Methods of forming microelectronic devices

1. A method of forming a microelectronic device, the method comprising:

forming a source material around substantially an entire periphery of a base material; and

removing the source material from lateral sides of the base material while maintaining the source material over an upper surface and a lower surface of the base material.

2. The method of claim 1 , further comprising forming an etch stop material over the base material prior to forming the source material around substantially the entire periphery of the base material.

3. The method of claim 2 , further comprising:

selecting the base material to comprise a semiconductive material; and

selecting the etch stop material to comprise a dielectric material.

4. The method of claim 2 , further comprising:

selecting the base material to comprise a silicon material; and

selecting the etch stop material to comprise silicon dioxide.

5. The method of claim 1 , further comprising forming a protective material on lateral sides of remaining portions of source material after removing the source material from the lateral sides of the base material.

6. The method of claim 1 , further comprising selecting the base material to comprise one or more of monocrystalline silicon, polycrystalline silicon, silicon-germanium, germanium, gallium arsenide, a gallium nitride, gallium phosphide, indium phosphide, indium gallium nitride, and aluminum gallium nitride.

7. The method of claim 1 , further comprising selecting the source material to comprise doped polysilicon.

8. The method of claim 1 , further comprising selecting the base material to comprise a ceramic material.

9. The method of claim 8 , wherein selecting the base material to comprise a ceramic material comprises selecting the base material to comprise silicon on poly-aluminum nitride.

10. The method of claim 1 , further comprising selecting the base material to comprise a glass material.

11. The method of claim 10 , wherein selecting the base material to comprise a glass material comprises selecting the base material to comprise one or more of borosilicate glass, phosphosilicate glass, fluorosilicate glass, borophosphosilicate glass, aluminosilicate glass, an alkaline earth boro-aluminosilicate glass, quartz, titania silicate glass, and soda-lime glass.

12. The method of claim 1 , further comprising:

forming a stack structure comprising a vertically alternating series of conductive structures and insulative structures over the source material;

forming vertically extending strings of memory cells within the stack structure to form a first microelectronic device structure;

attaching the first microelectronic device structure to a second microelectronic device structure comprising control logic circuitry to form a microelectronic device structure assembly;

removing the base material after forming the microelectronic device structure assembly; and

forming circuitry in electrical communication with the source material after removing the base material.

13. The method of claim 12 , wherein removing the base material comprises one or more of grinding and wet etching the base material.

14. A method of forming a microelectronic device, the method comprising:

forming a doped semiconductive material over a base material;

forming an insulative material over the doped semiconductive material;

forming openings in the insulative material and exposing the doped semiconductive material through the openings; and

epitaxially growing additional semiconductive material from the doped semiconductive material to fill the openings and cover the insulative material.

15. The method of claim 14 , wherein forming a doped semiconductive material over a base material comprises forming the doped semiconductive material to comprise a semiconductive material of the base material doped and one or more dopants dispersed within the semiconductive material.

16. The method of claim 14 , further comprising:

forming a stack structure comprising vertically alternating series of conductive structures and insulative structures over the additional semiconductive material;

forming vertically extending strings of memory cells within the stack structure to form a first microelectronic device structure;

coupling the first microelectronic device structure to a second microelectronic device structure comprising control logic circuitry to form a microelectronic device structure assembly; and

removing the base material after forming the microelectronic device structure assembly.

17. The method of claim 16 , wherein removing the base material comprises removing the base material without substantially removing the doped semiconductive material.

18. The method of claim 16 , wherein removing the base material comprises forming trenches in the base material along a { 100 } plane or a { 110 } plane of the base material.

19. The method of claim 16 , further comprising forming a source structure over the additional semiconductive material after removing the base material.

20. The method of claim 16 , further comprising forming a protecting material in a region between bevels of the first microelectronic device structure and the second microelectronic device structure.