IP Library › Granted Patent US 11,362,424
Granted Patent B2
US 11,362,424 · App. 16/707,315 · Granted Jun 14, 2022

Antenna module and electronic device comprising thereof

Inventors: Jinwoo Park (Suwon-si, KR); Kyujin Kwak (Suwon-si, KR); Jinho Lim (Suwon-si, KR); Dongyeon Kim (Suwon-si, KR); Jungsik Park (Suwon-si, KR); Sungjun Kim (Suwon-si, KR)
Assignee: Samsung Electronics Co., Ltd.
H01Q9/0414H01Q1/2283H01Q1/242H01Q9/045
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Quick Facts
Patent No.
US 11,362,424
App. No.
16/707,315
Granted
Jun 14, 2022
Kind
B2
Abstract

An electronic device is provided. The electronic device includes a housing, a plate attached to the housing to form an inner space together with the housing and includes a flat portion facing in a first direction and a curved portion extended from an edge of the flat portion and forming an obtuse angle with the first direction, and an antenna module positioned in the inner space. The antenna module includes a first partial layer, a second partial layer that includes a first antenna pattern, and is stacked on the first partial layer, and a third partial layer that includes a second antenna pattern, and is stacked on the second partial layer. When viewed from the first direction, the third partial layer overlaps at least a portion of the flat portion, and at least a portion of the second partial layer overlaps at least a portion of the curved portion.

Claims (38)

1. An electronic device comprising:

a housing;

a plate attached to the housing to form an inner space together with the housing and including a flat portion facing in a first direction and a curved portion extended from an edge of the flat portion and forming an obtuse angle with the first direction; and

an antenna module positioned in the inner space,

wherein the antenna module includes:

a first partial layer having a first size,

a second partial layer including a first antenna pattern, having a second size smaller than the first size, and stacked on the first partial layer, and

a third partial layer including a second antenna pattern, having a third size smaller than the second size, and stacked on the second partial layer, and

wherein, when viewed from the first direction, the third partial layer overlaps at least a portion of the flat portion, and at least a portion of the second partial layer overlaps at least a portion of the curved portion.

2. The electronic device of claim 1 ,

wherein the first partial layer includes a first region exposed by a difference between the first size of the first partial layer and the second size of the second partial layer,

wherein the second partial layer includes a second region exposed by a difference between the second size and the third size, and

wherein the third partial layer includes a third region facing in the first direction.

3. The electronic device of claim 2 , further comprising:

a support member fixing the antenna module to a printed circuit board disposed in the housing,

wherein the first region has a shape of engaging with a portion of the support member.

4. The electronic device of claim 2 , wherein a distance between the flat portion and the third region is smaller than a distance between the curved portion and the second region.

5. The electronic device of claim 2 , wherein the first region overlaps at least a portion of the flat portion, when viewed from the first direction.

6. The electronic device of claim 2 ,

wherein the antenna module has a first thickness in the third region,

wherein the antenna module has a second thickness smaller than the first thickness in the second region, and

wherein the antenna module has a third thickness smaller than the second thickness in the first region.

7. The electronic device of claim 1 , wherein the second partial layer includes at least one dipole antenna.

8. The electronic device of claim 7 , further comprising:

a wireless communication circuit configured to transmit/receive a signal having a frequency between 3.5 GHz and 100 GHz by using the dipole antenna.

9. The electronic device of claim 7 , wherein the first partial layer or the third partial layer includes at least one S-patch antenna for improving a straightness of a signal which is transmitted/received through the dipole antenna.

10. The electronic device of claim 1 , wherein the third partial layer includes at least one patch antenna.

11. The electronic device of claim 10 , further comprising:

a wireless communication circuit configured to transmit/receive a signal having a frequency between 3.5 GHz and 100 GHz by using the patch antenna.

12. The electronic device of claim 1 , further comprising:

a side bezel structure, formed of a metal material, to which the plate is attached,

wherein the side bezel structure includes an injection structure of a polymer material, which is disposed at a location corresponding to the antenna module.

13. The electronic device of claim 1 , wherein the antenna module further comprises a network layer.

14. The electronic device of claim 13 , wherein the network layer comprises:

at least one dielectric layer; and

at least one ground layer.

15. The electronic device of claim 14 , further comprising a radio frequency integrated circuit (RFIC),

wherein the RFIC is electrically connected with an antenna element of the antenna module through a feed part formed within the dielectric layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 9, 2019
From: PARK, JINWOO; KWAK, KYUJIN; LIM, JINHO; KIM, DONGYEON; PARK, JUNGSIK; KIM, SUNGJUN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 051217/0441 →
Priority Claims (1)
KR 10-2018-0166920 · Dec 21, 2018 · national
Continuity (1)
Related Publication 20200203836A1 · Jun 25, 2020