherein the ring is a continuous ring throughout so that the covered air cavity comprises a sealed air cavity, and wherein the mold compound is also excluded from being within the sealed air cavity covered air cavity.

18. The method of claim 11 , wherein the portion of the circuitry comprises less than 30 percent of an area of the IC.

19. The method of claim 11 , wherein the portion of the circuitry comprises at least one of an analog-to-digital converter (ADC), a digital-to-analog converter (DAC), a bandgap voltage reference, and a Microelectromechanical systems (MEMS) sensor.

20. The method of claim 11 , wherein a thickness of the dome of the solder is 10 μm to 200 μm.

21. The method of claim 11 , wherein the ring is a non-continuous ring that includes at least one gap.