Semiconductor device

1. A semiconductor device comprising:

a first interlayer insulating film;

a conductive connection structure provided in the first interlayer insulating film;

a second interlayer insulating film provided on the first interlayer insulating film;

a wiring structure provided in the second interlayer insulating film and connected to the conductive connection structure; and

an insertion liner interposed between an upper surface of the conductive connection structure and an upper surface of the first interlayer insulating film, the insertion liner comprising carbon,

wherein the conductive connection structure is disposed in a connection trench formed in the first interlayer insulating film,

wherein the conductive connection structure comprises a connection barrier film provided along a side wall and a bottom surface of the connection trench, and a connection filling film provided on the connection barrier film and filling the connection trench, and

wherein a part of the connection barrier film protrudes from an upper surface of the connection filling film and toward the wiring structure beyond the upper surface of the connection filling film, and the insertion liner extends along an upper surface of the connection barrier film and the upper surface of the connection filling film.

2. The semiconductor device of claim 1 , wherein the upper surface of the connection barrier film and the upper surface of the connection filling film form a continuous surface.

3. The semiconductor device of claim 1 , wherein the insertion liner comprises a carbon film.

4. The semiconductor device of claim 1 , wherein the insertion liner comprises a carbon-rich metal carbide film.

5. The semiconductor device of claim 1 , wherein the insertion liner is in contact with and electrically connects the conductive connection structure and the wiring structure.

6. The semiconductor device of claim 1 , wherein the conductive connection structure comprises a first conductive connection wiring and a second conductive connection wiring which are horizontally spaced apart from each other,

wherein the wiring structure is electrically connected to the first conductive connection wiring and isolated from the second conductive connection wiring, and

wherein the insertion liner is provided on the upper surface of the first conductive connection wiring and is not provided on the upper surface of the second conductive connection wiring.

7. The semiconductor device of claim 1 , wherein the second interlayer insulating film forms a wiring trench and a via trench, the via trench being provided on a bottom surface of the wiring trench and exposing at least a part of the conductive connection structure, and

wherein the wiring structure comprises a barrier film which extends along a side wall of the wiring trench, the bottom surface of the wiring trench, a side wall of the via trench and a bottom surface of the via trench, and a filling film which fills the wiring trench and the via trench over the barrier film.

8. The semiconductor device of claim 1 , further comprising a substrate; and

a gate electrode and a source/drain region disposed on the substrate,

wherein the conductive connection structure comprises a lower contact and an upper contact provided on the lower contact,

wherein the lower contact is connected to one of the gate electrode or the source/drain region, and

wherein the insertion liner extends along at least a part of an upper surface of the upper contact.

9. The semiconductor device of claim 8 , wherein a liner comprising carbon is not interposed between a bottom surface of the upper contact and an upper surface of the lower contact.

10. A semiconductor device comprising:

a first interlayer insulating film;

a conductive connection structure provided in the first interlayer insulating film;

an etching stop film provided on the conductive connection structure;

a second interlayer insulating film provided on the etching stop film;

a trench formed through the etching stop film and the second interlayer insulating film, the trench exposing a part of the conductive connection structure;

an insertion liner provided along a bottom surface of the trench between an upper surface of the conductive connection structure and an upper surface of the first interlayer insulating film, and comprising carbon; and

a wiring structure which fills the trench and is electrically connected to the conductive connection structure via the insertion liner,

wherein the conductive connection structure is disposed in a connection trench formed in the first interlayer insulating film,

wherein the conductive connection structure comprises a connection barrier film provided along a side wall and a bottom surface of the connection trench,

wherein a connection filling film is provided on the connection barrier film and filling the connection trench,

wherein a part of the connection barrier film protrudes from an upper surface of the connection filling film and toward the wiring structure beyond the upper surface of the connection filling film, and

wherein the insertion liner extends along an upper surface of the connection barrier film and the upper surface of the connection filling film.

11. The semiconductor device of claim 10 , wherein the insertion liner is interposed between the upper surface of the conductive connection structure and a bottom surface of the wiring structure.

12. The semiconductor device of claim 10 , wherein the insertion liner is not interposed between the etching stop film and the conductive connection structure.

13. The semiconductor device of claim 10 , wherein the insertion liner comprises a carbon film.

14. The semiconductor device of claim 10 , wherein the wiring structure comprises a wiring pattern and a via that is interposed between the wiring pattern and the conductive connection structure,

wherein each of the wiring pattern and the via comprises a barrier film and a filling film on the barrier film, and

wherein the barrier film of the wiring pattern is interposed between the filling film of the wiring pattern and the filling film of the via.

15. A semiconductor device comprising:

a substrate;

a gate electrode and a source/drain region provided on the substrate;

a first interlayer insulating film provided on the gate electrode and the source/drain region;

a first contact provided in the first interlayer insulating film and connected to one of the gate electrode or the source/drain region, the first contact comprising cobalt;

a second interlayer insulating film provided on the first interlayer insulating film;

a wiring structure provided in the second interlayer insulating film and connected to the first contact; and

a carbon film interposed between an upper surface of the first contact and an upper surface of the first interlayer insulating film;

wherein the first contact is disposed in a contact trench in the first interlayer insulating film,

wherein the first contact comprises a barrier film provided along a side wall and a bottom surface of the contact trench, and a contact filling film provided on the barrier film and filling the contact trench,

wherein a part of the barrier film protrudes from an upper surface of the contact filling film and towards the wiring structure beyond the upper surface of the contact filling film, and

wherein the carbon film extends along an upper surface of the barrier film and the upper surface of the contact filling film.

16. The semiconductor device of claim 15 , further comprising a second contact which is provided between the first contact and the substrate,

wherein the one of the gate electrode or the source/drain region is connected to the first contact via the second contact.

17. The semiconductor device of claim 16 , wherein the second contact comprises tungsten, and

wherein a carbon film is not interposed between the first contact and the second contact.

18. The semiconductor device of claim 15 , wherein the carbon film is in contact with and electrically connects the first contact and the wiring structure.