Additive manufactured multi-layer thermally conductive parts

1. A thermal management device comprising:

a single contiguous component comprising:

a first portion made of a first thermally conductive plastic; and

a second portion extending away from the first portion, the second portion being made of a second thermally conductive plastic, the second thermally conductive plastic being different than the first thermally conductive plastic,

wherein the second portion has a greater hardness than the first portion,

wherein the thermal management device is a battery housing, and

wherein the first portion is a cylindrical interface configured to abut a battery supported by the battery housing, and

wherein the second portion surrounds the first portion.

2. The thermal management device of claim 1 , wherein the first thermally conductive plastic is electrically insulating, and the second thermally conductive plastic is electrically non-insulating.

3. The thermal management device of claim 1 , wherein the first thermally conductive plastic includes a first polymer matrix, and the second thermally conductive plastic includes a second polymer matrix, the first polymer matrix and the second polymer matrix including a thermoplastic elastomer having different polymer chain lengths.

4. The thermal management device of claim 1 , wherein the first thermally conductive plastic includes a first thermoplastic polymer and first filler particles, and the second thermally conductive plastic includes the first thermoplastic polymer and second filler particles, the second filler particles being different than the first filler particles.

5. The thermal management device of claim 1 , wherein the first thermally conductive plastic includes a first thermoplastic polymer and a first weight percentage of first filler particles, and the second thermally conductive plastic includes the first thermoplastic polymer and a second weight percentage of second filler particles, the second weight percentage being different than the first weight percentage.

6. The thermal management device of claim 1 , wherein the first thermally conductive plastic includes a first thermoplastic polymer, and the second thermally conductive plastic includes a second thermoplastic polymer, the second thermoplastic polymer being different than the first thermoplastic polymer,

wherein the first thermoplastic polymer of the first thermally conductive plastic is adhered to the second thermoplastic polymer of the second thermally conductive plastic,

wherein the first thermally conductive plastic includes first fillers, and the second thermally conductive plastic includes the first fillers at a different weight percentage than the first thermally conductive plastic, or includes second fillers, the second fillers being different than the first fillers, and

wherein one or more electrical properties, one or more thermal properties, one or more mechanical properties, or any combination thereof of the first thermally conductive plastic is different than one or more electrical properties, one or more thermal properties, one or more mechanical properties, or any combination thereof of the second thermally conductive plastic.

7. The thermal management device of claim 1 , wherein the first portion has a hardness of less than 95 A, and the second portion has a hardness of greater than 95 A.

8. The thermal management device of claim 1 , wherein the second portion includes channels through which liquid is flowable.

9. The thermal management device of claim 1 , wherein the thermal management device is a cold plate,

wherein the first portion is an interface attachable to a heat source of an electronic device, and

wherein the second portion includes channels extending through the second portion.

10. An electronic device comprising:

a heat generating component; and

a heat sink that is a single contiguous component, the single contiguous component comprising:

a first portion made of a first thermally conductive plastic, the first portion abutting the heat generating component; and

a second portion made of a second thermally conductive plastic and including fins extending away from the first portion, the second thermally conductive plastic being different than the first thermally conductive plastic,

wherein the first thermally conductive plastic includes a first thermoplastic polymer, and the second thermally conductive plastic includes a second thermoplastic polymer, the second thermoplastic polymer being different than the first thermoplastic polymer,

wherein the first thermoplastic polymer of the first thermally conductive plastic is adhered to the second thermoplastic polymer of the second thermally conductive plastic,

wherein the first thermally conductive plastic includes first fillers, and the second thermally conductive plastic includes the first fillers at a different weight percentage than the first thermally conductive plastic, or includes second fillers, the second fillers being different than the first fillers, and

wherein one or more electrical properties, one or more thermal properties, one or more mechanical properties, or any combination thereof of the first thermally conductive plastic is different than one or more electrical properties, one or more thermal properties, one or more mechanical properties, or any combination thereof of the second thermally conductive plastic.

11. The electronic device of claim 10 , further comprising a circuit board supporting the heat generating component,

wherein the first portion surrounds the heat generating component, such that the first portion also abuts the circuit board.

12. The electronic device of claim 10 , wherein the heat generating component is a first heat generating component,

wherein the electronic device further comprises:

a second heat generating component; and

a circuit board that supports the first heat generating component and the second heat generating component,

wherein the single contiguous component further comprises a third portion, the third portion being made of the first thermally conductive plastic and abutting the second heat generating component,

wherein the first portion and the third portion extend away from a surface of the second portion, the first heat generating component extending a greater distance away from the circuit board than the second heat generating component, such that the third portion extends a greater distance away from the surface of the second portion than the first portion extends away from the surface of the second portion.

13. The electronic device of claim 10 , further comprising a third portion covering at least part of the second portion, the third portion being made of a third thermally conductive plastic, the third thermally conductive plastic being different than the second thermally conductive plastic.

14. The electronic device of claim 13 , wherein the second thermally conductive plastic has a higher absorptivity than the third thermally conductive plastic in the solar spectrum.

15. The electronic device of claim 13 , wherein the third thermally conductive plastic has a higher emissivity than the second thermally conductive plastic in the infrared spectrum.

16. The electronic device of claim 10 , wherein the first portion has a hardness of less than 95 A, and the second portion has a hardness of greater than 95 A.