Electronic assembly having multiple substrate segments
An electronic assembly ( 100 ) includes a mechanical carrier ( 102 ), a plurality of integrated circuits ( 104 A, 104 B) disposed on the mechanical carrier, a fan out package ( 108 ) disposed on the plurality of integrated circuits, a plurality of singulated substrates ( 112 A, 112 B) disposed on the fan out package, a plurality of electronic components ( 114 A, 114 B) disposed on the plurality of singulated substrates, and at least one stiffness ring ( 116 A, 116 B, 116 C) disposed on the plurality of singulated substrates. A method for constructing an electronic assembly includes identifying a group of known good singulated substrates, joining the group of known good singulated substrates into a substrate panel, attaching at least one bridge to the substrate panel that electrically couples at least two of the known good singulated substrates, and mounting a plurality of electronic components onto the substrate panel, each electronic component of the plurality of electronic components corresponding to a respective known good singulated substrate.
1. An electronic assembly comprising:
a mechanical carrier;
a plurality of integrated circuits disposed on the mechanical carrier;
a fan out package disposed on the plurality of integrated circuits;
a plurality of singulated substrates disposed on the fan out package;
a plurality of electronic components disposed on the plurality of singulated substrates; and
a plurality of stiffness rings disposed on the plurality of singulated substrates and surrounding at least some of the plurality of electronic components, wherein a first stiffness ring is disposed on a first singulated substrate and a second stiffness ring is disposed on a second singulated substrate, and wherein a third stiffness ring is disposed on respective portions of the first singulated substrate and the second singulated substrate and connects the first singulated substrate and the second singulated substrate.
2. The electronic assembly of claim 1 , wherein the mechanical carrier is a heat spreader.
3. The electronic assembly of claim 1 , further comprising an encapsulant disposed on the mechanical carrier that surrounds the plurality of integrated circuits.
4. The electronic assembly of claim 1 , wherein the fan out package is a Redistribution Layer (RDL) package.
5. The electronic assembly of claim 1 , wherein at least some of the plurality of singulated substrates are substrates having embedded capacitors.
6. The electronic assembly of claim 1 , further comprising a plurality of electrical connections between the first singulated substrate and the second singulated substrate of the plurality of singulated substrates.
7. The electronic assembly of claim 6 , wherein the third stiffness ring includes the plurality of electrical connections.