Slip-plane MEMs probe for high-density and fine pitch interconnects
A device probe includes a primary probe arm and a subsequent probe arm with a slip plane spacing between the primary probe arm and subsequent probe arm. Each probe arm is integrally part of a probe base that is attachable to a probe card. During probe use on a semiconductive device or a semiconductor device package substrate, overtravel of the probe tip allows the primary and subsequent probe arms to deflect, while sufficient resistance to deflection creates a useful contact with an electrical structure such as an electrical bump or a bond pad.
1. An electrical test prober, comprising:
a probe card; and
a probe, wherein the probe comprises:
a probe base comprising a first end affixed to the probe card;
a first arm cantilevered from a first portion of the probe base proximal to a second end of the probe base, opposite the first end;
a probe tip at a free end of the first arm, the probe tip to contact a device under test (DUT); and
a second arm cantilevered from a second portion of the probe base, wherein the second arm is between the first portion of the base and the first end.
2. The prober of claim 1 , wherein the second arm lacks a probe tip to contact the DUT.
3. The prober of claim 1 , wherein the first arm has a first Z-thickness in a Z-dimension normal to a plane of the probe card, and the second arm has a second Z-thickness in the Z-dimension that is different from the first Z-thickness.
4. The prober of claim 3 , wherein first arm has a first ductility, and the second arm has a second ductility, different from the first ductility.
5. The prober of claim 1 , further comprising a third probe arm cantilevered from a third portion of the probe base and spaced apart from both the first arm and the second arm.
6. The prober of claim 1 , wherein, in response to an overtravel of the probe relative to the DUT, the first arm is to undergo a deflection in a Z-dimension, and wherein upon a magnitude of the deflection exceeding a spacing between the first arm and the second arm, the first arm is to make physical contact with the second arm.
7. The prober of claim 6 , wherein the overtravel at the probe tip is 0.15-16 μm induces a 1 gram force at the probe tip.
8. The prober of claim 6 , wherein upon the physical contact the second arm is to physically reinforce the first arm against further deflection in the Z-dimension.
9. The prober of claim 1 , wherein the first arm extends at an obtuse angle from a sidewall of the probe base.
10. The prober of claim 1 , wherein the probe is one of a plurality of probes attached to the probe card to contact a plurality of locations on the DUT having a pitch of no more than 51 μm.
11. The prober of claim 10 , wherein the probe is one of a plurality of probes attached to the probe card to contact a plurality of locations on the DUT having a pitch of no more than 36 μm.
12. An electrical test probe, comprising:
a probe base comprising a first end to be affixed to a surface of a probe card;
a first arm cantilevered from a first portion of the probe base proximal to a second end of the probe base, opposite the first end;
a probe tip at a free end of the first arm, the probe tip to contact a device under test (DUT); and
a second arm cantilevered from a second portion of the probe base, wherein the second arm is between the first portion of the base and the first end.
13. The probe of claim 12 , wherein first arm has a first ductility, and the second arm has a second ductility, different from the first ductility.
14. The probe of claim 12 , wherein, in response to an overtravel of the probe relative to the DUT, the first arm is to undergo a deflection, and wherein upon a magnitude of the deflection exceeding a spacing between the first arm and the second arm, the first arm is to make physical contact with the second arm.
15. The probe of claim 12 , wherein the first arm extends at an obtuse angle from a sidewall of the probe base.
16. A system comprising:
a probe card; and
the probe of claim 12 , wherein the probe base is affixed to the probe card.
17. The system of claim 16 , wherein the first arm has a first Z-thickness in a Z-dimension normal to a plane of the probe card, and the second arm has a second Z-thickness in the Z-dimension that is different from the first Z-thickness.
18. The system of claim 16 , wherein the first arm and the second arm are metallurgically integral with the probe base.
19. The system of claim 16 , wherein the probe is one of a plurality of probes attached to the probe card to contact a plurality of locations on the DUT having a pitch of no more than 51 μm.
20. The prober of claim 19 , wherein the probe is one of a plurality of probes attached to the probe card to contact a plurality of locations on the DUT having a pitch of no more than 36 μm.