Bonded semiconductor devices having processor and NAND flash memory and methods for forming the same
Embodiments of semiconductor devices and fabrication methods thereof are disclosed. In an example, a semiconductor device includes a first semiconductor structure including a processor, an array of static random-access memory (SRAM) cells, and a first bonding layer including a plurality of first bonding contacts. The semiconductor device also includes a second semiconductor structure including an array of NAND memory cells and a second bonding layer including a plurality of second bonding contacts. The semiconductor device further includes a bonding interface between the first bonding layer and the second bonding layer. The first bonding contacts are in contact with the second bonding contacts at the bonding interface.
1. A semiconductor device, comprising:
a first semiconductor structure comprising a processor, an array of static random-access memory (SRAM) cells, a first bonding layer comprising a plurality of first bonding contacts, a first interconnect layer vertically between the first bonding layer and the processor, a word line driver of an array of NAND memory cells, and a page buffer of the array of NAND memory cells, wherein the array of SRAM cells are located in a peripheral region of the first semiconductor structure without the first bonding contacts, and wherein the first interconnect layer is configured to transfer electrical signals between the processor and one or more of the array of SRAM cells, the word line driver of the array of NAND memory cells, or the page buffer of the array of NAND memory cells;
a second semiconductor structure comprising the array of NAND memory cells and a second bonding layer comprising a plurality of second bonding contacts; and
a bonding interface between the first bonding layer and the second bonding layer, wherein the first bonding contacts are in contact with the second bonding contacts at the bonding interface, and wherein the first bonding layer and the second bonding layer are configured to transfer electrical signals between the array of NAND memory cells and one or more of the processor, the array of SRAM cells, the word line driver of the array of NAND memory cells, or the page buffer of the array of NAND memory cells.
2. The semiconductor device of claim 1 , wherein the first semiconductor structure comprises:
a substrate;
the processor on the substrate;
the array of SRAM cells on the substrate and outside of the processor; and
the first bonding layer above the processor and the array of SRAM cells.
3. The semiconductor device of claim 2 , wherein the second semiconductor structure comprises:
the second bonding layer above the first bonding layer;
a memory stack above the second bonding layer;
an array of three-dimensional (3D) NAND memory strings extending vertically through the memory stack; and
a semiconductor layer above and in contact with the array of 3D NAND memory strings.
4. The semiconductor device of claim 2 , wherein the array of NAND memory cells comprises an array of two-dimensional (2D) NAND memory cells, and wherein the second semiconductor structure comprises:
the second bonding layer above the first bonding layer;
the array of 2D NAND memory cells above the second bonding layer; and
a semiconductor layer above and in contact with the array of 2D NAND memory cells.
5. The semiconductor device of claim 3 , further comprising a pad-out interconnect layer above the semiconductor layer, wherein the semiconductor layer comprises polysilicon or single-crystal silicon.
6. The semiconductor device of claim 1 , wherein the second semiconductor structure comprises:
a substrate;
a memory stack above the substrate;
an array of 3D NAND memory strings extending vertically through the memory stack; and
the second bonding layer above the memory stack and the array of 3D NAND memory strings.
7. The semiconductor device of claim 1 , wherein the second semiconductor structure comprises:
a substrate;
an array of 2D NAND memory cells on the substrate; and
the second bonding layer above the array of 2D NAND memory cells.
8. The semiconductor device of claim 1 , wherein
the second semiconductor structure comprises a second interconnect layer vertically between the second bonding layer and the array of NAND memory cells; and
the processor and the array of SRAM cells are electrically connected to the array of NAND memory cells through the first and second interconnect layers and the first and second bonding contacts.
9. The semiconductor device of claim 1 , wherein the array of SRAM cells are distributed in a plurality of separate regions of the peripheral region of the first semiconductor structure.
10. The semiconductor device of claim 1 , wherein the second semiconductor structure further comprises a peripheral circuit of the array of NAND memory cells.
11. The semiconductor device of claim 10 , wherein the peripheral circuit is above or below the array of NAND memory cells.
12. The semiconductor device of claim 10 , wherein the peripheral circuit is outside of the array of NAND memory cells.
13. The semiconductor device of claim 1 , wherein the first semiconductor structure comprises:
the first bonding layer above the second bonding layer;
the processor above the first bonding layer;
the array of SRAM cells above the first bonding layer and outside of the processor; and
a semiconductor layer above and in contact with the processor and the array of SRAM cells.
14. The semiconductor device of claim 13 , further comprising a pad-out interconnect layer above the semiconductor layer.
15. A semiconductor device, comprising:
a first semiconductor structure comprising:
a device layer comprising a processor, an array of static random-access memory (SRAM) cells, a word line driver of an array of NAND memory cells, and a page buffer of the array of NAND memory cells;
a first bonding layer comprising a plurality of first bonding contacts; and
an interconnect layer located between the device layer and the first bonding layer, wherein the interconnect layer is configured to transfer electrical signals between the processor and one or more of the array of SRAM cells, the word line driver of the array of NAND memory cells, or the page buffer of the array of NAND memory cells;
a second semiconductor structure comprising the array of NAND memory cells and a second bonding layer comprising a plurality of second bonding contacts; and
a bonding interface between the first bonding layer and the second bonding layer,
wherein the first bonding contacts are in contact with the second bonding contacts at the bonding interface,
wherein the processor the array of SRAM cells are electrically connected to the array of NAND memory cells through the first bonding contacts and the second bonding contacts at the bonding interface, and
wherein the processor and one or more of the array of SRAM cells, the word line driver of the array of NAND memory cells, or the page buffer of the array of NAND memory cells are electrically connected to one another through the interconnect layer.
16. The semiconductor device of claim 15 , wherein the first semiconductor structure includes a peripheral region that comprises the array of SRAM cells, the word line driver of the array of NAND memory cells, and the page buffer of the array of NAND memory cells.