Heat sink, heat sink arrangement and module for liquid immersion cooling

1. A liquid submersion cooled electronic device, comprising:

a device housing defining an interior space and a maximum dielectric cooling liquid level;

heat generating electronic components disposed within the interior space of the device housing;

a dielectric cooling liquid in the interior space,

the dielectric cooling liquid submerging and in direct contact with the heat generating electronic components;

a dielectric cooling liquid inlet in the device housing through which dielectric cooling liquid enters the interior space;

a dielectric cooling liquid outlet weir in the device housing from which dielectric cooling liquid exits the interior space, the dielectric cooling liquid outlet weir is disposed at the maximum dielectric cooling liquid level of the device housing;

a manifold within the interior space, wherein the manifold is fluidly connected to the dielectric cooling inlet; and

a tube extending from the manifold and directing a return flow of the dielectric cooling liquid directly onto one of the heat generating electronic components;

wherein the cooling liquid outlet weir establishes the level of the dielectric cooling liquid within the interior space and establishes a volumetric rate of flow of the dielectric cooling liquid within the interior space that is needed for the cooling of the heat generating electronic components.

2. The liquid submersion cooled electronic device of claim 1 , wherein the device housing includes a first side and a second side opposite the first side; the dielectric cooling liquid inlet is in the first side and the dielectric cooling liquid outlet weir is in the second side.

3. The liquid submersion cooled electronic device of claim 1 , wherein the dielectric cooling liquid outlet weir is located on the device housing at a vertical level that is higher than the location of the dielectric cooling liquid inlet.

4. The liquid submersion cooled electronic device of claim 1 , wherein the heat generating electronic components include at least one of a power supply, a processor, and a switch.

5. A liquid submersion cooled electronic device, comprising:

a non-pressurized device housing defining an interior space, the non-pressurized device housing including a tray with an at least partially open top and a cover removably attached to the tray and disposed over the at least partially open top;

at least one heat generating electronic component disposed within the interior space of the non-pressurized device housing;

a dielectric cooling liquid in the interior space, the dielectric cooling liquid partially or fully submerging and in direct contact with the at least one heat generating electronic component;

a pump having a pump inlet in fluid communication with the interior space and a pump outlet;

a heat exchanger having a heat exchanger inlet in fluid communication with the pump outlet and having a heat exchanger outlet in fluid communication with the interior space;

a liquid distribution manifold within the interior space, the liquid distribution manifold having a manifold inlet in fluid communication with the heat exchanger outlet, and a plurality of manifold outlets;

a tube having an inlet end thereof connected to one of the manifold outlets, and an outlet end thereof adjacent to the at least one heat generating electronic component to direct a return flow of dielectric cooling liquid to the at least one heat generating electronic component;

an open top tray disposed within the interior space, the at least one heat generating electronic component is disposed within the open top tray, the outlet end of the tube is connected to the open top tray to direct the return flow of dielectric cooling liquid into a space defined by the open top tray, and a side wall of the open top tray includes a dielectric cooling liquid outlet weir from which dielectric cooling liquid exits the space defined by the open top tray.

6. The liquid submersion cooled electronic device of claim 5 , wherein the pump is disposed within the interior space and the pump inlet is submerged in the dielectric cooling liquid.

7. The liquid submersion cooled electronic device of claim 5 , wherein the heat exchanger is disposed within the interior space.

8. The liquid submersion cooled electronic device of claim 5 , wherein the at least one heat generating electronic component comprises a plurality of heat generating electronic components within the interior space, and wherein the plurality of heat generating electronic components comprise a plurality of data storage devices, a plurality of power supplies, a plurality of processors, or a plurality of switches.

9. A liquid submersion cooled electronic system, comprising:

a plurality of liquid submersion cooled electronic devices of claim 5 disposed in a vertical array on a rack.