IP Library › Granted Patent US 11,362,114
Granted Patent B2
US 11,362,114 · App. 16/765,216 · Granted Jun 14, 2022

Array substrate and method for manufacturing the same and display device

Inventors: Wei Yang (Beijing, CN); Guangcai Yuan (Beijing, CN); Ce Ning (Beijing, CN); Xinhong Lu (Beijing, CN); Tianmin Zhou (Beijing, CN); Xin Yang (Beijing, CN)
Assignee: BOE TECHNOLOGY GROUP CO., LTD.
H01L27/1237H01L27/127H01L27/1222H01L27/1248
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Quick Facts
Patent No.
US 11,362,114
App. No.
16/765,216
Granted
Jun 14, 2022
Kind
B2
Abstract

A method of manufacturing an array substrate includes: forming a first semiconductor pattern and a first insulating layer group sequentially on a base substrate; forming a second semiconductor pattern and a second insulating layer group sequentially on the first insulating layer group; forming two first via holes in the first insulating layer group and the second insulating layer group to expose the first semiconductor pattern, annealing the exposed first semiconductor pattern and then removing an oxide layer on a surface of the first semiconductor pattern; forming connecting wires in the first via holes; forming second via holes in the second insulating layer group to expose the second semiconductor pattern, and forming a first source electrode and a first drain electrode in the second via holes such that the first source electrode or the first drain electrode covers and is connected to one of the connecting wires.

Claims (35)

1. An array substrate, comprising:

a base substrate;

a first semiconductor pattern disposed on the base substrate;

a first insulating layer group disposed on a surface of the first semiconductor pattern away from the base substrate;

a second semiconductor pattern disposed on the first insulating layer group;

a second insulating layer group disposed on a surface of the second semiconductor pattern away from the base substrate;

first via holes disposed in the first insulating layer group to expose the first semiconductor pattern;

second via holes disposed in the second insulating layer group to expose the second semiconductor pattern; and

a first groove formed in the first insulating layer group and having a depth same as that of the first via holes.

2. The array substrate according to claim 1 , wherein an orthographic projection of the first semiconductor pattern on the base substrate does not overlap an orthographic projection of the second semiconductor pattern on the base substrate.

3. The array substrate according to claim 1 , wherein the first semiconductor pattern and the second semiconductor pattern are made of different materials.

4. The array substrate according to claim 1 , wherein the first semiconductor pattern is made of polysilicon and the second semiconductor pattern is made of metal oxide.

5. A display device, comprising an array substrate, the array substrate comprising:

a base substrate;

a first semiconductor pattern disposed on the base substrate;

a first insulating layer group disposed on a surface of the first semiconductor pattern away from the base substrate;

a second semiconductor pattern disposed on the first insulating layer group;

a second insulating layer group disposed on a surface of the second semiconductor patter away from the base substrate;

first via holes disposed in the first insulating layer group to expose the first semiconductor pattern;

second via holes disposed in the second insulating layer group to expose the second semiconductor pattern; and

a first groove formed in the first insulating layer group and having a depth same as that of the first via holes.

6. The array substrate according to claim 2 , wherein the first semiconductor pattern and the second semiconductor pattern are made of different materials.

7. The array substrate according to claim 2 , wherein the first semiconductor pattern is made of polysilicon and the second semiconductor pattern is made of metal oxide.

8. The array substrate according to claim 1 , wherein the first insulating layer group comprises a first gate insulating layer disposed on a surface of the first semiconductor pattern away from the base substrate, a first interlayer dielectric layer disposed on a surface of the first gate insulating layer away from the base substrate, and a second buffer layer disposed on a surface of the first interlayer dielectric layer away from the base substrate.

9. The array substrate according to claim 1 , wherein the second insulating layer group comprises a second gate insulating layer disposed on a surface of the second semiconductor pattern away from the base substrate, and a second interlayer dielectric layer disposed on a surface of the second gate insulating layer away from the base substrate.

10. The array substrate according to claim 1 , wherein the array substrate further comprises connecting wires disposed in the first via holes.

11. The array substrate according to claim 10 , wherein the array substrate further comprises a first source electrode and a first drain electrode disposed in the second via holes, wherein the first source electrode or the first drain electrode covers and is connected to one of the connecting wires.

12. The array substrate according to claim 1 , wherein the second insulating layer group comprises a second gate insulating layer and a second interlayer dielectric layer sequentially disposed on the second semiconductor pattern.

13. The array substrate according to claim 1 , wherein the array substrate further comprises a second groove formed in the first groove and having a depth same as that of the second via holes.

14. The array substrate according to claim 13 , wherein the first groove and the first via holes are formed through an identical patterning process, and the second groove and the second via holes are formed through an identical patterning process.

15. The display device according to claim 5 , wherein the array substrate further comprises connecting wires disposed in the first via holes.

16. The display device according to claim 15 , wherein the array substrate further comprises a first source electrode and a first drain electrode disposed in the second via holes, wherein the first source electrode or the first drain electrode covers and is connected to one of the connecting wires.

17. The display device according to claim 5 , wherein the second insulating layer group comprises a second gate insulating layer and a second interlayer dielectric layer sequentially disposed on the second semiconductor pattern.

18. The display device according to claim 5 , wherein the array substrate further comprises a second groove formed in the first groove and having a depth same as that of the second via holes.

19. The display device according to claim 18 , wherein the first groove and the first via holes are formed through an identical patterning process, and the second groove and the second via holes are formed through an identical patterning process.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 26, 2021
From: YANG, WEI; YUAN, GUANGCAI; NING, CE; LU, XINHONG; ZHOU, TIANMIN; YANG, XIN
To: BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 056041/0277 →
Priority Claims (1)
CN 201811497063.7 · Dec 7, 2018 · national
Continuity (1)
Related Publication 20210225893A1 · Jul 22, 2021
Cited By (1)
US 12,342,713