Method of manufacturing display device and source substrate structure
Provided are a method of manufacturing a display device and a source substrate structure. The method of manufacturing the display device includes holding a light-emitting element on a source substrate that passes laser light of a certain wavelength therethrough, the holding being performed by a release layer between the source substrate and the light-emitting element, forming an adhesive layer on a driving substrate on which a driving substrate-side electrode is formed, moving the light-emitting element to a surface of the adhesive layer on the driving substrate from the source substrate by irradiating laser light of the certain wavelength to the release layer through the source substrate, and adhering the moved light-emitting element to the driving substrate by using the adhesive layer, and the release layer comprises a resin material with a thickness that is greater than or equal to 0.1 μm and is less than or equal to 0.5 μm.
1. A source substrate structure comprising:
a source substrate through which laser light of a certain wavelength passes;
a light-emitting element; and
a release layer interposed between the source substrate and the light-emitting element, the light-emitting element being held on the source substrate by the release layer,
wherein the release layer comprises:
a first release layer formed on and directly adhered to the source substrate and comprising a first resin material, and
a second release layer formed on and directly adhered to the first release layer and comprising a second resin material different from the first resin material,
wherein a thickness of the first release layer is greater than a thickness of the second release layer,
wherein the thickness of the first release layer is in a range of 1 μm to 5 μm, and the thickness of the second release layer is in a range of 0.1 μm to 0.5 μm,
wherein when an absorption rate of the first release layer formed on and directly adhered to the source substrate with respect to the certain wavelength is Wa1 and an absorption rate of the second release layer formed on and directly adhered to the first release layer with respect to the certain wavelength is Wa2, Wa1<Wa2, and
wherein the absorption rate of the first release layer with respect to the certain wavelength is greater than or equal to 1% and less than or equal to 50%, and the absorption rate of the second release layer with respect to the certain wavelength is greater than or equal to 60% and less than or equal to 100%.
2. The source substrate structure of claim 1 , wherein the second resin material comprises any one selected from a group consisting of polyimide resin, acryl resin, epoxy resin, polypropylene resin, polycarbonate resin, and acrylonitrile butadiene styrene (ABS) resin.
3. The source substrate structure of claim 1 , wherein the first resin material comprises polydimethylsiloxane (PDMS) resin, and
the second resin material comprises any one selected from a group consisting of polyimide resin, acryl resin, epoxy resin, polypropylene resin, polycarbonate resin, and acrylonitrile butadiene styrene (ABS) resin.