IP Library › Granted Patent US 11,376,628
Granted Patent B2
US 11,376,628 · App. 16/534,012 · Granted Jul 5, 2022

Capacitive device and piezoelectric device

Inventors: Taiichi Takezaki (Tokyo, JP); Hiroaki Hasegawa (Tokyo, JP); Shuntaro Machida (Tokyo, JP)
Assignee: Hitachi, Ltd.
B06B1/0292A61B8/4494B06B1/067G01N29/245G01N29/2406A61B8/4483
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Quick Facts
Patent No.
US 11,376,628
App. No.
16/534,012
Granted
Jul 5, 2022
Kind
B2
Abstract

A capacitive device includes a unit cell including a CMUT, and a transmission/reception plate for impedance matching which is provided above the unit cell via a connection portion, in which a membrane of the CMUT constituting the unit cell is connected to the transmission/reception plate via the connection portion having an area smaller than that of the transmission/reception plate. The area of the transmission/reception plate is desirably larger than the area of a hollow portion of the CMUT.

Claims (18)

1. A capacitive device comprising:

an ultrasonic transducer comprising:

a substrate,

a lower electrode formed above the substrate,

a hollow portion provided above a first insulating film and below a second insulating film sequentially formed above the lower electrode,

an upper electrode formed above the hollow portion,

a third insulating film formed above the upper electrode, and

a membrane constituted by the second insulating film and the third insulating film above the hollow portion;

a connection portion formed on the membrane and having a first area; and

a transmission/reception plate formed above the ultrasonic transducer via the connection portion and having a second area larger than the first area, wherein

the second area of the transmission/reception plate is larger than an area of the hollow portion,

the transmission/reception plate is fixed to the ultrasonic transducer via a fixed portion,

the transmission/reception plate has a planar spiral shape, and

the hollow portion, the membrane, and the connection portion are arranged at a position closer to the fixing portion than a center portion of the transmission/reception plate.

2. The capacitive device according to claim 1 , wherein

a plurality of the ultrasonic transducer arranged in an array is connected to the transmission/reception plate formed above the plurality of the ultrasonic transducer, via a plurality of the connection portion each having an area smaller than an area of the transmission/reception plate.

3. The capacitive device according to claim 1 , wherein

each of the plurality of the ultrasonic transducer arranged in an array is connected to the transmission/reception plate formed above each of the plurality of the ultrasonic transducer, via the connection portion having an area smaller than an area of the transmission/reception plate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 7, 2019
From: TAKEZAKI, TAIICHI; HASEGAWA, HIROAKI; MACHIDA, SHUNTARO
To: HITACHI, LTD.
Reel/Frame 049989/0192 →
Priority Claims (1)
JP JP2018-165730 · Sep 5, 2018 · national
Continuity (1)
Related Publication 20200070205A1 · Mar 5, 2020