Nonvolatile memory device having a ferroelectric layer
A nonvolatile memory device according to an embodiment includes a substrate having an upper surface, a source electrode structure disposed on the substrate, and a channel structure disposed over the substrate and disposed to contact one sidewall surface of the source electrode structure. In addition, the nonvolatile memory device includes a drain electrode structure disposed to contact one sidewall surface of the channel structure over the substrate. In addition, the nonvolatile memory device includes a plurality of ferroelectric structures extending in a first direction perpendicular to the substrate in the channel structure and disposed to be spaced apart from each other along the second direction perpendicular to the first direction. In addition, the nonvolatile memory device includes a gate electrode structure disposed in each of the plurality of ferroelectric structure to extend along the first direction.
1. A nonvolatile memory device comprising:
a substrate having an upper surface;
a source electrode structure disposed over the substrate, the source electrode structure comprising a plurality of source electrode layer patterns and a plurality of source insulation layer patterns that are alternately stacked along a first direction perpendicular to the upper surface, wherein the source electrode structure extends in a second direction perpendicular to the first direction;
a channel structure disposed over the substrate and disposed to contact one sidewall surface of the source electrode structure, the one sidewall surface of the source electrode structure forming a plane substantially parallel to the first and second directions;
a drain electrode structure disposed over the substrate to contact one sidewall surface of the channel structure, the drain electrode structure comprising a plurality of drain electrode layer patterns and a plurality of drain insulation layer patterns that are alternately stacked along the first direction, wherein the drain electrode structure extends in the second direction;
a plurality of ferroelectric structures extending in the first direction in the channel structure and disposed to be spaced apart from each other along the second direction; and
a gate electrode structure disposed in each of the plurality of ferroelectric structures to extend along the first direction,
wherein the source electrode structure and the drain electrode structure are spaced apart from each other in a direction perpendicular to the first and second directions.
2. The nonvolatile memory device of claim 1 , further comprising a base insulation layer disposed on the substrate and contacting the source electrode structure, the channel structure, the drain structure, the ferroelectric structures and the gate electrode structure.
3. The nonvolatile memory device of claim 1 , wherein the ferroelectric structures are disposed to surround the gate electrode structure along the first direction by a predetermined thickness.
4. The nonvolatile memory device of claim 1 , wherein each of the ferroelectric structures comprises at least one selected from the group consisting of hafnium oxide, zirconium oxide, and hafnium zirconium oxide.
5. The nonvolatile memory device of claim 1 , wherein the channel structure comprises doped semiconductor or metal oxide.