IP Library › Granted Patent US 11,372,330
Granted Patent B2
US 11,372,330 · App. 11/992,595 · Granted Jun 28, 2022

Anti-reflective coating forming composition containing reaction product of isocyanuric acid compound with benzoic acid compound

Inventors: Takahiro Kishioka (Toyama, JP); Rikimaru Sakamoto (Toyama, JP); Daisuke Maruyama (Toyama, JP)
Assignee: NISSAN CHEMICAL INDUSTRIES, LTD.
G03F7/091
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Quick Facts
Patent No.
US 11,372,330
App. No.
11/992,595
Granted
Jun 28, 2022
Kind
B2
Abstract

There is provided anti-reflective coating forming composition containing a reaction product of an isocyanuric acid compound having two or three 2,3-epoxypropyl groups with a benzoic acid compound. The anti-reflective coating obtained from the composition has a high preventive effect for reflected light, causes no intermixing with photoresists, can form a photoresist pattern having no footing at the lower part, and can use in lithography process by use of a light such as ArF excimer laser beam and F2 excimer laser beam, etc.

Claims (42)

1. A method for forming a photoresist pattern having no footing at the lower part of the photoresist for use in manufacturing semiconductor devices, comprising:

coating an anti-reflective coating forming composition on a semiconductor substrate, and baking it to form an anti-reflective coating;

forming a photoresist layer on the anti-reflective coating;

exposing the semiconductor substrate covered with the anti-reflective coating and the photoresist layer to light; and

developing the photoresist layer after the exposure to light to form a photoresist pattern having no footing at the lower part; wherein

the anti-reflective coating forming composition comprises: a reaction product, an oligomer of the reaction product, a crosslinking compound, a solvent, and an acid compound, wherein

the reaction product is a mixture of:

a compound having a structure obtained by a reaction of an epoxy group of a compound of formula (1)

 where R 1 is 2,3-epoxypropyl, with a carboxy group of a hydroxy benzoic acid compound; and

a compound having a structure obtained by a reaction of one epoxy group of the compound of formula (1) with a hydroxy group and another epoxy group of formula (1) with a carboxy group of the hydroxy benzoic acid compound,

the oligomer of the reaction product is obtained by a reaction of an epoxypropyl group of the compound of formula (1) with a carboxy group of the hydroxy benzoic acid compound and by a reaction of an epoxypropyl group of another compound of formula (1) with a hydroxy group of the hydroxy benzoic acid compound,

the acid compound comprises pyridinium-p-toluene sulfonate,

the reaction product is obtained by reacting the compound of formula (1) with the hydroxy benzoic acid compound in a molar ratio of 1:2 to 1:3 (the compound of formula (1): the hydroxy benzoic acid compound),

the crosslinking compound comprises tetramethoxymethyl glycoluril,

the content of the photoacid generator is 0.1 to 5 mass % of the solid content of the anti-reflective coating forming composition,

the content of the acid compound is 0.1 to 5 mass % of the solid content of the anti-reflective coating forming composition,

wherein the solid content of the anti-reflective coating forming composition is with respect to the mass of the anti-reflective coating forming composition excluding the solvent, and

the anti-reflective coating has

a thickness of 0.01 to 3.0 μm,

a refractive index (n) at a wavelength of 193 nm of around 1.81, and

an attenuation coefficient (k) of around 0.44.

2. A method for forming a photoresist pattern having no footing at the lower part of the photoresist for use in manufacturing semiconductor devices, comprising:

coating an anti-reflective coating forming composition on a semiconductor substrate, and baking it to form an anti-reflective coating;

forming a photoresist layer on the anti-reflective coating;

exposing the semiconductor substrate covered with the anti-reflective coating and the photoresist layer to irradiation light of F2 excimer laser beam (wavelength 157 nm); and

developing the photoresist layer after the exposure to light to form a photoresist pattern having no footing at the lower part; wherein

the anti-reflective coating forming composition comprises: a reaction product, an oligomer of the reaction product, a crosslinking compound, a solvent, and an acid compound, wherein

the reaction product is a mixture of:

a compound having a structure obtained by a reaction of an epoxy group of a compound of formula (1)

 where R 1 is 2,3-epoxypropyl, with a carboxy group of a hydroxy benzoic acid compound; and

a compound having a structure obtained by a reaction of one epoxy group of the compound of formula (1) with a hydroxy group and another epoxy group of formula (1) with a carboxy group of the hydroxy benzoic acid compound,

the oligomer of the reaction product is obtained by a reaction of an epoxypropyl group of the compound of formula (1) with a carboxy group of the hydroxy benzoic acid compound and by a reaction of an epoxypropyl group of another compound of formula (1) with a hydroxy group of the hydroxy benzoic acid compound,

the acid compound comprises pyridinium-p-toluene sulfonate,

the reaction product is obtained by reacting the compound of formula (1) with the hydroxy benzoic acid compound in a molar ratio of 1:2 to 1:3 (the compound of formula (1): the hydroxy benzoic acid compound),

the crosslinking compound comprises tetramethoxymethyl glycoluril,

the content of the photoacid generator is 0.1 to 5 mass % of the solid content of the anti-reflective coating forming composition,

the content of the acid compound is 0.1 to 5 mass % of the solid content of the anti-reflective coating forming composition

wherein the solid content of the anti-reflective coating forming composition is with respect to the mass of the anti-reflective coating forming composition excluding the solvent, and

the anti-reflective coating has

a thickness of 0.01 to 3.0 μm,

a refractive index (n) at a wavelength of 193 nm of around 1.81, and

an attenuation coefficient (k) of around 0.44.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 26, 2008
From: KISHIOKA, TAKAHIRO; SAKAMOTO, RIKIMARU; MARUYAMA, DAISUKE
To: NISSAN CHEMICAL INDUSTRIES, LTD.
Reel/Frame 020754/0854 →
Continuity (1)
Related Publication 20090117493A1 · May 7, 2009