IP Library › Granted Patent US 11,368,172
Granted Patent B2
US 11,368,172 · App. 17/198,426 · Granted Jun 21, 2022

Radio-frequency module and communication device

Inventors: Takayuki Shinozaki (Nagaokakyo, JP); Yukiya Yamaguchi (Nagaokakyo, JP); Morio Takeuchi (Nagaokakyo, JP); Yoichi Sawada (Nagaokakyo, JP)
Assignee: MURATA MANUFACTURING CO., LTD.
H04B1/0053H04B1/44
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Quick Facts
Patent No.
US 11,368,172
App. No.
17/198,426
Granted
Jun 21, 2022
Kind
B2
Abstract

A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides thereof; a transmission power amplifier; a control circuit configured to control the transmission power amplifier; a first transmission filter and a second transmission filter; and a first switch configured to switch connection of an output terminal of the transmission power amplifier between the first transmission filter and the second transmission filter. The control circuit is disposed on the first principal surface, and the first switch is disposed on the second principal surface.

Claims (58)

1. A radio frequency module, comprising:

a module board including a first principal surface and a second principal surface on opposite sides of the module board;

a transmission power amplifier disposed on the module board;

a control circuit configured to control the transmission power amplifier;

a first transmission filter and a second transmission filter;

a first switch configured to switch connection of an output terminal of the transmission power amplifier between the first transmission filter and the second transmission filter; and

one or more external-connection terminals, wherein

the control circuit is disposed on the first principal surface,

the first switch is disposed on the second principal surface,

at least one of the first transmission filter and the second transmission filter are disposed on the second principal surface, and

the one or more external-connection terminals are disposed on the first principal surface.

2. The radio frequency module according to claim 1 , wherein

the first transmission filter and the second transmission filter are disposed on the second principal surface.

3. The radio frequency module according to claim 2 , wherein

the transmission power amplifier is disposed on the second principal surface.

4. The radio frequency module according to claim 3 , wherein

in a plan view of the module board, the control circuit and the first switch at least partially overlap.

5. The radio frequency module according to claim 4 , further comprising:

a reception low-noise amplifier, wherein

the reception low-noise amplifier is disposed on the first principal surface,

in a plan view of the module board, at least one of the one or more external-connection terminals is interposed between the control circuit and the reception low-noise amplifier, and

the at least one of the one or more external-connection terminals being set to a ground potential.

6. The radio frequency module according to claim 3 , further comprising:

a reception low-noise amplifier, wherein

the reception low-noise amplifier is disposed on the first principal surface,

in a plan view of the module board, at least one of the one or more external-connection terminals is interposed between the control circuit and the reception low-noise amplifier, and

the at least one of the one or more external-connection terminals being set to a ground potential.

7. A communication device, comprising:

an antenna;

an RF signal processing circuit configured to process a radio frequency signal which is to be transmitted or has been received by the antenna; and

a radio frequency module configured to transfer the radio frequency signal between the antenna and the RF signal processing circuit, the radio-frequency module including

a module board including a first principal surface and a second principal surface on opposite sides of the module board,

a transmission power amplifier disposed on the module board,

a control circuit configured to control the transmission power amplifier,

a first transmission filter and a second transmission filter, and

a first switch configured to switch connection of an output terminal of the transmission power amplifier between the first transmission filter and the second transmission filter, and

one or more external-connection terminals,

wherein

the control circuit is disposed on the first principal surface,

the first switch is disposed on the second principal surface,

at least one of the first transmission filter and the second transmission filter are disposed on the second principal surface, and

the one or more external-connection terminals are disposed on the first principal surface.

8. The radio frequency module according to claim 7 , wherein

the first transmission filter and the second transmission filter are disposed on the second principal surface.

9. The radio frequency module according to claim 8 , wherein

the transmission power amplifier is disposed on the second principal surface.

10. The communication device according to claim 9 , wherein

in a plan view of the module board, the control circuit and the first switch at least partially overlap.

11. The communication device according to claim 10 , further comprising:

a reception low-noise amplifier, wherein

the reception low-noise amplifier is disposed on the first principal surface,

in a plan view of the module board, at least one of the one or more external-connection terminals is interposed between the control circuit and the reception low-noise amplifier, and

the at least one of the one or more external-connection terminals being set to a ground potential.

12. The communication device according to claim 9 , further comprising:

a reception low-noise amplifier, wherein

the reception low-noise amplifier is disposed on the first principal surface,

in a plan view of the module board, at least one of the one or more external-connection terminals is interposed between the control circuit and the reception low-noise amplifier, and

the at least one of the one or more external-connection terminals being set to a ground potential.

Priority Claims (2)
JP JP2019-171568 · Sep 20, 2019 · national
JP JP2020-057972 · Mar 27, 2020 · national
Continuity (2)
Continuation 17022091 · Sep 16, 2020
Related Publication 20210203366A1 · Jul 1, 2021
Cited By (1)
US 12,191,828