Fluororesin film and laminate, and method for producing hot pressed laminate
The purpose of the present invention is to provide a fluororesin film or fluororesin laminate excellent in heat resistance and excellent in interlayer adhesion to an object to be laminated, such as a prepreg, a method for producing a hot pressed laminate using said film or laminate, and a method for producing a printed circuit board. The fluororesin film contains a fluororesin having a melting point of from 260 to 380° C., and has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 μm 2 of at least one surface thereof in the thickness direction is measured by an atomic force microscope. The laminate 1 has a layer A 10 containing said fluororesin and a layer B 12 made of another substrate, wherein the layer A 10 has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 μm 2 of a second surface 10 b thereof is measured by an atomic force microscope.
1. A laminate comprising:
a layer A comprising an adhesive fluororesin having a melting point of from 260 to 380° C. and having at least one functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group, an amide group, an amino group and an isocyanate group, and
a layer B comprising a metal,
wherein one side of layer A is laminated directly to one side of layer B,
wherein the adhesive fluororesin is a fluorinated polymer having a unit with an adhesive functional group or a terminal group with an adhesive functional group,
wherein the surface of layer A has an arithmetic average roughness Ra of at least 3.0 nm and a maximum height Rz of at least 80.0 nm when a 1 μm 2 area of the surface is measured by an atomic force microscope.
2. The laminate of claim 1 , wherein the adhesive fluororesin comprises a tetrafluoroethylene polymer, of which a melt viscosity at 380° C. is from 1×10 2 to 1×10 6 Pa·s.
3. The laminate of claim 1 , wherein a composition ratio of oxygen atoms at the surface to a total of carbon atoms, fluorine atoms and oxygen atoms at the surface is at least 1%.
4. The laminate of claim 1 , wherein a composition ratio of fluorine atoms at the surface to a total of carbon atoms, fluorine atoms and oxygen atoms at the surface is at least 25% and at most 65%.
5. The laminate of claim 1 , wherein the metal of layer B is a layer of copper foil, and a maximum height Rz of surface roughness measured based on JIS C6515: 1998 (IEC61249-5-1: 1995) of the copper foil, is at least 1 nm and at most 2.5 μm.
6. The laminate of claim 1 , wherein a peel strength at an interface between the directly laminated layers A and B is at least 5 N/10 mm, and wherein a dielectric constant (20 GHz) is less than 3.6.
7. The laminate of claim 6 , wherein a composition ratio of oxygen atoms at the surface in contact with the layer B of the layer A to a total of carbon atoms, fluorine atoms and oxygen atoms at the surface in contact with the layer B of the layer A is at least 1%, and
a composition ratio of fluorine atoms at the surface in contact with the layer B of the layer A to the total of carbon atoms, fluorine atoms and oxygen atoms is at least 25% and at most 65%.
8. The laminate of claim 1 , wherein the arithmetic average roughness Ra is at least 12 nm.
9. The laminate of claim 1 , wherein the arithmetic average roughness Ra is at least 12.1 nm and at most 16 nm.
10. The laminate of claim 1 , wherein the maximum height Rz is at least 119 nm and at most 210 nm.
11. The laminate of claim 1 , wherein the arithmetic average roughness Ra is at least 12.1 nm and at most 16 nm, and
the maximum height Rz is at least 119 nm and at most 210 nm.
12. The laminate of claim 1 , wherein the adhesive fluororesin has a melting point of from 260 to 320° C.
13. A method for producing a hot pressed laminate using the laminate of claim 1 , the method comprising laminating by hot pressing an object to be laminated, to the surface of the laminate.
14. The method of claim 13 , wherein the hot pressing is conducted at a temperature of at most the melting point of the adhesive fluororesin.
15. A method for producing a hot pressed laminate using the laminate of claim 1 comprising:
surface-treating a fluororesin film of the laminate, wherein the fluororesin film containing a fluororesin having a melting point of from 260° C. to 380° C. to obtain a fluororesin film, of which the wetting tension of at least one surface in the thickness direction is at least 30 mN/m, and
laminating an object to be laminated, on said surface with a wetting tension of at least 30 mN/m of the obtained fluororesin film by hot pressing at a temperature of at most the melting point of the fluororesin.